Abstract:
The present invention relates to an underlayer composition having anti-reflective properties useful in a lithographic process. The composition according to the present invention has highly outstanding optical and mechanical characteristics and a high etching selectivity ratio, while at the same time having the feature that coating can be carried out using the spin-on coating technique. Advantageously, the composition of the present invention is used in relatively short wavelength lithography and has a minimal residual acid content.
Abstract:
A hardmask composition having antireflective properties is provided. The hardmask composition is suitable for lithography, provides excellent optical and mechanical properties, and exhibits high etch selectivity. In addition, the hardmask composition can be readily applied by spin-on application techniques. Advantageously, the hardmask composition is useful for short- wavelength lithography and has a minimum residual acid content.
Abstract:
An antireflective hardmask composition is provided. The hardmask composition includes an organic solvent, an initiator, and at least one polymer represented by Formulae A, B, or C, which are described in the specification.
Abstract:
A naphthalene-backbone polymer having antireflective properties is provided. The polymer is represented by Formula 1, which is described in the specification.
Abstract:
Provided herein, according to some embodiments of the invention, are organosilane polymers prepared by reacting organosilane compounds including (a) at least one compound of Formula (I) Si(OR 1 )(OR 2 )(OR 3 )R 4 wherein R 1 , R 2 and R 3 may each independently be an alkyl group, and R 4 may be -(CH 2 ) n R 5 , wherein R 5 may be an aryl or a substituted aryl, and n may be O or a positive integer; and (b) at least one compound of Formula (II) Si(OR 6 )(OR 7 )(OR 8 )R 9 wherein R 6 , R 7 and R 8 may each independently an alkyl group or an aryl group; and R 9 may be an alkyl group. Also provided are hardmask compositions including an organosilane compound according to an embodiment of the invention, or a hydrolysis product thereof. Methods of producing semiconductor devices using a hardmask compostion according to an embodiment of the invention, and semiconductor devices produced therefrom, are also provided.
Abstract:
Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided. Antireflectivehardmask compositions of the invention include: (a) a polymer component including at least one polymer having a monomeric unit of Formula (I) described in this specification; (b) a crosslinking component; and (c) an acid catalyst.
Abstract:
A hardmask composition having antireflective properties is provided. The hardmask composition is suitable for lithography and provides excellent optical properties and mechanical properties. In addition, the hardmask composition can be readily applied by spin-on application techniques. Particularly, the composition is highly resistant to dry etching. Therefore, the composition can be used to provide a multilayer thin film that is capable of being patterned with a high aspect ratio. Further provided is a method for forming a pattern using the composition.
Abstract:
Provided herein are hardmask compositions for resist underlayer films, wherein according to some embodiments of the invention, hardmask compositions include a polymer prepared by the reaction of a compound of Formula 1 with a compound of Formula 2 in the presence of a catalyst, whereinisa monovalent organic group, n is an integer from 3 to 20, and m is 1 or 2; and an organic solvent. Also provided herein are methods for producing a semiconductor integrated circuit device using a hardmask composition according to an embodiment of the invention. Further provided are semiconductor integrated circuit devices produced by a method embodiment of the invention.
Abstract:
Provided is a hardmask composition having antireflective properties that is suitable for lithography. The hardmask composition provides excellent characteristics in terms of optical properties and mechanical properties. In addition, the composition can be readily applied by spin-on application techniques. Particularly, the composition is highly resistant to dry etching. Therefore, the composition can be used to provide a multilayer thin film that is patterned with high aspect ratio. Further provided is a method for forming a pattern using the composition.
Abstract:
Disclosed is a hardmask composition having antireflective properties useful for a lithographic process. The hardmask composition provides excellent optical properties, superior mechanical properties and high etch selectivity. In addition, the hardmask composition can be easily applied by a spin-on coating technique. Advantageously, the hardmask composition is suitable for a short- wavelength lithographic process and has a minimum residual acid content.