公开(公告)号：WO2008117213A3

公开(公告)日：2008-12-31

申请号：PCT/IB2008051064

申请日：2008-03-20

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  VAN OS KOEN ,  COOLEN MARCEL W W

Inventor： VAN OS KOEN ,  COOLEN MARCEL W W

IPC: H05K1/14 ,  B01L3/00 ,  B01L7/00 ,  H01L25/16 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/144 ,  B01L3/5027 ,  B01L7/52 ,  B01L2200/147 ,  B01L2300/0819 ,  B01L2300/0861 ,  B01L2300/1822 ,  B01L2300/1827 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0002 ,  H05K1/117 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An assembly of at least two printed circuit boards includes an intermediate connection layer (40) for providing electrical and mechanical connections between first and second circuit boards (10,12). The intermediate connection layer comprises a lower set of connection pads connecting the intermediate layer to the first circuit board, and an upper set of connection pads connecting the intermediate layer to the second circuit board. The intermediate connection layer comprises connection regions and a void region, wherein the void region extends between the first and second circuit boards and houses electronic components (16) of the circuit boards. This arrangement uses an intermediate connection layer to provide a stable mechanical connection, provide electrical connections between the circuit boards, and define a spacing for housing the electrical components of one or both of the circuit boards. The connections can be soldered, and this can be performed by reflow soldering methods, and using pick and place equipment.

Abstract translation: 至少两个印刷电路板的组件包括用于提供第一和第二电路板（10,12）之间的电连接和机械连接的中间连接层（40）。 中间连接层包括将中间层连接到第一电路板的下组连接垫和将中间层连接到第二电路板的上组连接垫。 中间连接层包括连接区域和空隙区域，其中空隙区域在第一和第二电路板之间延伸并容纳电路板的电子部件（16）。 该布置使用中间连接层来提供稳定的机械连接，提供电路板之间的电连接，并且限定用于容纳一个或两个电路板的电气部件的间隔。 连接可以焊接，这可以通过回流焊接方法和使用拾放设备来执行。

公开(公告)号：WO2008117213A2

公开(公告)日：2008-10-02

申请号：PCT/IB2008/051064

申请日：2008-03-20

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  VAN OS, Koen ,  COOLEN, Marcel, W., W.

Inventor： VAN OS, Koen ,  COOLEN, Marcel, W., W.

IPC: B01L3/00 ,  B01L7/00

CPC classification number: H05K1/144 ,  B01L3/5027 ,  B01L7/52 ,  B01L2200/147 ,  B01L2300/0819 ,  B01L2300/0861 ,  B01L2300/1822 ,  B01L2300/1827 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/0002 ,  H05K1/117 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An assembly of at least two printed circuit boards includes an intermediate connection layer (40) for providing electrical and mechanical connections between first and second circuit boards (10,12). The intermediate connection layer comprises a lower set of connection pads connecting the intermediate layer to the first circuit board, and an upper set of connection pads connecting the intermediate layer to the second circuit board. The intermediate connection layer comprises connection regions and a void region, wherein the void region extends between the first and second circuit boards and houses electronic components (16) of the circuit boards. This arrangement uses an intermediate connection layer to provide a stable mechanical connection, provide electrical connections between the circuit boards, and define a spacing for housing the electrical components of one or both of the circuit boards. The connections can be soldered, and this can be performed by reflow soldering methods, and using pick and place equipment.

Abstract translation: 至少两个印刷电路板的组件包括用于在第一和第二电路板（10,12）之间提供电气和机械连接的中间连接层（40）。 中间连接层包括将中间层连接到第一电路板的下一组连接焊盘，以及将中间层连接到第二电路板的上部连接焊盘组。 中间连接层包括连接区域和空隙区域，其中空隙区域在第一和第二电路板之间延伸并且容纳电路板的电子部件（16）。 这种布置使用中间连接层来提供稳定的机械连接，在电路板之间提供电连接，并且限定用于容纳一个或两个电路板的电气部件的间隔。 连接可以焊接，这可以通过回流焊接方法进行，并使用拾取和放置设备。