公开(公告)号：WO2008051838A2

公开(公告)日：2008-05-02

申请号：PCT/US2007/081924

申请日：2007-10-19

Applicant: SANDISK CORPORATION ,  MIDDLEKAUFF, Warren ,  MILLER, Robert ,  CENTOFANTE, Charlie

Inventor： MIDDLEKAUFF, Warren ,  MILLER, Robert ,  CENTOFANTE, Charlie

IPC: H05K1/00

CPC classification number: H05K1/0268 ,  H05K1/0269 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2203/161

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract translation: 公开了生产集成电路产品的改进技术。 改进的技术使集成电路产品的生产更小，成本更低。 本发明的一个方面涉及使用印刷油墨覆盖设置有集成电路产品的测试触点（例如，测试引脚）。 一旦用油墨覆盖，测试触点不再电暴露。 因此，集成电路产品不易受到意外接触或静电放电的影响。 此外，集成电路产品可以小尺寸高效生产，无需额外的封装或标签来电隔离测试触点。

公开(公告)号：WO2008051838A3

公开(公告)日：2008-06-12

申请号：PCT/US2007081924

申请日：2007-10-19

Applicant: SANDISK CORP ,  MIDDLEKAUFF WARREN ,  MILLER ROBERT ,  CENTOFANTE CHARLIE

Inventor： MIDDLEKAUFF WARREN ,  MILLER ROBERT ,  CENTOFANTE CHARLIE

IPC: G06K19/077 ,  G11C5/00 ,  H05K1/02

CPC classification number: H05K1/0268 ,  H05K1/0269 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2203/161

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract translation: 公开了用于生产集成电路产品的改进的技术。 改进的技术允许集成电路产品的生产更小且成本更低。 本发明的一个方面涉及提供使用印刷油墨的集成电路产品的测试接触（例如测试引脚）。 一旦被油墨覆盖，测试触点就不再被电镀。 因此，集成电路产品不易意外进入或静电放电。 此外，集成电路产品可以以小尺寸有效地生产，而不需要额外的封装或标签来电隔离测试触点。

公开(公告)号：WO1995002499A1

公开(公告)日：1995-01-26

申请号：PCT/US1994007903

申请日：1994-07-13

Applicant: FARQUHAR, Jim ,  CENTOFANTE, Charlie ,  DORF, Ken ,  WEIBEZAHN, Brandt ,  FAJARDO, Iggoni

IPC: B29C65/02

CPC classification number: H05K5/0269 ,  B29C45/14336 ,  B29C65/08 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/54 ,  B29L2031/3425 ,  G06K19/077 ,  Y10T156/1002

Abstract: A package (10) for a memory card (28) and the process by which the package is manufactured. The package comprises chiefly two stamped steel covers, (an upper (12) and a lower cover (14) half), each secured to a plastic frame element (16 and 18). The cover halves (16 and 18) are secured by extended fingers (26) which wrap around the plastic frame (16 and 18). This provides a double layer of metal at the perimeter of the frame. The two cover halves (12 and 14) are situated so as to encapsulate the subject PCB (28) and to affix it in its proper position. The two cover halves (12 and 14) are then welded together using sonic welding on the plastic frame. The package (10) has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Abstract translation: 一种用于存储卡（28）的包装（10）和制造包装的过程。 该包装主要包括两个冲压的钢盖（一个上部（12）和一个下盖（14）），每个固定到塑料框架元件（16和18）上。 盖半部（16和18）通过围绕塑料框架（16和18）的延伸指状物（26）固定。 这在框架的周边提供了双层金属。 两个盖半部（12和14）被定位成封装主体PCB（28）并将其固定在其正确位置。 然后使用声波焊接将两个盖半部（12和14）焊接在塑料框架上。 封装（10）被设计为满足所有PCMCIA标准，包括极化键和接地点。