公开(公告)号：WO1991011722A1

公开(公告)日：1991-08-08

申请号：PCT/NO1991000008

申请日：1991-01-24

Applicant: SENSONOR A.S ,  JACOBSEN, Henrik ,  KVISTEROY, Terje

Inventor： SENSONOR A.S

IPC: G01P15/09

CPC classification number: G01P15/0802 ,  G01P15/123 ,  G01P15/125 ,  G01P21/00 ,  G01P2015/0828

Abstract: An arrangement in a semiconductor accelerometer (1), e.g. consisting of etched silicon spring (2) comprising a resistance bridge (3), as well as a weight at the free end portion (2') of the spring, and in which a spring rupture indicator is provided in the shape of a resistance loop (6, 6', 6'') along the spring length.

Abstract translation: 半导体加速度计（1）中的布置，例如 由包括电阻桥（3）的蚀刻硅弹簧（2）以及弹簧的自由端部（2'）处的重物组成，其中弹簧断裂指示器设置成电阻环 （6,6'，6“）沿着弹簧长度。

公开(公告)号：WO1992020096A1

公开(公告)日：1992-11-12

申请号：PCT/NO1992000085

申请日：1992-05-05

Applicant: SENSONOR A.S ,  KVISTEROY, Terje ,  JACOBSEN, Henrik

Inventor： SENSONOR A.S

IPC: H01L23/02

CPC classification number: G01P1/023 ,  H01L21/50 ,  H01L23/04 ,  H01L23/057 ,  H01L23/22 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to an arrangement for the encasing of a functional device, e.g., a semiconductor element, a semiconductor-based element, a sensor element, a microactuator, or an electronic circuit consisting of one or more integrated circuits and other electronic components, and a process for preparing an arrangement of this kind. Around the functional device (47) is arranged a casing (43, 45) which forms a closed cavity (51) which completely or partly surrounds the functional device (47). The casing is made of a plastic material or another polymer material. The casing consists of two or more joined components (43, 45). Metal parts which form wire bonds (46) with said functional device (47) in the casing pass through the walls of said casing. At least one of the casing pass through the walls of said casing. At least one of the casing components has filling holes or filling ducts (52, 53) for the introduction of liquid and/or gel material (56) into said cavity, and the filling holes or filling canals are sealed (54, 55) after the volume of the cavity has been filled with said liquid or gel.

Abstract translation: 本发明涉及一种用于封装诸如半导体元件，基于半导体的元件，传感器元件，微致动器或由一个或多个集成电路和其他电子元件组成的电子电路的功能器件的布置，以及 准备这种安排的过程。 在功能装置（47）周围设置有形成完全或部分围绕功能装置（47）的闭合腔（51）的壳体（43,45）。 外壳由塑料材料或另一种聚合物材料制成。 壳体由两个或更多个连接的部件（43,45）组成。 与壳体中的功能装置（47）形成线接合（46）的金属部件穿过所述壳体的壁。 壳体中的至少一个穿过所述壳体的壁。 至少一个壳体部件具有用于将液体和/或凝胶材料（56）引入所述空腔中的填充孔或填充管道（52,53），并且填充孔或填充通道在之后密封（54,55） 空腔的体积已经用所述液体或凝胶填充。