公开(公告)号：WO2019056011A1

公开(公告)日：2019-03-21

申请号：PCT/US2018/051583

申请日：2018-09-18

Applicant: US SYNTHETIC CORPORATION

Inventor： HEATON, Daren Nathaniel ,  LYNN, Jeremy Brett

IPC: B32B18/00 ,  C04B35/528 ,  C04B35/645 ,  C04B37/00 ,  C04B41/00 ,  C22C26/00

CPC classification number: E21B10/55 ,  B22F7/062 ,  B22F7/08 ,  B24D3/10 ,  B24D3/348 ,  B24D18/0009 ,  B32B18/00 ,  C04B35/528 ,  C04B35/645 ,  C04B37/001 ,  C04B41/00 ,  C04B2235/3813 ,  C04B2235/3821 ,  C04B2235/404 ,  C04B2235/405 ,  C04B2235/407 ,  C04B2235/427 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/582 ,  C22C26/00 ,  C22C2026/005 ,  C22C2026/006 ,  C22C2026/008 ,  E21B10/52 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735

Abstract: Polycrystalline diamond includes a working surface and a peripheral surface extending around an outer periphery of the working surface. The polycrystalline diamond includes a first volume including an interstitial material and a second volume having a leached region that includes boron and titanium. A method of fabricating a polycrystalline diamond element includes positioning a first volume of diamond particles adjacent to a substrate, the first volume of diamond particles including a material that includes a group 13 element, and positioning a second volume of diamond particles adjacent to the first volume of diamond particles such that the first volume of diamond particles is disposed between the second volume of diamond particles and the substrate, the second volume of diamond particles having a lower concentration of material including the group 13 element than the first volume of diamond particles. Various other articles, assemblies, and methods are also disclosed.

公开(公告)号：WO2017114677A1

公开(公告)日：2017-07-06

申请号：PCT/EP2016/081675

申请日：2016-12-19

Applicant: ELEMENT SIX (UK) LIMITED

Inventor： KANYANTA, Valentine ,  MIRANDA-FERNANDEZ, Miriam ,  ZUNEGA, Jonee Christine Paredes ,  ZHANG, Xiaoxue ,  OZBAYRAKTAR, Mehmet Serdar

IPC: B22F3/11 ,  C04B35/52 ,  C04B35/528 ,  C04B35/532 ,  C04B35/56 ,  C04B35/58 ,  C04B38/00 ,  C22C1/08 ,  C22C26/00 ,  C22C29/00 ,  B24D3/10 ,  B24D3/18 ,  B24D3/26 ,  B24D3/32 ,  B22F5/00

CPC classification number: B22F3/11 ,  B22F2005/001 ,  B24D3/10 ,  B24D3/18 ,  B24D3/26 ,  B24D3/32 ,  B32B18/00 ,  C04B35/528 ,  C04B35/645 ,  C04B2235/3217 ,  C04B2235/427 ,  C04B2235/5436 ,  C04B2235/80 ,  C04B2237/363 ,  C04B2237/401 ,  C22C1/08 ,  C22C26/00 ,  C22C29/06

Abstract: A superhard polycrystalline construction comprises a body of polycrystalline superhard material comprising a structure comprising superhard material, the structure having porosity greater than 20% by volume and up to around 80% by volume. A method of forming such a superhard polycrystalline construction comprises forming a skeleton structure of a first material having a plurality of voids, at least partially filling some or all of the voids with a second material to form a pre-sinter assembly, and treating the pre-sinter assembly to sinter together grains of superhard material to form a body of polycrystalline superhard material comprising a first region of superhard grains, and an interpenetrating second region; the second region being formed of the other of the first or second material that does not comprise the superhard grains; the superhard grains forming a sintered structure having a porosity greater than 20% by volume and up to around 80% by volume.

Abstract translation: 超硬多晶结构包括具有包含超硬材料的结构的多晶超硬材料主体，所述结构具有大于20体积％的孔隙率和高达大约80体积％的孔隙率。 形成这种超硬多晶结构的方法包括形成具有多个空隙的第一材料的骨架结构，用第二材料至少部分地填充一些或全部空隙以形成预烧结组件， 用于将超硬材料颗粒烧结在一起以形成包含第一超硬晶粒区域和互穿第二区域的多晶超硬材料主体; 第二区域由不包含超硬晶粒的第一或第二材料中的另一个形成; 该超硬晶粒形成孔隙率大于20体积％且高达大约80体积％的烧结结构。

公开(公告)号：WO2016164498A1

公开(公告)日：2016-10-13

申请号：PCT/US2016/026272

申请日：2016-04-06

Applicant: M CUBED TECHNOLOGIES, INC.

Inventor： GRATRIX, Edward ,  KARANDIKAR, Prashant ,  MASTROBATTISTO, Daniel ,  VANCE, William

IPC: B24D3/00 ,  B24B53/00 ,  C04B35/573 ,  C30B29/04 ,  H01L21/67 ,  H01L21/683

CPC classification number: B24D3/10 ,  B24B53/047 ,  C04B35/573 ,  C04B35/80 ,  C04B2235/427 ,  C04B2235/428 ,  C04B2235/5436 ,  C30B29/04 ,  H01L21/68757

Abstract: Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height "standing proud" above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.

Abstract translation: 含有金刚石的物品，例如形状为一些特定物品的复合材料，可以被设计成使得接触物品的物体仅接触钻石。 在一个实施例中，制品可以是用于处理诸如真空或静电卡盘的半导体晶片的设备的形式。 在一个实施方案中，含金刚石的制品可以是金刚石颗粒增强Si / SiC体的复合物，例如反应结合的SiC。 使用逐渐更细的金刚石砂粒研磨金刚石增强的RBSC体，去除了一些SiC / Si基体材料，使成形制品表面其余部分均匀高度的金刚石颗粒“站立起来”。 此外，如果含有金刚石的制品具有足够的导电性，则可以使用放电加工机械加工。

公开(公告)号：WO2016049435A1

公开(公告)日：2016-03-31

申请号：PCT/US2015/052186

申请日：2015-09-25

Applicant: DIAMOND INNOVATIONS, INC.

Inventor： ZHANG, Kai ,  SURYAVANSHI, Abhijit ,  HIRSCH, Alexander ,  ZHANG, Hui

IPC: C04B35/52 ,  C04B35/528 ,  C22C26/00

CPC classification number: B24D18/0009 ,  B22F3/1035 ,  B22F3/14 ,  B22F7/06 ,  B22F7/08 ,  B22F2005/001 ,  B22F2999/00 ,  B24D3/06 ,  B24D3/10 ,  C04B35/528 ,  C04B35/645 ,  C04B37/021 ,  C04B2235/425 ,  C04B2235/604 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/385 ,  C04B2237/401 ,  C04B2237/704 ,  C22C26/00 ,  C22C29/08 ,  C22C2026/006 ,  E21B10/55 ,  E21B10/5735 ,  E21B2010/545

Abstract: A compact, a superabrasive compact and a method of making the compact and superabrasive compact are disclosed. A compact may comprise a plurality of carbide particles, a binder, and a species. The binder may be dispersed among the plurality of tungsten carbide particles. The species may be dispersed in the compact, wherein the binder has a melting point from about 600 C to about 1350 C at ambient pressure. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a binder. The melting point of the binder is from about 600 C to about 1350 C at high pressure from about 30 kbar to about 100 kbar.

Abstract translation: 公开了一种紧凑型超磨料型紧凑件和制造紧凑型和超级磨料型紧凑件的方法。 压块可以包括多个碳化物颗粒，粘合剂和物质。 粘合剂可以分散在多个碳化钨颗粒中。 物质可以分散在压块中，其中粘合剂在环境压力下具有约600℃至约1350℃的熔点。 超级磨料压块可以包括金刚石台和基底。 钻石台可以附着在基片上。 基材可以具有粘合剂。 粘合剂的熔点在约30kbar至约100kbar的高压下为约600℃至约1350℃。

公开(公告)号：WO2013064435A1

公开(公告)日：2013-05-10

申请号：PCT/EP2012/071295

申请日：2012-10-26

Applicant: ELEMENT SIX ABRASIVES S.A. ,  ELEMENT SIX LIMITED

Inventor： CAN, Nedret ,  FISH, Michael, Lester

IPC: C04B35/52 ,  C22C26/00

CPC classification number: B24D3/10 ,  C04B35/52 ,  C04B35/5831 ,  C04B35/645 ,  C04B2235/3826 ,  C04B2235/427 ,  C04B2235/5436 ,  C04B2235/661 ,  C04B2235/85 ,  C22C26/00 ,  E21B10/36 ,  E21B10/5735

Abstract: A polycrystalline diamond construction comprises diamond grains exhibiting inter-granular bonding and defining a plurality of interstitial regions, and a non-diamond phase at least partially filling a plurality of the interstitial regions to form non-diamond pools. The percentage of non-diamond phase in the total area of a cross-section of the body of polycrystalline diamond material is between around 0 to 5 %, and the average nearest neighbour distance between grains of the non-diamond phase is less than around 1.3 microns in an analysed image of a cross-section through the body of polycrystalline material when analysed using an image analysis technique at a magnification of around 1000 and an image area of 1280 by 960 pixels; or is between around 5 to 10 %, and the average nearest neighbour distance between grains of the non-diamond phase is less than around 1.04 microns, or is between around 10 to 15 %, and the average nearest neighbour distance between grains of the non-diamond phase is less than around 1.04 microns, or is between around 15 to 30%, and the average nearest neighbour distance between grains of the non-diamond phase is less than around 0.8 microns.

Abstract translation: 多晶金刚石结构包括呈现颗粒间结合并限定多个间隙区域的金刚石晶粒和至少部分填充多个间隙区域以形成非金刚石池的非金刚石相。 非金刚石相在多晶金刚石材料主体截面总面积中的百分比在0至5％之间，非金刚石相晶粒之间的平均最近相邻距离小于约1.3 当使用图像分析技术以大约1000的放大倍率和1280×960像素的图像区域分析时，通过多晶材料体的横截面的分析图像中的微米; 或在约5至10％之间，并且非金刚石相的晶粒之间的平均最近相邻距离小于约1.04微米，或者在约10至15％之间，并且非金刚石晶粒之间的平均最近邻距离 - 金刚石相小于约1.04微米，或者在约15至30％之间，并且非金刚石相的晶粒之间的平均最近相邻距离小于约0.8微米。

公开(公告)号：WO2013012919A1

公开(公告)日：2013-01-24

申请号：PCT/US2012/047191

申请日：2012-07-18

Applicant: US SYNTHETIC CORPORATION ,  QIAN, Jiang ,  MCMURRAY, Eugene, C. ,  MUKHOPADHYAY, Debkumar ,  WIGGINS, Jason, K. ,  VAIL, Michael, A. ,  BERTAGNOLLI, Kenneth, E.

Inventor： QIAN, Jiang ,  MCMURRAY, Eugene, C. ,  MUKHOPADHYAY, Debkumar ,  WIGGINS, Jason, K. ,  VAIL, Michael, A. ,  BERTAGNOLLI, Kenneth, E.

IPC: B22F7/06 ,  C22C26/00 ,  E21B10/567 ,  B23B27/00

CPC classification number: B24D3/10 ,  B22F7/062 ,  B22F2005/001 ,  B24D18/0009 ,  C22C26/00 ,  E21B10/54 ,  E21B10/56 ,  E21B10/567 ,  F16C33/043 ,  F16C33/108 ,  F16C2352/00 ,  Y10T408/89

Abstract: In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table bonded to the substrate. The table includes bonded diamond grains defining interstitial regions. The table includes an upper surface, a back surface bonded to the substrate, and at least one lateral surface extending therebetween. The table includes a first region extending inwardly from the upper surface and the lateral surface. The first region exhibits a first interstitial region concentration and includes at least one interstitial constituent disposed therein, which may be present in at least a residual amount and includes at least one metal carbonate and/or at least one metal oxide. The table includes a second bonding region adjacent to the substrate that extends inwardly from the back surface. The second bonding region exhibits a second interstitial region concentration that is greater than the first interstitial region concentration and includes a metallic infiltrant therein.

Abstract translation: 在一个实施例中，多晶金刚石致密体包括基底和结合到基底的预成型多晶金刚石台。 该表包括定义间隙区域的结合金刚石颗粒。 桌子包括上表面，与表面粘合的后表面，以及在其间延伸的至少一个侧表面。 桌子包括从上表面和侧表面向内延伸的第一区域。 第一区域表现出第一间隙区域浓度并且包括至少一个置于其中的间隙成分，其可以以至少残留量存在并且包括至少一种金属碳酸盐和/或至少一种金属氧化物。 桌子包括与衬底相邻的第二接合区域，其从后表面向内延伸。 第二结合区域表现出比第一间隙区域浓度大的第二间隙区域浓度，并且其中包括金属渗透剂。

公开(公告)号：WO2011056509A3

公开(公告)日：2011-10-27

申请号：PCT/US2010053962

申请日：2010-10-25

Applicant: ILLINOIS TOOL WORKS

Inventor： SWIATOWY JEFFREY

IPC: B24D7/06 ,  B24D3/10 ,  B24D7/16 ,  B24D13/14

CPC classification number: B24D13/142 ,  B24D3/10 ,  B24D7/06

Abstract: A tool (10) for removing fusion bonded epoxy coating from the surface of a pipe has an elongate rotatable shaft (12) suitable for being received in a rotating tool holder of a machine. Extending radially outward of the distal end (16) of the shaft (12) are a plurality of fingers (40), the outer ends of which are spaced apart. Each of the fingers (40) is made of a spring metal, and at the distal end of each finger is an abrasive pad (60) having diamond particles embedded in soft metal. Spring force is independently applied by each spring finger (40) to its associated abrasive pad (60).

Abstract translation: 用于从管表面去除熔接环氧树脂涂层的工具（10）具有适于容纳在机器的旋转工具架中的细长的可旋转轴（12）。 在轴（12）的远端（16）的径向外侧延伸的是多个指状物（40），其外端间隔开。 每个手指（40）由弹簧金属制成，并且在每个手指的远端处是具有镶嵌在软金属中的金刚石颗粒的研磨垫（60）。 每个弹簧手指（40）独立地施加弹簧力到其相关联的研磨垫（60）。

公开(公告)号：WO2011041693A4

公开(公告)日：2011-09-15

申请号：PCT/US2010051148

申请日：2010-10-01

Applicant: BAKER HUGHES INC ,  ELEMENT SIX PRODUCTION PTY LTD ,  SCOTT DANNY E ,  SKEEM MARCUS R ,  LUND JEFFREY B ,  LIVERSAGE JOHN H ,  ADIA MOOSA MAHOMED

Inventor： SCOTT DANNY E ,  SKEEM MARCUS R ,  LUND JEFFREY B ,  LIVERSAGE JOHN H ,  ADIA MOOSA MAHOMED

IPC: E21B10/567 ,  E21B10/42 ,  E21B10/56

CPC classification number: E21B10/5735 ,  B22F2998/00 ,  B24D3/10 ,  B24D18/0009 ,  C23C30/005 ,  E21B10/43 ,  E21B10/567 ,  C22C26/00

Abstract: Cutting elements for earth-boring tools may generate a shear lip at a wear scar thereon during cutting. A diamond table may exhibit a relatively high wear resistance, and an edge of the diamond table may be chamfered, the combination of which may result in the formation of a shear lip. Cutting elements may comprise multi-layer diamond tables that result in the formation of a shear lip during cutting. Earth-boring tools include such cutting elements. Methods of forming cutting elements may include selectively designing and configuring the cutting elements to form a shear Hp. Methods of cutting a formation using an earth-boring tool include cutting the formation with a cutting element on the tool, and generating a shear lip at a wear scar on the cutting element. The cutting element may be configured such that the shear lip comprises diamond material of the cutting element.

Abstract translation: 用于钻孔工具的切割元件可能在切割期间在其上的磨损疤痕上产生剪切唇。 钻石台可能具有较高的耐磨性，并且金刚石台的边缘可能会倒角，其结合可能导致形成剪切唇。 切割元件可以包括导致​​在切割期间形成剪切唇缘的多层金刚石台。 钻孔工具包括这样的切割元件。 形成切割元件的方法可以包括选择性地设计和配置切割元件以形成剪切Hp。 使用钻孔工具切割地层的方法包括用工具上的切割元件切割地层，并在切割元件上产生磨损痕迹的剪切唇缘。 切割元件可以被配置成使得剪切唇缘包括切割元件的金刚石材料。

公开(公告)号：WO2010098978A1

公开(公告)日：2010-09-02

申请号：PCT/US2010/023692

申请日：2010-02-10

Applicant: US SYNTHETIC CORPORATION ,  MUKHOPADHYAY, Debkumar ,  BERTAGNOLLI, Kenneth, E. ,  SANI, Mohammad, N.

Inventor： MUKHOPADHYAY, Debkumar ,  BERTAGNOLLI, Kenneth, E. ,  SANI, Mohammad, N.

IPC: B22F7/06 ,  E21B10/573

CPC classification number: B24D3/10 ,  B22F2005/001 ,  B22F2998/00 ,  C04B35/528 ,  C04B2235/3847 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/555 ,  C22C26/00 ,  C22C2204/00 ,  E21B10/5735 ,  Y10T428/24893 ,  Y10T428/30 ,  C22C29/08

Abstract: Embodiments relate to polycrystalline diamond compacts ("PDCs") including a polycrystalline diamond ("PCD") table that is substantially free of defects formed due to abnormal grain growth of tungsten carbide grains, and methods of fabricating such PDCs. In an embodiment, a PDC comprises a cemented tungsten carbide substrate including an interfacial surface that is substantially free of tungsten carbide grains exhibiting abnormal grain growth, and a PCD table bonded to the interfacial surface of the cemented tungsten carbide substrate. The PCD table includes a plurality of bonded diamond grains defining a plurality of interstitial regions. At least a portion of the interstitial regions includes a metal-solvent catalyst disposed therein. The PCD table may be substantially free of chromium or the PCD table and the cemented tungsten carbide substrate may each include chromium.

Abstract translation: 实施例涉及包括基本上没有由碳化钨颗粒的异常晶粒生长形成的缺陷的多晶金刚石（“PCD”）表的多晶金刚石压块（“PDC”），以及制造这种PDC的方法。 在一个实施方案中，PDC包括包含基本上不含显示异常晶粒生长的碳化钨颗粒的界面的粘结碳化钨基材和结合到粘结碳化钨基材的界面表面的PCD表。 PCD表包括限定多个间隙区域的多个结合金刚石晶粒。 间隙区域的至少一部分包括设置在其中的金属 - 溶剂催化剂。 PCD表可以基本上不含铬或PCD台，并且硬质合金碳化物基材可以各自包含铬。

公开(公告)号：WO2009138435A1

公开(公告)日：2009-11-19

申请号：PCT/EP2009/055786

申请日：2009-05-13

Applicant: O'CEALLAIGH, Micheal

Inventor： O'CEALLAIGH, Micheal

IPC: B24B7/22 ,  B24B37/04 ,  B24D3/10 ,  B24D5/06 ,  B24D7/06 ,  B24D18/00

CPC classification number: B24B7/228 ,  B24D3/10 ,  B24D5/06 ,  B24D7/06 ,  B24D18/00

Abstract: A cup wheel for a grinding tool for use in grinding semiconductor substrates is presented herein, the wheel comprising: a hub having a pair of opposing faces and a peripheral rim linking said faces; and at least one grinding segment mounted on and upstanding from at least one face of the hub; wherein in use, as the wheel is rotated, the face ofthe hub on which the at least one grinding segment is mounted is directed towards the substrate to be ground, to bring the at least one grinding segment into contact withthe substrate, and wherein at least one pair of side faces of the at least one grinding segment intersect at a leading edge which substantially faces the direction of travel of the grinding segment as the wheel rotates.

Abstract translation: 本文提出了一种用于研磨半导体衬底的研磨工具的杯轮，该轮包括：轮毂，其具有一对相对面和连接所述面的外围边缘; 以及至少一个磨削段，其安装在所述轮毂的至少一个面上并且直立; 其中在使用中，当车轮旋转时，其上安装有至少一个研磨段的毂的表面被引向待研磨的基底，以使至少一个研磨段与基底接触，并且其中至少 所述至少一个研磨段的一对侧面在前进边缘处相交，所述前缘基本上面对所述研磨段随所述轮旋转时的行进方向。