公开(公告)号：WO2002089525A3

公开(公告)日：2002-11-07

申请号：PCT/US2002/013081

申请日：2002-04-26

Applicant: VIRGINIA COMMONWEALTH UNIVERSITY ,  LENHARDT, Martin ,  RICHARDS, Douglas

Inventor： LENHARDT, Martin ,  RICHARDS, Douglas

IPC: H04R25/00

Abstract: There is provided hearing device (140) improvements using modulation techniques adapted to the characteristics of auditory and vestibular hearing. One embodiment provides for extending hearing to the infrasonic range and applying them to a carrier in the ultrasonic "quiet zone". Further extension of hearing into the ultrasonic range is provided by a modulation scheme which uses a fluid conduction coupler (720) to match impedance for a vibration transducer applied to the skin. A variation on this embodiment integrates this ultrasonic hearing extension with normal acoustic headphones. Another embodiment compensates for high frequency hearing loss by a modulation scheme which uses middle ear resonance as an amplifier. A further embodiment combines ultrasonic transposition (115) with wireless modulation to obtain secure communication.

公开(公告)号：WO02089525A2

公开(公告)日：2002-11-07

申请号：PCT/US0213081

申请日：2002-04-26

Applicant: UNIV VIRGINIA COMMONWEALTH ,  LENHARDT MARTIN ,  RICHARDS DOUGLAS

Inventor： LENHARDT MARTIN ,  RICHARDS DOUGLAS

IPC: H04R25/00

CPC classification number: H04R25/353 ,  H04R2460/13

Abstract: There is provided hearing device (140) improvements using modulation techniques adapted to the characteristics of auditory and vestibular hearing. One embodiment provides for extending hearing to the infrasonic range and applying them to a carrier in the ultrasonic "quiet zone". Further extension of hearing into the ultrasonic range is provided by a modulation scheme which uses a fluid conduction coupler to match impedance for a vibration transducer applied to the skin. A variation on this embodiment integrates this ultrasonic hearing extension with normal acoustic headphones. Another embodiment compensates for high frequency hearing loss by a modulation scheme which uses middle ear resonance as an amplifier. A further embodiment combines ultrasonic transposition with wireless modulation to obtain secure communication.

Abstract translation: 提供了使用适应于听觉和前庭听觉特征的调制技术的听力设备（140）的改进。 一个实施例提供将听觉延伸到超声波范围并将其应用于超声波“安静区”中的载体。 通过使用流体传导耦合器来匹配施加到皮肤的振动传感器的阻抗的调制方案来提供进一步将听力扩展到超声波范围内。 该实施例的变型将该超声听力扩展与普通声学耳机相结合。 另一个实施例通过使用中耳共振作为放大器的调制方案来补偿高频听力损失。 另一实施例将超声波转置与无线调制组合以获得安全通信。

公开(公告)号：WO2008085681A3

公开(公告)日：2008-10-09

申请号：PCT/US2007088138

申请日：2007-12-19

Applicant: APPLIED MATERIALS INC ,  LESTER PAUL E ,  MEYER SCOTT ,  ATKINS WYLAND L ,  RICHARDS DOUGLAS ,  PREDOAICA CONSTANTIN ,  HUDGENS JEFFREY C ,  CARLSON CHARLES ,  KANKANALA PENCHALA N ,  RICE MICHAEL R ,  PAPANU JAMES S ,  BAIYA EVANSON G ,  ROSATO JOHN J

Inventor： LESTER PAUL E ,  MEYER SCOTT ,  ATKINS WYLAND L ,  RICHARDS DOUGLAS ,  PREDOAICA CONSTANTIN ,  HUDGENS JEFFREY C ,  CARLSON CHARLES ,  KANKANALA PENCHALA N ,  RICE MICHAEL R ,  PAPANU JAMES S ,  BAIYA EVANSON G ,  ROSATO JOHN J

IPC: B08B3/00

CPC classification number: H01L21/67766 ,  H01L21/67051 ,  H01L21/68707 ,  Y10S134/902

Abstract: The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Abstract translation: 本发明通常提供了一种在多室处理系统中处理和传送基板的装置和方法，该多室处理系统具有在使用批处理的许多有利方面的同时并行执行的单个基板处理步骤的能力。 本文描述的本发明的实施例适用于最大化系统吞吐量，降低系统成本，在处理期间降低每个基板的成本，增加系统可靠性，提高处理的基板上的装置产量，并减少系统占用面积。 在一个实施例中，群集工具适于执行湿/清洁处理序列，其中在群集工具中的基板上执行各种基板清洁处理。

公开(公告)号：WO2008085681A2

公开(公告)日：2008-07-17

申请号：PCT/US2007/088138

申请日：2007-12-19

Applicant: APPLIED MATERIALS, INC. ,  LESTER, Paul E. ,  MEYER, Scott ,  ATKINS, Wyland L. ,  RICHARDS, Douglas ,  PREDOAICA, Constantin ,  HUDGENS, Jeffrey C. ,  CARLSON, Charles ,  KANKANALA, Penchala N. ,  RICE, Michael R. ,  PAPANU, James S. ,  BAIYA, Evanson G. ,  ROSATO, John J.

Inventor： LESTER, Paul E. ,  MEYER, Scott ,  ATKINS, Wyland L. ,  RICHARDS, Douglas ,  PREDOAICA, Constantin ,  HUDGENS, Jeffrey C. ,  CARLSON, Charles ,  KANKANALA, Penchala N. ,  RICE, Michael R. ,  PAPANU, James S. ,  BAIYA, Evanson G. ,  ROSATO, John J.

IPC: H01L21/67

CPC classification number: H01L21/67766 ,  H01L21/67051 ,  H01L21/68707 ,  Y10S134/902

Abstract: The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Abstract translation: 本发明总体上提供了一种用于在多腔室处理系统中处理和传送基板的设备和方法，该系统具有接收并执行并行执行的单个基板处理步骤的能力，同时使用多个有利的 批处理方面。 本文描述的本发明的实施例适合于最大化系统吞吐量，降低系统成本，降低处理期间每个衬底的成本，增加系统可靠性，改进处理衬底上的器件产量，并减少系统占板面积。 在一个实施例中，群集工具适于执行湿/清洁处理序列，其中在群集工具中的衬底上执行各种衬底清洁处理。