Abstract:
The present invention pertains to a linear power regulator device (10), comprising an internal pass device (32), a driver device (20) having a driver output (27) arranged to drive the internal pass device (32) via the driver output (27), wherein the linear power regulator device (10) comprises an external connection (34) connectable or connected to an external pass device (50); and wherein the driver device (20) is arranged to drive an external pass device (50) via the driver output (33) and the external connection (34). The invention also pertains to a corresponding electronic device.
Abstract:
A reference voltage loss monitoring circuit comprises a first reference node (51) and a second reference node(52). The reference nodes are arranged to be connected to a voltage reference (Vref). A first connection device (1) is arranged to connect the first reference node to the second reference node, and comprises a first diode (11) arranged to allow a current flowing from the first reference node to the reference ground node and not conversely. The first diode comprises a first main transistor (12) connected to operate as a diode. A second connection device (2) is arranged to connect the second reference node to the first reference node, and comprises a second diode (21) arranged to allow a current flowing from the second reference node to first reference node and not conversely. The second diode comprises a second main transistor (22) connected to operate as a diode. Each of the first and second connection devices further comprises a secondary transistor (14, 24) mirrored with the main transistor of the first and second connection devices respectively. The secondary transistor comprises an output arranged to be coupled to a diagnostic circuit (90), for delivering to the diagnostic circuit a signal indicative of a loss of voltage reference on a respective reference node.
Abstract:
An electronic device (10) for generating an error signal in response to an electrostatic discharge perturbation is described. The device (10) may comprise: a detection unit (34; 36; 38) for generating a detection signal in response to said electrostatic discharge perturbation, said detection signal correlating in time with said electrostatic discharge perturbation; a clock (26) for generating a clock signal having a clock period; and a protection unit (28) for generating an error signal in response to said detection signal only when a duration of said detection signal exceeds a predefined multiple of said clock period. A method of generating an error signal in response to an electrostatic discharge perturbation, for protecting electronic circuitry, is also disclosed.
Abstract:
A power safety circuit (30) comprises a power sense terminal (32); an output terminal (34); an output driver unit (36) connected to the output terminal; an input terminal (38) connectable to receive a first power from a power source (40) and arranged to supply the first power to the output driver unit; and a power detection unit (42) arranged to detect a state of the input terminal and provide a power sense signal to the power sense terminal; wherein the power sense terminal is arranged to supply a second power to the output driver unit when the power sense signal indicates a level of the first power below a minimum level for driving the output terminal. An integrated circuit device (50) comprises at least one power safety circuit (30). A safety critical system (60) comprises at least one integrated circuit device (50) with at least one power safety circuit (30).
Abstract:
An integrated circuit device (100) comprises a first integrated circuit (101) and a second integrated circuit (102) wherein the first and second integrated circuits (101, 102) are comprised on a single semiconductor die (100). The second integrated circuit (102) is a safety circuit (102) arranged to monitor the operation of the first integrated circuit (101), report any detected faults and drive the device into a failsafe state if a fault is detected. The first integrated circuit (101) may be a power management module for a safety critical system. An isolation barrier in the form of a trench (107) is formed between the two integrated circuits (101, 102) so that the safety circuit (102) is protected from any high voltage or thermal stresses arising in the first integrated circuit (101). The device (100) has particular application to automotive safety-critical systems such as electric power steering systems.
Abstract:
A packaged semiconductor device (1) comprising a package (2) and a semiconductor device (3) is described. The semiconductor device (3) comprises a first and a second GND-pad (31, 32) bonded to one or more GND-pins (11, 12) with a first and a second bond wire (B1, B2) respectively, a first functional pad (33) bonded to a first functional pin (13) with a third bond wire (B3), a semiconductor layer (10) of a P-type conductivity, a first semiconductor component (34) and a second semiconductor component (37). The first semiconductor component (34) is arranged to, when a transient current is applied to the first functional pin, divert at least part of the transient current to the first GND-pad from the first P-region to the first GND-pad via at least a first PN- junction (J1). The second semiconductor component (37) comprises a second N-type region (N2) of a terminal of the second semiconductor component (37) associated with the first functional pad. The first GND-pad (31) is in contact with a second P-type region. The second GND-pad (32) is in contact with a third N-type region. At least part (P2a) of the second P-type region is arranged in between the first semiconductor component (34) and the second semiconductor component (37), and at least part of the third N-type region is arranged in between the at least part of the first P-type region (P1) and the second semiconductor component (37).
Abstract:
An integrated circuit (IC) device comprising at least one electrostatic discharge (ESD) protection network for a high voltage application. The at least one ESD protection network comprises a common diode structure operably coupled between at least one external contact of the IC device for which ESD protection is to be provided and a substrate of the IC device such that the common diode structure is forward biased towards the at least one external contact, at least one Darlington transistor structure operably coupled between the at least one external contact of the IC device for which ESD protection is to be provided and the substrate of the IC device, and the at least one Darlington transistor structure comprising: an emitter node operably coupled to the at least one external contact of the IC device; a collector node operably coupled to the substrate of the IC device; and a base node operably coupled between the emitter node of the Darlington transistor structure and the common diode structure. The at least one ESD protection network further comprises at least one isolation diode structure operably coupled between the emitter node and the base node of the at least one Darlington transistor structure such that the at least one isolation diode structure is forward biased towards the base node.