公开(公告)号：WO2012044061A3

公开(公告)日：2012-05-31

申请号：PCT/KR2011007141

申请日：2011-09-28

Applicant: INTEKPLUS CO LTD ,  KANG MIN-GU ,  KU JA-CHUL ,  LEE SANG-YOON ,  LIM SSANG-GUN

Inventor： KANG MIN-GU ,  KU JA-CHUL ,  LEE SANG-YOON ,  LIM SSANG-GUN

IPC: G06T1/60 ,  H04N5/77

CPC classification number: G06F3/005 ,  G06T1/60 ,  H04N5/765

Abstract: The present invention provides a method for transmitting and receiving image data at a high speed and a device for implementing the method, wherein the method comprises the steps of: sequentially transmitting image data, which is outputted from an image sensor, through one or more transmission channels at a speed that is suitable for bandwidths of the transmission channels; and sequentially recording, in a frame store, the image data that is received through the one or more transmission channels at a speed which corresponds to the entire bandwidth that has been formed by adding up the bandwidths of each of the one or more transmission channels.

Abstract translation: 本发明提供了一种用于高速发送和接收图像数据的方法以及用于实现该方法的装置，其中该方法包括以下步骤：从图像传感器输出通过一个或多个传输的图像数据 信道以适合于传输信道的带宽的速度; 并且以帧存储顺序地以与通过相加所述一个或多个传输信道中的每一个的带宽相对应的整个带宽的速度通过所述一个或多个传输信道接收的图像数据。

公开(公告)号：WO2011081360A2

公开(公告)日：2011-07-07

申请号：PCT/KR2010009281

申请日：2010-12-23

Applicant: POSCO ,  KIM DONG-HYUN ,  LEE YOU-HWAN ,  LEE SANG-YOON ,  CHO HYUNG-KEUN

Inventor： KIM DONG-HYUN ,  LEE YOU-HWAN ,  LEE SANG-YOON ,  CHO HYUNG-KEUN

IPC: C21D8/06 ,  C22C38/00 ,  C22C38/12

CPC classification number: C22C38/12 ,  C21D8/065 ,  C21D9/0093 ,  C22C38/02 ,  C22C38/04

Abstract: An ultra-high-strength steel wire rod having excellent resistance to delayed fracture includes, by wt%, 0.7-1.2% C, 0.25-0.5% Si, 0.5-0.8% Mn, 0.02-0.1% V and a balance of Fe and inevitable impurities.

Abstract translation: 具有优异的延迟断裂性的超高强度钢线材包括：重量％，0.7-1.2％C，0.25-0.5％Si，0.5-0.8％Mn，0.02-0.1％V，余量为Fe和 不可避免的杂质。

公开(公告)号：WO2007046629A1

公开(公告)日：2007-04-26

申请号：PCT/KR2006/004229

申请日：2006-10-18

Applicant: INTEKPLUS CO., LTD. ,  KANG, Min-gu ,  LEE, Hyun-min ,  SONG, Kyung-soo ,  LEE, Sang-yoon ,  LIM, Ssang-gun

Inventor： KANG, Min-gu ,  LEE, Hyun-min ,  SONG, Kyung-soo ,  LEE, Sang-yoon ,  LIM, Ssang-gun

IPC: H01L21/66

CPC classification number: H01L22/20

Abstract: Disclosed is a semiconductor package sorting method for improving sorting speed and yield of semiconductor packages. The method comprises performing a vision inspection on a tray, transferring the tray to a buffer unit, shifting defective products to a defective product tray, performing a vision inspection on a tray, transferring the tray to an unloading unit, determining whether defective products are found among semiconductor packages, if it is determined that the unloading tray receives defective products, shifting the defective products to the defective product tray and shifting normal products to fill the unloading tray, if a vision inspection for a last tray of a lot is completed, shifting the defective products to the defective product tray, discharging the defective product tray into a defective product storage unit, and if the re-inspection is determined, performing a defective product re-inspection simultaneously with arrangement of the normal products.

Abstract translation: 公开了一种用于提高半导体封装的分选速度和产量的半导体封装分选方法。 该方法包括在托盘上执行视觉检查，将托盘传送到缓冲单元，将有缺陷的产品转移到有缺陷的产品托盘，对托盘进行视觉检查，将托盘传送到卸载单元，确定是否找到有缺陷的产品 在半导体封装中，如果确定卸载托盘接收到不良产品，则将缺陷产品转移到有缺陷的产品托盘并移动正常产品以填充卸载托盘，如果批次的最后托盘的视觉检查完成，则移位 有缺陷的产品到缺陷产品托盘，将有缺陷的产品托盘排放到有缺陷的产品存储单元中，并且如果确定了重新检查，则与正常产品的布置同时进行缺陷产品重新检查。

公开(公告)号：WO2006132485A1

公开(公告)日：2006-12-14

申请号：PCT/KR2006/002154

申请日：2006-06-05

Applicant: INTEKPLUS CO., LTD. ,  LEE, Sang-yoon ,  KANG, Min-gu ,  KIM, Il-nam ,  LEE, Hyun-min ,  LIM, Ssang-gun

Inventor： LEE, Sang-yoon ,  KANG, Min-gu ,  KIM, Il-nam ,  LEE, Hyun-min ,  LIM, Ssang-gun

IPC: H01L21/66

CPC classification number: G06T7/001 ,  G06T2207/30148 ,  H01L22/20 ,  H01L2924/014

Abstract: A method for inspecting a semiconductor device is disclosed, which increases the accuracy of an external- defect inspection capable of determining whether balls or PCBs (Printed Circuit Boards) of the semiconductor device have external defects. The method for inspecting the semiconductor device to determine whether a defect occurs in a ball grid array contained in a PCB via an image captured by a camera includes the steps of: a) capturing an image of the semiconductor device to allow a circumference of each ball contained in the semiconductor device to be displayed in white, and acquiring falling-illumination image information from the captured image; b) capturing an image of the semiconductor device to allow a center part of each ball contained in the semiconductor device to be displayed in white, and acquiring coaxial image information from the captured image; c) subtracting the coaxial image information from the falling-illumination image information, and acquiring ring-shaped image information; and d) comparing the ring- shaped image information with reference image information, and determining whether the ball is defective according to the comparison result.

Abstract translation: 公开了一种用于检查半导体器件的方法，其增加了能够确定半导体器件的球或PCB（印刷电路板）是否具有外部缺陷的外部缺陷检查的精度。 用于通过照相机拍摄的图像检查半导体器件以确定在PCB中包含的球栅阵列中是否发生缺陷的方法包括以下步骤：a）捕获半导体器件的图像以允许每个球的圆周 包含在半导体装置中以白色显示，并从捕获图像获取落下照明图像信息; b）捕获半导体器件的图像，以允许包含在半导体器件中的每个球的中心部分以白色显示，并从捕获的图像获取同轴图像信息; c）从所述降落照明图像信息中减去所述同轴图像信息，并获取环形图像信息; 以及d）将环形图像信息与参考图像信息进行比较，并且根据比较结果确定球是否有缺陷。

公开(公告)号：WO2003056623A1

公开(公告)日：2003-07-10

申请号：PCT/KR2002/002420

申请日：2002-12-24

Applicant: INTEK PLUS CO., LTD. ,  LIM, Ssang-Gun ,  LEE, Sang-Yoon

Inventor： LIM, Ssang-Gun ,  LEE, Sang-Yoon

IPC: H01L21/58

CPC classification number: G01R1/0408 ,  G01R31/01 ,  H05K13/022

Abstract: Disclosed are a method and apparatus for simultaneously inspecting and packaging chips, the method comprising a first step for advancing a film having a plurality of chip receiving recesses thereon from a film supplying roll to a film recovery roll by a step movement, inserting an uninspected chip into the chip receiving recess of the film, inspecting the chip passing under a three dimensional measuring probe by the three dimensional measuring probe, and replacing the inspected chip with a new chip by a robot arm when the probe determines that the inspected chip is abnormal, and a second step for attaching a tape onto the film to close an opening of the chip receiving recess having a normal chips therein after the first step is performed.

Abstract translation: 公开了一种用于同时检查和包装芯片的方法和装置，该方法包括第一步骤，用于通过步进运动将具有多个芯片接收凹部的膜从薄膜供应辊推送到薄膜恢复辊，将未预期的芯片 进入薄膜的芯片接收凹部，通过三维测量探头检查在三维测量探针下通过的芯片，并且当探针确定被检查的芯片异常时，用机器人手臂用新的芯片替换被检查的芯片， 以及第二步骤，用于在执行第一步骤之后，将胶带附着到胶片上以封闭其中具有普通芯片的芯片容纳凹部的开口。

公开(公告)号：WO2011016676A2

公开(公告)日：2011-02-10

申请号：PCT/KR2010/005117

申请日：2010-08-04

Applicant: POSCO ,  LEE, You-Hwan ,  KIM, Dong-Hyun ,  LEE, Sang-Yoon ,  KIM, Ha-Ni ,  PARK, Yong-Sik

Inventor： LEE, You-Hwan ,  KIM, Dong-Hyun ,  LEE, Sang-Yoon ,  KIM, Ha-Ni ,  PARK, Yong-Sik

IPC: C22C38/04 ,  C21D8/06

CPC classification number: C22C38/02 ,  C21D8/021 ,  C21D8/0263 ,  C21D8/06 ,  C21D2211/005 ,  C21D2211/009 ,  C22C38/04

Abstract: There is provided a rolled steel with excellent toughness, a drawn wire rod prepared by drawing the rolled steel, and a method for manufacturing the same, in which even if a heating step is omitted, the toughness of the steel can be improved by securing a de-generated pearlite structure in an internal structure of the rolled steel by controlling a content of Mn among components and cooling conditions, and then preventing C diffusion. The rolled steel according to the present invention includes C: 0.15~0.30 %, Si: 0.1~0.2 %, Mn: 1.8~3.0 %, P: 0.035 % or less, S: 0.040 % or less, the remainder Fe, and other inevitable impurites, as a percentage of weight, in which the microstucture of the rolled steel is composed of ferrite and pearlite including cementite with 150 nm or less of thickness.

Abstract translation: 提供了具有优异韧性的轧制钢，通过拉制轧制钢制备的拉丝线及其制造方法，其中即使省略加热步骤，也可以通过确保钢的韧性来提高钢的韧性 通过控制成分中的Mn含量和冷却条件，在轧制钢的内部结构中去除珠光体组织，然后防止C扩散。 根据本发明的轧制钢包括C：0.15〜0.30％，Si：0.1〜0.2％，Mn：1.8〜3.0％，P：0.035％以下，S：0.040％以下，剩余部分Fe等 不可避免的杂质，重量的百分比，其中轧制钢的微结构由铁素体和珠光体组成，包括厚度在150nm以下的渗碳体。

公开(公告)号：WO2007043762A1

公开(公告)日：2007-04-19

申请号：PCT/KR2006/003941

申请日：2006-09-29

Applicant: KOREA ATOMIC ENERGY RESEARCH INSTITUTE ,  KOREA HYDRO & NUCLEAR POWER CO., LTD ,  LEE, Tae Hoon ,  KIM, Ho Dong ,  KO, Won Il ,  SONG, Dae Yong ,  JEONG, Joong Hwan ,  LEE, Sang Yoon

Inventor： LEE, Tae Hoon ,  KIM, Ho Dong ,  KO, Won Il ,  SONG, Dae Yong ,  JEONG, Joong Hwan ,  LEE, Sang Yoon

IPC: G21K1/00

CPC classification number: G01T3/00 ,  G01T7/02

Abstract: A neutron coincidence counter for non-destructive accounting for a nuclear material according to the present invention comprises an outer case, neutron detectors mounted in the outer case while being surrounded by a moderator, and a basket horizontally movable in the outer case so as to be exposed outside the outer case and having a cavity for receiving a sample container therein. Further, a neutron coincidence counter for non-destructive accounting for a nuclear material according to the present invention comprises an outer case, neutron detectors mounted in the outer case while being surrounded by a moderator, a basket movable in the outer case so as to be exposed outside the outer case and having a cavity for receiving a sample container therein, and an external signal analyzer connected to the detectors through an electrically conductive path. Moreover, at least one facile connector of one-touch connection type is mounted on the electrically conductive path for connecting the detectors to the external signal analyzer, resulting in free removal and replacement of wires connected to the connector.

Abstract translation: 根据本发明的用于核材料的非破坏性核算的中子重合计数器包括外壳，安装在外壳中并由主体包围的中子探测器和可在外壳中水平移动的篮状物 暴露在外壳外部并且具有用于在其中接收样品容器的空腔。 此外，根据本发明的用于核材料的非破坏性核算的中子重合计数器包括外壳，安装在外壳中同时由调节器包围的中子探测器，可在外壳中移动的篮状物 暴露在外壳外部并且具有用于在其中接收样品容器的空腔和通过导电路径连接到检测器的外部信号分析器。 此外，至少一个轻触式连接器的简单连接器安装在导电路径上，用于将检测器连接到外部信号分析仪，从而免除了去除和更换连接到连接器的电线。

公开(公告)号：WO2006132490A1

公开(公告)日：2006-12-14

申请号：PCT/KR2006/002173

申请日：2006-06-07

Applicant: INTEKPLUS CO., LTD. ,  LEE, Sang-yoon ,  CHOI, Yi-bae ,  KANG, Min-gu ,  LIM, Ssang-gun

Inventor： LEE, Sang-yoon ,  CHOI, Yi-bae ,  KANG, Min-gu ,  LIM, Ssang-gun

IPC: G01R31/26

CPC classification number: G01R31/2896

Abstract: The present invention relates to an apparatus and a method for inspecting external appearances of semiconductor packages, and more particularly to an in-tray apparatus for inspecting semiconductor packages to reduce the inspection time of the semiconductor packages in trays according to the semiconductor packages during the in-tray inspection and to minimize interference of shadow due to projected light beam so that efficiency and reliability are improved. The apparatus includes first and second vision probes on transfer paths of a tray accommodating semiconductor packages, and a central controller comparing image information obtained by the vision probes with reference image information about a semiconductor package in a corresponding lot to analyze and determine whether or not the semiconductor package is inferior. The first vision probe is aligned with rails on which the tray is transferred, and the second vision probe is arranged at a predetermined angle to the first vision probe.

Abstract translation: 本发明涉及一种用于检查半导体封装的外观的装置和方法，更具体地涉及一种用于检查半导体封装的托盘内装置，以减少在半导体封装期间根据半导体封装的托盘中的半导体封装在托盘中的检查时间 并且最小化由于投影光束引起的阴影的干扰，从而提高效率和可靠性。 该装置包括在容纳半导体封装的托盘的传送路径上的第一和第二视觉探针，以及将视觉探针获得的图像信息与相应批次中的半导体封装的参考图像信息进行比较的中央控制器，以分析和确定 半导体封装较差。 第一视觉探针与传送托盘的轨道对准，并且第二视觉探针以与第一视觉探针成预定角度排列。

公开(公告)号：WO2006132489A1

公开(公告)日：2006-12-14

申请号：PCT/KR2006/002171

申请日：2006-06-07

Applicant: INTEKPLUS CO., LTD. ,  LEE, Sang-yoon ,  LIM, Ssang-gun

Inventor： LEE, Sang-yoon ,  LIM, Ssang-gun

IPC: H01L21/66

CPC classification number: H01L22/20 ,  H01L2924/014

Abstract: The present invention relates to a method of inspecting new types semiconductor devices with other device on standby while continuing conventional lot end sorting of semiconductor devices so that inspection efficiency of an external appearance of the semiconductor device can be enhanced. The method includes determining whether the object is inferior by transferring a tray accommodating objects from a loading unit and comparing image information obtained by the vision camera with stored image information of a corresponding object, sorting and discharging the objects according to the determination, performing a lot end sorting by unloading normal objects in a buffer tray when the sorting of all objects in a corresponding lot is finished, and performing the inspection of objects in a new lot while the lot end sorting of the existing lot is performed when a predetermined signal of the objects in the new lot is inputted during the lot end sorting.

Abstract translation: 本发明涉及一种在继续进行半导体器件的常规批次结束分类的同时对待其他器件的新型半导体器件进行检查的方法，从而可以提高半导体器件外观的检查效率。 该方法包括通过从装载单元传送容纳物体的托盘来确定物体是否较差，并且将由视觉摄像机获得的图像信息与存储的对应物体的图像信息进行比较，根据该确定对物体进行排序和排出，执行许多 当相应批次中的所有对象的分类完成时，通过卸载缓冲托盘中的正常对象来完成排序，并且当现有批次的批量结束排序执行时，执行新批次中的对象的检查， 在批次结束排序期间输入新批次中的对象。

公开(公告)号：WO2011037403A2

公开(公告)日：2011-03-31

申请号：PCT/KR2010006496

申请日：2010-09-20

Applicant: POSCO ,  LEE SANG-YOON ,  KWON JUNG-SEOK ,  KIM DONG-HYUN ,  KIM JOON-YOUNG ,  LEE YOU-HWAN

Inventor： LEE SANG-YOON ,  KWON JUNG-SEOK ,  KIM DONG-HYUN ,  KIM JOON-YOUNG ,  LEE YOU-HWAN

IPC: C21D8/06 ,  C22C38/00 ,  C22C38/02

CPC classification number: C22C38/02 ,  C21D6/005 ,  C21D8/06 ,  C21D9/52 ,  C21D9/525 ,  C22C38/04

Abstract: Provided are a method for manufacturing a high-carbon soft wire rod which omits softening treatment and a wire rod manufactured thereby, and the method comprises the steps of: austenitizing a billet including 0.7-1.5 weight% of C, 0.005-2.0 weight% of Si, 0.2-1.5 weight% of Mn, 0.03 weight% or less of Al, 0.02 weight% or less of P, 0.02 weight% or less of S, and the remaining weight percent of Fe and necessary impurities at the temperature of A3 or more; performing a finish-rolling process at A1 to A1+80°C; and cooling the rolled wire rod to A1-50°C to A1-100°C at the cooling speed of 0.03°C/s.

Abstract translation: 本发明提供一种省略软化处理的高碳软线材及其制造的线材的制造方法，其特征在于，包括以下步骤：将含有0.7〜1.5重量％的C，0.005〜2.0重量％的C， Si，0.2〜1.5重量％的Mn，0.03重量％以下的Al，0.02重量％以下的P，0.02重量％以下的S，剩余重量百分比的Fe和必需的杂质在A3或 更多; 在A1〜A1 + 80℃进行精轧工序; 并以0.03℃/ s的冷却速度将轧制线材冷却至A1-50℃至A1-100℃。