摘要:
A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.
摘要:
In one example, an optical device may include a waveguide having a core index of refraction that decreases along a length of the waveguide and an edge index of refection of the waveguide that is constant along the length of the waveguide. The central rays of the optical signals travelling through the waveguide may be refracted towards higher radii while the outer rays propagate unaffected. The optical device may decrease dispersion of the optical signals travelling through an optical fiber.
摘要:
An alignment connector for an optoelectronic module can include: a front end having a first gripper arm and a second gripper arm with an alignment connector aperture between the first gripper arm and the second gripper arm; a base having a bottom surface and a receptacle surface; the back end having a first back wall and a second back wall with a back gap therebetween; and a ferrule receptacle extending to a medial region where the alignment connector aperture extends from, and including a portion of the receptacle surface, the ferrule receptacle being defined by a first side wall having a first latch arm and a second side wall having a second latch arm. The alignment connector can be included in a module with a bail or pull-tab. Alternatively, the first gripper arm and second gripper arm can be mounted directly to a module housing.
摘要:
A VCSEL may include a bottom DBR mirror and a top DBR mirror above the bottom DBR mirror. The VCSEL may include a vertical optical cavity located within a portion of the bottom and top DBR mirrors. The vertical optical cavity may be configured to emit an optical signal. The VCSEL may include a lateral feedback optical cavity located within a different portion of the bottom and the top DBR mirrors configured to receive a feedback bias signal configured to bias the lateral feedback optical cavity to adjust the optical signal. The VCSEL may include an active region formed between the bottom and the top DBR mirrors that may include an oxide layer defining an oxide aperture. The VCSEL may include an isolation implant configured to electrically isolate the vertical optical cavity from the feedback optical cavity and to create a first and a second aperture within the oxide aperture.
摘要:
A circuit and method in an amplifier circuit for filtering a DC offset in differential input signals and inserting a programmable adjustable crosspoint offset in differential output signals. An amplifier circuit includes a differential amplifier circuit configured to amplify differential input signals into differential output signal. The amplifier circuit further includes a feedback circuit coupled between the differential output signals and the differential input signals. The feedback circuit is configured to generate a programmably adjustable crosspoint offset in the differential output signal and a programmably adjustable cutoff frequency of the feedback circuit. An amplifier method includes amplifying differential input signals into differential output signals, generating a programmably adjustable crosspoint offset in the differential output signal, and generating a programmably adjustable cutoff frequency of a feedback circuit between the differential output signals and the differential input signals.
摘要:
In an embodiment, an optoelectronic module includes a printed circuit board (PCB) and a lens block. The printed circuit board (PCB) includes at least one of an optical transmitting or receiving array. The lens block may be configured for directly coupling light between one of the optical transmitting or receiving array to optical fibers in an optical cable. A method may include directly coupling light between one of an optical transmitting or receiving array and a lens block, and further coupling the light through the lens block directly to an optical fiber of an optical cable externally coupled to the optoelectronic module.
摘要:
An etched planarized VCSEL includes: an active region (122) comprising MQW (138,140); a blocking region (127,160) over the active region which may be made form InGaP, and defining apertures therein; and conductive channel cores (129,162) in the apertures which may be made from AIGaAs, wherein the conductive channel cores and blocking region form an isolation region (128). The VCSEL may comprise spacer layers (148,150). A method of making the VCSEL includes: forming the active region; forming the blocking region over the active region; etching the apertures in the blocking region; and forming the conductive channel cores in the apertures of the blocking region. Another etched planarized VCSEL includes: an active region; a conductive region over the active region, and defining apertures therein; and blocking cores in the apertures, wherein the blocking cores and conductive region form an isolation region. A method of making the VCSEL includes: forming the active region; forming the conductive region over the active region; etching the apertures in the conductive region; and forming the blocking cores in the apertures of the conductive region. This kind of providing a current aperture for a VCSEL avoids the reliability problems of current apertures provided by lateral oxidisation of a layer in the mesa of the VCSEL.
摘要:
An optical system includes a silicon (Si) substrate (102), a buried oxide (BOX) layer (104) formed on the substrate (102), a silicon nitride (SiN) layer (112) formed above the BOX layer, and a SiN waveguide (114) formed in the SiN layer (112). In some embodiments, the optical system may additionally include an interposer waveguide (116) adiabatically coupled to the SiN waveguide (114) to form a SiN-interposer adiabatic coupler that includes at least the tapered section of the SiN waveguide, the optical system further including at least one of: a cavity (402) formed in the Si substrate at least beneath the SiN-interposer adiabatic coupler or an oxide overlay (822) formed between a top of a SiN core of the SiN waveguide and a bottom of the interposer waveguide. Alternatively or additionally, the optical system may additionally include a multimode Si-SiN adiabatic coupler that includes a SiN taper (1008) of a SiN waveguide and a Si taper (1006) of a Si waveguide.
摘要:
An optical system includes a silicon (Si) substrate, a buried oxide (BOX) layer formed on the substrate, a silicon nitride (SiN) layer formed above the BOX layer, and a SiN waveguide formed in the SiN layer. In some embodiments, the optical system may additionally include an interposer waveguide adiabatically coupled to the SiN waveguide to form a SiN-interposer adiabatic coupler that includes at least the tapered section of the SiN waveguide, the optical system further including at least one of: a cavity formed in the Si substrate at least beneath the SiN-interposer adiabatic coupler or an oxide overlay formed between a top of a SiN core of the SiN waveguide and a bottom of the interposer waveguide. Alternatively or additionally, the optical system may additionally include a multimode Si-SiN adiabatic coupler that includes a SiN taper of a SiN waveguide and a Si taper of a Si waveguide.
摘要:
In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within the gap between the first surface and the second surface. The method may also include dispensing bulk epoxy into the gap and in contact with the precured epoxy, the first surface, and the second surface. The method may also include curing the bulk epoxy to bond the first surface to the second surface.