公开(公告)号：WO2008076080A3

公开(公告)日：2008-11-06

申请号：PCT/SG2007000397

申请日：2007-11-16

Applicant: ROKKO TECHNOLOGY PTE LTD ,  SHEN XUE FANG ,  ZHANG JING ,  LING NEE SENG ,  ANG SOO LOO

Inventor： SHEN XUE FANG ,  ZHANG JING ,  LING NEE SENG ,  ANG SOO LOO

IPC: H01L23/495 ,  B23K20/00 ,  H01L21/48 ,  H01L21/687

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/7825 ,  H01L2224/78703 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A clamping assembly (1 ) for clamping a lead frame (7) with pre-attached semiconductor device, comprising of: a first member (2) to hold the lead frame (7), said first member (2) having a surface profile in contact with a surface profile of the semiconductor device, a second member (3)for allowing the mounting of the first member (2) thereon, an attachment means to secure the first member (2) onto the second member (3), wherein the attachment means is adjustable to conform the surface profile of the first member (2) to the surface profile of the lead frame (7).

Abstract translation: 一种用于用预固定的半导体器件夹紧引线框架（7）的夹紧组件（1），包括：用于保持引线框架（7）的第一构件（2），所述第一构件（2）具有表面轮廓 与半导体器件的表面轮廓接触，用于允许第一部件（2）在其上的安装的第二部件（3），用于将第一部件（2）固定到第二部件（3）上的连接装置，其中 附接装置可调节以使第一构件（2）的表面轮廓与引线框架（7）的表面轮廓一致。

公开(公告)号：WO2011037543A1

公开(公告)日：2011-03-31

申请号：PCT/SG2010/000360

申请日：2010-09-24

Applicant: ROKKO TECHNOLOGY PTE LTD. ,  YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

Inventor： YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

IPC: H01L21/78 ,  H01L21/677 ,  B21D28/00 ,  H01L21/68

CPC classification number: H01L21/67092 ,  H01L21/67132 ,  Y10T83/647 ,  Y10T83/6572

Abstract: A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.

Abstract translation: 一种用于分离IC单元的冲压系统，包括：冲压组件，布置成接收衬底并将所述衬底分离成IC单元; 旋转载体，可从第一位置旋转到第二位置，所述旋转载体布置成在第一位置处接收所述单元，并通过旋转将所述单元运送到第二位置; 其中所述旋转载体包括用于容纳所述单元的至少一部分的凹部。 一种冲压组件，其包括具有用于接收可选择性地替换的插入件的凹部的模具块，其中所述插入件对应于特定于预定IC封装布置的冲压模式。

公开(公告)号：WO2010101531A1

公开(公告)日：2010-09-10

申请号：PCT/SG2010/000075

申请日：2010-03-04

Applicant: ROKKO TECHNOLOGY PTE LTD. ,  SHEN, Xue, Fang ,  ZHANG, Jing

Inventor： SHEN, Xue, Fang ,  ZHANG, Jing

IPC: H01L21/78 ,  B21D28/00

CPC classification number: B21D28/06 ,  H01L21/78 ,  Y10T83/8878 ,  Y10T83/9423

Abstract: A punch and die assembly for singulating an IC unit from a substrate, the assembly comprising an array of punches a guide block having opposed first and second faces with a plurality of elongate channels corresponding to each punch extending from said first to second face; a die block for supporting said substrate, said die block having an array of punching zones at which the punches bear so as to singulate all or a portion of a peripheral edge of said IC units from the substrate.

Abstract translation: 一种用于从基板分离IC单元的冲头和模具组件，所述组件包括冲头阵列，导向块具有相对的第一和第二面，多个细长通道对应于从所述第一面到第二面的每个冲头; 用于支撑所述基板的模具块，所述模具块具有冲孔区域的阵列，冲头在该阵列处承载以从基板将所述IC单元的外围边缘的全部或一部分分离。

公开(公告)号：WO2008076080A2

公开(公告)日：2008-06-26

申请号：PCT/SG2007/000397

申请日：2007-11-16

Applicant: ROKKO TECHNOLOGY PTE LTD. ,  SHEN, Xue Fang ,  ZHANG, Jing ,  LING, Nee Seng ,  ANG, Soo Loo

Inventor： SHEN, Xue Fang ,  ZHANG, Jing ,  LING, Nee Seng ,  ANG, Soo Loo

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/687 ,  B23K20/00

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/7825 ,  H01L2224/78703 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A clamping assembly for clamping a lead frame with pre-attached semiconductor device, comprising of: a first member, to hold the lead frame, said first member having a surface profile in contact with a surface profile of the semiconductor device, a second member for allowing the mounting of the first member thereon, an attachment means to secure the first member onto the second member, wherein the attachment means is adjustable to conform the surface profile of the first member to the surface profile of the lead frame.

Abstract translation: 一种用于用预固定半导体器件夹紧引线框架的夹持组件，包括：第一构件，用于保持引线框架，所述第一构件具有与半导体器件的表面轮廓接触的表面轮廓;第二构件，用于 允许第一构件在其上的安装，用于将第一构件固定到第二构件上的附接装置，其中附接装置是可调节的，以使第一构件的表面轮廓与引线框架的表面轮廓一致。