Abstract:
A low voltage isolation switch (1) is described, inserted between an input terminal (HVout) suitable for receiving a high voltage signal (IM) and an output terminal (pzt) suitable for transmitting this high voltage signal (IM) to a load (PZ) of the type comprising at least one driving block (5) being inserted between a first and a second voltage reference (Vss, -Vss) and comprising a first driving transistor (M1), inserted, in series to a first driving diode (D1), between the first voltage reference (Vss) and a first driving central circuit node (Xd) and a second driving transistor (M2), in turn inserted, in series with a second driving diode (D2), between the driving central circuit node (Xd) and the second supply voltage reference (-Vss) as well as a control transistor (MD) connected across a diode block (7) comprising at least one first and one second transmission diode (DN1, DN2), connected in antiparallel, i.e. by having the anode terminal of the first diode connected to the cathode terminal of the second one and vice versa, between the input (HVout) and output (pzt) terminals of the low voltage isolation switch (1), this control transistor (MD) having a control terminal connected to the driving central circuit node (Xd) through a low voltage decoupling block (6), in turn inserted between a first and a second substrate terminal (SS1, SS2) and also comprising a first and a second parasite capacitive element (Par1, Par2) connected to these first and second substrate terminals (SS1, SS2) as well as comprising at least one first decoupling transistor (M3) and one second decoupling transistor inserted (M4), being in parallel to each other and having control terminals connected to the first and second parasite capacitive elements (Par1, Par2), respectively.
Abstract:
It is described a driving circuit (1) having at least one output terminal (OUT) connected to an ultrasonic pulse generator circuit and providing thereto with an output voltage (Vout), characterized in that it comprises at least one first portion (2A) connected to a first voltage reference (VPH) and including at least one first output transistor (MOP) being inserted between the first voltage reference (VPH) and the output terminal (OUT), such a first portion (2A) further comprising: at least one first high voltage comparator (3A) being connected to said output terminal (OUT) and to a first threshold voltage reference (VTHP), at least one first start-up circuit (4A) being controlled by a first setting signal (SETP); at least one first switching ON /OFF circuit (5A) being connected at its input to the first start-up circuit (4A), in correspondence with a first internal circuit node (XP), and to the first high voltage comparator (3A), in correspondence with a second internal circuit node (YP), and at its output to a control terminal of the first output transistor (MOP); the first start-up circuit (4A) providing a switching on signal (ONA) to the first switching on/ off circuit (5A) while the high voltage comparator (3A) provides a switching off signal (OFFA) to the first switching on/ off circuit (5A) which causes the switching off of the output transistor (MOP), the high voltage comparator (3A) generating the switching off signal (OFFA) when the output voltage (Vout) reaches a first desired supply voltage value which depends on the value of the first threshold voltage reference (VTHP).
Abstract:
In a pressure sensor (35), a pressure-sensor element (10) has a monolithic body (12) of semiconductor material, and a first main face (12a) and a second main face (12b) acting on which is a stress resulting from a pressure (P) the value of which is to be determined; and a package (36) encloses the pressure-sensor element (10). The package (36) has an inner chamber (37) containing liquid material (38), and the pressure-sensor element (10) is arranged within the inner chamber (37) in such a manner that the first and second main faces (12a, 12b) are both in contact with the liquid material (38). In particular, the liquid material is a silicone gel.
Abstract:
The invention relates to a driving method for obtaining a linear gain variation of a transconductance amplifier, of the type comprising at least one differential transistor cell, with adjustment of a driving voltage value (Vtgc1) of a degenerative driving transistor (MD1) of said transconductance amplifier, comprising the steps of : generating an output current signal of a differential cell (11) being a copy of said differential transistor cell of said transconductance amplifier, said output current signal having a linear relationship with a transconductance value of said copy differential cell (11) as said driving voltage (Vtgc1) varies; generating a reference current signal having a linear relationship with a differential input voltage; comparing said output current signal and said reference current signal for adjusting said driving voltage value (Vtgc1) and modifying said transconductance value of said copy differential cell (11) up to a balance of said current signals.
Abstract:
An electrostatic micromotor (10') is provided with a fixed substrate (12), a mobile substrate (13) facing the fixed substrate (12), and electrostatic-interaction elements (14, 15, 17) enabling a relative movement of the mobile substrate (3) with respect to the fixed substrate (2) in a movement direction (x); the electrostatic micromotor is also provided with a capacitive position-sensing structure (18') configured to enable sensing of a relative position of the mobile substrate (13) with respect to the fixed substrate (12) in the movement direction (x). The capacitive position-sensing structure (18') is formed by at least one sensing indentation (22), extending within the mobile substrate (13) from a first surface (13a; 13b) thereof, and by at least one first sensing electrode (24), facing, in at least one given operating condition, the sensing indentation (22).
Abstract:
A transmission channel (1) is described of the type comprising at least one high voltage buffer block (4) comprising buffer transistors (MB1, MB2, MB3, MB4) and respective buffer diodes (DB1, DB2, DB3, DB4), being inserted between respective voltage references (HVPO, HVP1, HVMO, HVM1), these buffer transistors (MB1, MB2, MB3, MB4) being also connected to a clamping block (5), in turn comprising clamping transistors (MC1, MC2) connected to at least one output terminal (HVout) of this transmission channel through diodes (DC1, DC2) connected to prevent the body diodes of the clamping transistors (MC1, MC2) from conducting. Advantageously according to the invention, the transmission channel (1) comprises at least one reset circuit (20) comprising diodes (DME1, DME2, DME3, DME4) and being inserted between circuit nodes (XME1, XME2, XME3, XME4, XC1, XC2) of the high voltage buffer block (4) and of the clamping block (5), these circuit nodes (XME1, XME2, XME3, XME4, XC1, XC2) being in correspondence with conduction terminals of the transistors (MB l, MB2, MB3, MB4; MC1, MC2) comprised into the high voltage buffer block (4) and into the clamping block (5).
Abstract:
In a pressure sensor (35) , a pressure-sensor element (10) has a monolithic body (12) of semiconductor material, and a first main face (12a) and a second main face (12b) acting on which is a stress resulting from a pressure (P) the value of which is to be determined; and a package (36) encloses the pressuresensor element (10) . The package (36) has an inner chamber (37) containing liquid material (38), and the -ores sure-sensor element (10) is arranged within the inner chamber (37) in such a manner that the first and second main faces (12a, 12b) are both in contact with the liquid material (38). In particular, the liquid material is a silicone gel.
Abstract:
In an integrated pressure sensor (15) with a high full-scale value, a monolithic body (16) of semiconductor material has a first and a second main surface (16a and 16b), opposite and separated by a substantially uniform distance (w). The monolithic body (16) has a bulk region (17), having a sensitive portion (23) next to the first main surface (16a), upon which pressure (P) acts. A first piezoresistive detection element (18) is integrated in the sensitive portion (23) and has a variable resistance as a function of the pressure (P). The bulk region (17) is a solid and compact region and has a thickness substantially equal to the distance (w).
Abstract:
A low voltage isolation circuit (1) is described inserted between a connection node (HVout) to a matrix (2) of switches suitable for receiving a high voltage signal (IM) and a connection terminal (pzt) to a load (PZ) suitable for transmitting said high voltage signal (IM) to said load (PZ) of the type comprising at least one driving block (5) inserted between a first and a second voltage reference (Vss, - Vss) and comprising at least a first driving transistor (M l), inserted, in series with a first driving diode (Dl), between the first voltage reference (Vss) and a first driving central circuit node (Xc) and a second driving transistor (M2), in turn inserted, in series with a second diode (D2), between the driving central circuit node (Xc) and the second supply voltage reference (-Vss). The switch comprises an isolation block (8) connected to the connection terminal (pzt), to the connection node (HVout) and to the driving central circuit node (Xc) and comprising at least one voltage limiter block (6), a diode block (7) and a control transistor (MD), in turn connected across the diode block (7) between the connection node (HVout) to the matrix (2) of switches and the connection terminal (pzt) to the load (PZ) of the low voltage isolation switch (1) and having a control terminal (XD) connected to the driving central circuit node (Xc).
Abstract:
A transmission channel (1) is described comprising at least one high voltage buffer block (4) comprising buffer transistors (MB1, MB2, MB3, MB4) and respective buffer diodes (DB1, DB2, DB3, DB4), being inserted between respective voltage references (HVP0, HVP1, HVM0, HVM1), a clamping circuit (10) being connected to a first output terminal (HVout) of the transmission channel (1), an antinoise block (6) being connected between the first output terminal (HVout) and a connection terminal (Xdcr) of the transmission channel (1); as well as a switching circuit (30) being inserted between the connection terminal (Xdcr) and a second output terminal (LVout) of the transmission channel (1). Advantageously according to the invention, the clamping circuit (10) comprises a clamping core (11), a reset circuit (20) comprising diodes (DME1, DME2, DME3, DME4 ) inserted between circuit nodes (XME1, XME2, XME3, XME4, XC1, XC2) of the high voltage buffer block (4) and of the clamping circuit (10), the circuit nodes (XME1, XME2, XME3, XME4, XC1, XC2 ) being in correspondance with conduction terminals of said transistors (MB1,MB2,MB3,MB4,MC1,MC2) comprised into the high voltage buffer block(4) and into the clamping circuit (10), and a switching circuit (30).