公开(公告)号：WO2007064672A3

公开(公告)日：2009-04-30

申请号：PCT/US2006045621

申请日：2006-11-29

Applicant: AMPHENOL CORP ,  GAILUS MARK W ,  KHILCHENKO LEON M

Inventor： GAILUS MARK W ,  KHILCHENKO LEON M

IPC: H05K1/16 ,  H05K3/34

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，该导电粘合剂可以是无铅（Pb）。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 在粘合剂的转移方面的进一步的帮助下，接触尾部可以形成有凹部，这增加了粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

公开(公告)号：WO2008094135A2

公开(公告)日：2008-08-07

申请号：PCT/US2006045624

申请日：2006-11-29

Applicant: AMPHENOL CORP ,  GAILUS MARK W ,  KHILCHENKO LEON M

Inventor： GAILUS MARK W ,  KHILCHENKO LEON M

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

公开(公告)号：WO2008094135A3

公开(公告)日：2008-08-07

申请号：PCT/US2006/045624

申请日：2006-11-29

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

IPC: H01R12/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

公开(公告)号：WO2007064672A2

公开(公告)日：2007-06-07

申请号：PCT/US2006/045621

申请日：2006-11-29

Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

IPC: H05K7/00

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，该导电粘合剂可以是无铅（Pb）。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 在粘合剂的转移方面的进一步的帮助下，接触尾部可以形成有凹部，这增加了粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。