公开(公告)号：WO2012095757A1

公开(公告)日：2012-07-19

申请号：PCT/IB2012/050035

申请日：2012-01-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  IBM (China) Investment Company Limited ,  BODAY, Dylan ,  KUCZYNSKI, Joseph ,  MEYER III, Robert

Inventor： BODAY, Dylan ,  KUCZYNSKI, Joseph ,  MEYER III, Robert

IPC: H01L23/40 ,  H01L23/373 ,  H05K7/20 ,  C08L83/04

CPC classification number: C09K5/14 ,  B32B7/12 ,  B32B2405/00 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  Y10T428/31663 ,  H01L2924/00

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally- reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9 x 10 11 ohm-cm or more.

Abstract translation: 本发明涉及用于电子部件的可逆粘合的热界面材料及其制造和使用方法。 更具体地，本发明的实施例提供了热界面材料，其包括热可逆粘合剂和导热和不导电的填料，其中热界面材料的特征在于导热率为0.2W / mK以上， 电阻率为9×1011 ohm-cm以上。