Abstract:
A cerebrospinal fluid ("CSF") collection tube includes a bottom end portion and a tubular sidewall portion. The tubular sidewall portion has a first end and a second end, the first end being sealed to the bottom end portion and the second end defining an open end portion of the CSF collection tube. The CSF collection tube further includes a filament element that is attached to an interior surface of the tubular sidewall portion and projects through the open end portion of the CSF collection tube. The CSF collection tube may further include a removeable cap.
Abstract:
A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.
Abstract:
A cerebrospinal fluid ("CSF") collection tube includes a bottom end portion and a tubular sidewall portion. The tubular sidewall portion has a first end and a second end, the first end being sealed to the bottom end portion and the second end defining an open end portion of the CSF collection tube. The CSF collection tube further includes a filament element that is attached to an interior surface of the tubular sidewall portion and projects through the open end portion of the CSF collection tube. The CSF collection tube may further include a removeable cap.
Abstract:
A method of treating a dielectric surface portion of a semiconductor substrate, comprising the steps of: (a) providing a semiconductor substrate having a dielectric surface portion; and then (b) treating said dielectric surface portion with a coating reagent, the coating reagent comprising a reactive group coupled to a coordinating group, with the coordinating group having a metal bound thereto, so that the metal is deposited on the dielectric surface portion to produce a surface portion treated with a metal.
Abstract:
A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), comprises the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising carbon dioxide); adding a second fluid (typically also a supercritical fluid) to said vessel, with said second fluid being added at a pressure greater than the pressure of the first supercritical fluid, and with said second fluid having a density less than that of the first supercritical fluid; forming an interface between the first supercritical fluid and the second fluid; and displacing at least a portion of the first supercritical fluid from the vessel with the pressure of the second, preferably fluid while maintaining the interface therebetween.
Abstract:
Compositions useful for cleaning metal from a substrate or coating metal onto a substrate are described: Such compositions comprise (a) a densified carbon dioxide continuous phase; (b) a polar discrete phase in said carbon dioxide continuous phase; (c) a metal in said discrete phase (i.e., a metal removed from the substrate, or to be coated onto the substrate); (d) at least one ligand in said continuous phase, said discrete phase, or both said continuous and said discrete phase.
Abstract:
Compositions useful for cleaning metal from a substrate or coating metal onto a substrate are described: Such compositions comprise (a) a densified carbon dioxide continuous phase; (b) a polar discrete phase in said carbon dioxide continuous phase; (c) a metal in said discrete phase ( i.e ., a metal removed from the substrate, or to be coated onto the substrate); (d) at least one ligand in said continuous phase, said discrete phase, or both said continuous and said discrete phase.
Abstract:
A method of cleaning a microelectronic substrate is carried out by providing a cleaning fluid, the cleaning fluid comprising an adduct of hydrogen fluoride with a Lewis base in a carbon dioxide solvent; and then cleaning the substrate by contacting the substrate to the cleaning fluid for a time sufficient to clean the substrate.
Abstract:
Dental restorative composites having self-healing capabilities to repair discontinuities in the composite are provided. Dental restorative composites according to the present invention include a microsphere that encapsulates a monomer. When a fracture occurs, the microsphere is ruptured and the monomer fills the fracture. Depending on the monomer present in the microsphere, it is polymerized by a polymerization initiator or by an olefin metathesis catalyst present in the dental restorative composite. Self-healing dental restorative composites provide increased resistance to fracturing, and thus remain substantially intact for a longer period of time, preserving the remedial integrity of the dental repair or reconstruction.
Abstract:
A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.