公开(公告)号：WO2013093976A1

公开(公告)日：2013-06-27

申请号：PCT/JP2011/007195

申请日：2011-12-22

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H01P7/04 ,  H01P1/203 ,  H01P1/205

CPC classification number: H01P1/2053 ,  H01P1/208 ,  H01P1/2088 ,  H01P7/04

Abstract: A filter of the present invention includes a first terminal, a second terminal and a resonant element. The resonant element includes a multilayer substrate, ground vias through the multilayer substrate and a signal via through the multilayer substrate, surrounded by the ground vias and connected to the first and the second terminals. The multilayer substrate further includes a top conductor layer, a bottom conductor layer with at least one aperture, at least one intermediate conductor layer between the top and the bottom conductor layers and a dielectric material which isolates the top, each intermediate and the bottom conductor layers from each other. Each intermediate conductor layer includes a conductive plate connected to the signal via and isolated from the ground vias. The bottom conductor layer is connected to the other end of the signal via. The signal via and an area surrounded by the ground vias in the multilayer substrate act as an artificial dielectric.

Abstract translation: 本发明的滤波器包括第一端子，第二端子和谐振元件。 谐振元件包括多层基板，通过多层基板的接地通孔和通过多层基板的信号通道，被接地通孔包围并连接到第一和第二端子。 多层基板还包括顶部导体层，具有至少一个孔的底部导体层，在顶部和底部导体层之间的至少一个中间导体层和隔离顶部，每个中间和底部导体层的介电材料 从彼此。 每个中间导体层包括连接到信号通孔并与接地通孔隔离的导电板。 底部导体层连接到信号通孔的另一端。 信号通孔和由多层基板中的接地通孔包围的区域用作人造电介质。

公开(公告)号：WO2006009274A1

公开(公告)日：2006-01-26

申请号：PCT/JP2005/013539

申请日：2005-07-19

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H01P1/203 ,  H01P3/08 ,  H05K3/46

CPC classification number: H01P1/2039 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/1006

Abstract: A composite via structure in a multilayer printed circuit board (PCB) and also compact and shielded filters formed by the use of composite via structures as building blocks are provided. The composite via structure consists of two functional parts. The first functional part is designed to form an interconnected circuit with low return and leakage losses between the first pad disposed at the one side of the PCB and the special pad serving for a connection to a planar transmission line. The second functional part of the composite via structure serves to form a shielded open- or short-circuited resonant length (stub) extended in the vertical direction from the special pad to the second pad disposed at the opposite side of the PCB.

Abstract translation: 提供了一种多层印刷电路板（PCB）中的复合通孔结构以及通过使用复合通孔结构作为结构单元形成的紧凑且屏蔽的过滤器。 复合通孔结构由两个功能部件组成。 第一功能部件被设计成形成互连电路，其在布置在PCB的一侧的第一焊盘和用于连接到平面传输线的专用焊盘之间具有低返回和漏电损耗。 复合通孔结构的第二功能部分用于形成从垂直方向延伸的屏蔽的开路或短路谐振长度（短截线），从特殊焊盘延伸到设置在PCB相对侧的第二焊盘。

公开(公告)号：WO2013171788A9

公开(公告)日：2014-09-18

申请号：PCT/JP2012003175

申请日：2012-05-15

Applicant: NEC CORP ,  KUSHTA TARAS ,  HARADA TAKASHI

Inventor： KUSHTA TARAS ,  HARADA TAKASHI

IPC: H01P1/205 ,  H01P7/04 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P1/203 ,  H01P1/20345 ,  H01P1/2088 ,  H01P7/082 ,  H05K1/0222 ,  H05K1/0298 ,  H05K1/16

Abstract: A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.

Abstract translation: 本发明的滤波器包括多层基板，两个端子，接地导体和混合谐振器。 多层基板包括多个导体层和被配置为将所述多个导体层彼此隔离的电介质。 混合谐振器设置在多层衬底中，并且包括第一和第二谐振元件和连接第一和所述第二谐振元件的耦合条。 每个谐振元件包括信号通孔，一组接地通孔和人造电介质。 每个信号通孔设置穿过多层基板。 每组接地孔通过多层基板设置并且被配置为围绕信号通孔。 每个人造电介质设置在多层基板中，并且在信号通孔和一组接地通孔之间。 人造电介质包括连接到第一信号通孔的导电板和将第一导电板与一组接地通孔隔离的隔离狭缝。

公开(公告)号：WO2010073410A1

公开(公告)日：2010-07-01

申请号：PCT/JP2008/073942

申请日：2008-12-25

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H01P7/04 ,  H01P1/205

CPC classification number: H01P1/2056 ,  H01P1/203 ,  H01P7/04 ,  H01P7/08 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09718

Abstract: A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.

Abstract translation: 滤波器设置有平面传输线和连接到平面传输线的一端的（两者）的组合通孔结构。 平面传输线和组合通孔结构设置在相同的多层板中。 组合通孔结构包括两个工作部件。 第一工作部分包括信号通道的段和围绕信号通路的多个接地通路段。 第二工作部分包括相同信号通道的段，相同接地通孔的多个段，平滑导电板和波纹状导电板。 平滑导电板和波纹状导电板连接到信号通孔。 第二工作部分包括相同信号通道的段，相同接地通孔和波纹状导电板的多个段。 波纹状导电板与信号通孔相连。

公开(公告)号：WO2007102597B1

公开(公告)日：2007-11-08

申请号：PCT/JP2007054621

申请日：2007-03-02

Applicant: NEC CORP ,  NEC ELECTRONICS CORP ,  KUSHTA TARAS ,  NARITA KAORU ,  KANEKO TOMOYUKI ,  OGOU SHIN-ICHI

Inventor： KUSHTA TARAS ,  NARITA KAORU ,  KANEKO TOMOYUKI ,  OGOU SHIN-ICHI

IPC: H05K3/46

CPC classification number: H05K1/116 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09727

Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

Abstract translation: 根据一个实施例，形成多层衬底中的将通孔结构和平面传输线接合的宽带过渡作为信号通孔焊盘与布置在相同导体层上的平面传输线之间的中间连接。 过渡部分的横向尺寸等于一端的通孔焊盘直径和另一端的焊条宽度; 根据通过三维全波模拟获得的数字图，过渡的长度可以等于间隙孔在平面传输线方向上的特征尺寸或者被定义为在时域中提供最小过量感抗 。

公开(公告)号：WO2014128761A1

公开(公告)日：2014-08-28

申请号：PCT/JP2013/001030

申请日：2013-02-22

Applicant: NEC CORPORATION ,  KUSHTA, Taras ,  MIYATA, Akira

Inventor： KUSHTA, Taras ,  MIYATA, Akira

IPC: H01P5/107

CPC classification number: H01P3/02 ,  H01P5/107

Abstract: A wideband transition of the present invention between a planar transmission line and a waveguide comprises a substrate, a segment of the planar transmission line, a conductive patch, an adjusting conductor plate and a section of the waveguide. The segment is arranged in a top conductor layer of the substrate. The conductive patch is arranged in the top conductor layer and connected to one end of the segment. The adjusting conductor plate is arranged in the top conductor layer or another conductor layer of the substrate next to the top conductor layer and isolated from any other conductor. The section is disposed above the conductive patch and connected to a conductor plane at the top conductor layer. Another end of the segment is a first terminal of the wideband transition. Another end of the section is a second terminal of the wideband transition.

Abstract translation: 本发明在平面传输线和波导之间的宽带转变包括基板，平面传输线的一段，导电贴片，调节导体板和波导的一部分。 该片段布置在衬底的顶部导体层中。 导电贴片布置在顶部导体层中并连接到片段的一端。 调整导体板布置在顶导体层或衬底的另一导体层之上，与顶导体层相邻，并与任何其它导体隔离。 该部分设置在导电贴片上方并连接到顶部导体层处的导体平面。 该段的另一端是宽带转换的第一个终端。 该部分的另一端是宽带转变的第二个终端。

公开(公告)号：WO2011074105A1

公开(公告)日：2011-06-23

申请号：PCT/JP2009/071084

申请日：2009-12-14

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H01P1/20 ,  H01P7/00

CPC classification number: H05K1/0222 ,  H01P1/203 ,  H01P7/08 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09618

Abstract: A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.

Abstract translation: 谐振通孔结构设置有多层基板，信号通孔导体和接地通孔。 多层基板包括导体层和电介质。 电介质隔离每个导体层。 信号通孔导体设置在多层基板上。 接地通孔通过多层基板和信号通孔导体周围设置。 电介质包括布置在导体层平面中的信号通孔和接地通孔之间的两个部分。 第一部分设置在第一层和其它导体层之间。 第二部分设置在另一层和最后一层导体层之间。

公开(公告)号：WO2008047852A1

公开(公告)日：2008-04-24

申请号：PCT/JP2007/070307

申请日：2007-10-11

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H05K3/46

CPC classification number: H05K1/0219 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/09718

Abstract: To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate and, also, to increase the isolation of the signal via pairs in the via structure. Also, another object of presented invention is improving impedance control for via structures in the wide frequency band and reduction of transformation between differential and common modes. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease.

Abstract translation: 为了提供通过多层衬底中的信号通孔对和接地通孔形成的通孔结构的更紧凑的尺寸，并且还增加了通孔结构中的信号经由对的隔离。 此外，本发明的另一个目的是改进在宽频带中的通孔结构的阻抗控制和减小差模和共模之间的变换。 提供多层基板，使得包括高隔离通孔单元的多层基板，其中高隔离通孔单元包括：两个信号通孔对; 围绕由连接到接地通孔的接地通孔和接地条构成的两个信号通孔对的屏蔽结构，其中屏蔽结构相对于两个通孔对对称地形成，以减少混合模式之间的变换以及来自两个信号通孔对的泄漏; 隔离孔将信号经由对与多层基板的其它导电部分分离并具有预定尺寸以提供高隔离通孔单元的宽带操作; 并且分离带对称地布置在所述信号通孔对之间，以提供两个信号通孔对之间的串扰减小和共模减少。

公开(公告)号：WO2013171788A1

公开(公告)日：2013-11-21

申请号：PCT/JP2012/003175

申请日：2012-05-15

Applicant: NEC CORPORATION ,  KUSHTA, Taras ,  HARADA, Takashi

Inventor： KUSHTA, Taras ,  HARADA, Takashi

IPC: H01P1/205 ,  H01P7/04 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P1/203 ,  H01P1/20345 ,  H01P1/2088 ,  H01P7/082 ,  H05K1/0222 ,  H05K1/0298 ,  H05K1/16

Abstract: A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.

Abstract translation: 本发明的滤波器包括多层基板，两个端子，接地导体和混合谐振器。 多层基板包括多个导体层和被配置为将所述多个导体层彼此隔离的电介质。 混合谐振器设置在多层衬底中，并且包括第一和第二谐振元件和连接第一和所述第二谐振元件的耦合条。 每个谐振元件包括信号通孔，一组接地通孔和人造电介质。 每个信号通孔设置穿过多层基板。 每组接地孔通过多层基板设置并且被配置为围绕信号通道。 每个人工电介质设置在多层基板中，并且在信号通孔和一组接地通孔之间。 人造电介质包括连接到第一信号通孔的导电板和将第一导电板与一组接地通孔隔离的隔离狭缝。

公开(公告)号：WO2012001742A1

公开(公告)日：2012-01-05

申请号：PCT/JP2010/004313

申请日：2010-06-30

Applicant: NEC CORPORATION ,  KUSHTA, Taras

Inventor： KUSHTA, Taras

IPC: H01P1/201 ,  H05K1/02 ,  H05K3/46

CPC classification number: H01P1/20 ,  H01P1/203 ,  H05K1/0222 ,  H05K1/0233 ,  H05K1/0251 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/0979

Abstract: A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.

Abstract translation: 本发明的过滤器包括具有多层基板的多个通孔结构。 多个通孔结构中的每一个包括第一，第二和第三功能部分。 第一功能部的信号通路的一端连接到第二功能部的信号通路的一端，第二功能部的信号通路的另一端连接到第三功能部的两个信号通路。 那些信号通道被多个接地通孔包围。 滤波器的输入和输出端口连接到每个第一功能部分的信号通道的另一端。