公开(公告)号：WO2019023282A1

公开(公告)日：2019-01-31

申请号：PCT/US2018/043571

申请日：2018-07-24

Applicant: MICROLINK DEVICES, INC.

Inventor： YOUTSEY, Christopher ,  MCCARTHY, Robert ,  REDDY, Rekha

IPC: H01L21/306 ,  H01L21/3063 ,  H01L21/78 ,  H01L31/0236 ,  H01L33/00 ,  H01L33/22

CPC classification number: H01L21/30612 ,  H01L21/02389 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02664 ,  H01L21/30635 ,  H01L21/67075 ,  H01L21/67086 ,  H01L21/78 ,  H01L21/7813 ,  H01L29/2003 ,  H01L31/02363 ,  H01L33/0075 ,  H01L33/22

Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.

公开(公告)号：WO2018169301A1

公开(公告)日：2018-09-20

申请号：PCT/KR2018/002973

申请日：2018-03-14

Applicant: 주식회사 베프스

Inventor： 박상영 ,  박영태

IPC: G06K9/00 ,  B06B1/06 ,  H01L21/78

CPC classification number: B06B1/06 ,  G06K9/00 ,  H01L21/78

Abstract: 초음파 지문 센서 및 그 제조 방법이 제공된다. 초음파 지문 센서의 제조 방법은, (a) m x n 센서 어레이 형태의 압전 로드가 형성된 제1 압전층을 제조하는 단계; (b) 하나의 압전 시트 형태의 제2 압전층을 상기 제1 압전층의 하부에 부착하는 단계를 포함할 수 있다.

公开(公告)号：WO2018051208A1

公开(公告)日：2018-03-22

申请号：PCT/IB2017/055314

申请日：2017-09-05

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： YAMANE, Yasumasa ,  TOKUMARU, Ryo ,  SAWAI, Hiromi

IPC: H01L21/336 ,  H01L21/28 ,  H01L21/8234 ,  H01L21/8239 ,  H01L21/8242 ,  H01L27/088 ,  H01L27/105 ,  H01L27/108 ,  H01L27/115 ,  H01L29/417 ,  H01L29/423 ,  H01L29/49 ,  H01L29/786 ,  H01L29/788 ,  H01L29/792

CPC classification number: H01L29/4908 ,  H01L21/443 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/78 ,  H01L22/14 ,  H01L23/544 ,  H01L27/1052 ,  H01L27/1207 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1255 ,  H01L29/24 ,  H01L29/42384 ,  H01L29/66969 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/78696

Abstract: A semiconductor device having stable electrical characteristics is provided. A semiconductor device that can be miniaturized or highly integrated is provided. One embodiment of the present invention includes a transistor including an oxide, a first barrier layer over the transistor, and a second barrier layer in contact with the first barrier layer. The oxide is in contact with an insulator including an excess-oxygen region. The insulator is in contact with the first barrier layer. The first barrier layer has a thickness greater than or equal to 0.5 nm and less than or equal to 1.5 nm. The second barrier layer is thicker than the first barrier layer.

Abstract translation: 提供具有稳定电特性的半导体器件。 提供可以小型化或高度集成的半导体器件。 本发明的一个实施例包括晶体管，该晶体管包括氧化物，晶体管上的第一阻挡层以及与第一阻挡层接触的第二阻挡层。 氧化物与包括过量氧区域的绝缘体接触。 绝缘体与第一阻挡层接触。 第一阻挡层具有大于或等于0.5nm且小于或等于1.5nm的厚度。 第二阻挡层比第一阻挡层厚。

公开(公告)号：WO2017142640A1

公开(公告)日：2017-08-24

申请号：PCT/US2017/012608

申请日：2017-01-06

Applicant: QUALCOMM INCORPORATED

Inventor： LEE, Jae Sik ,  WE, Hong Bok ,  KIM, Dong Wook

IPC: H01L23/538 ,  H01L21/60

CPC classification number: H01L24/14 ,  H01L21/31051 ,  H01L21/31058 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/11 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/0231 ,  H01L2224/04105 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/12105 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/24137 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3511

Abstract: A fan-out wafer-level-process integrated circuit is provided in which a plurality of interconnects (125) couple to pads (111) on an encapsulated (135) die (105,110). The interconnects have a pad-facing surface that couples to a corresponding pad through a seed layer (145). The seed layer does not cover the sidewalls of the interconnects.

Abstract translation: 提供了扇出晶圆级工艺集成电路，其中多个互连（125）耦合到封装（135）管芯（105,110）上的焊盘（111）。 互连件具有通过种子层（145）耦合到相应垫的面向垫的表面。 种子层不覆盖互连的侧壁。

公开(公告)号：WO2017123407A1

公开(公告)日：2017-07-20

申请号：PCT/US2016/068577

申请日：2016-12-23

Applicant: ZIPTRONIX, INC.

Inventor： UZOH, Cyprian Emeka ,  ENQUIST, Paul M. ,  FOUNTAIN, Jr., Gaius Gillman

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L25/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/14 ,  H01L25/105 ,  H01L2221/68327

Abstract: Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the support structure such that the surface of the film faces a support surface of the support structure. The film can be selectively positioned laterally relative to the support structure such that a selected first die is aligned with a first location of the support structure. A force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the film to the support structure.

Abstract translation: 公开了用于有效传递元素的系统和方法。 可以提供支撑多个切块集成装置模具的膜。 多个切割后的集成器件管芯可以沿着膜的表面彼此相邻布置。 可以将膜定位在支撑结构附近，使得膜的表面面对支撑结构的支撑表面。 该膜可以选择性地相对于支撑结构横向定位，使得选定的第一模具与支撑结构的第一位置对齐。 可以在不平行于膜表面的方向上施加力，以使所选择的第一模具直接从膜转移到支撑结构。

公开(公告)号：WO2017118217A1

公开(公告)日：2017-07-13

申请号：PCT/CN2016/105511

申请日：2016-11-11

Applicant: 京东方科技集团股份有限公司 ,  北京京东方显示技术有限公司

Inventor： 邢建国 ,  王贺陶 ,  晏斌

IPC: H01L27/12 ,  H01L21/762 ,  H01L21/78

CPC classification number: B32B7/12 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/148 ,  B32B2307/204 ,  B32B2457/20 ,  H01L21/6835 ,  H01L21/762 ,  H01L21/78 ,  H01L27/12 ,  H01L51/003 ,  H01L51/0097

Abstract: 一种基板结构，以及贴附柔性基板和剥离柔性基板的方法。基板结构包括载体基板(1)以及设置在载体基板(1)上的柔性基板(2)，还包括：夹在载体基板(1)和柔性基板(2)之间的一个或多个并排设置的粘结层(3)；粘结层(3)包括粘性强度在电场的作用下改变的电粘性层(31)；电粘性层(31)设置在粘结层(3)与柔性基板(2)接触的表面上。

公开(公告)号：WO2017098659A1

公开(公告)日：2017-06-15

申请号：PCT/JP2015/084828

申请日：2015-12-11

Applicant: 新電元工業株式会社

Inventor： 福田　祐介 ,  渡部　善之

IPC: H01L21/28

CPC classification number: H01L29/1608 ,  H01L21/02057 ,  H01L21/02529 ,  H01L21/0475 ,  H01L21/268 ,  H01L21/28512 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/544 ,  H01L29/0619 ,  H01L2223/54426

Abstract: 炭化珪素半導体装置（１００）の製造方法は、炭化珪素ウエハ（１０）の表面側に表面電極（３０）を形成する工程と、炭化珪素ウエハ（１０）を裏面側から薄くして、炭化珪素ウエハ（１０）を薄板化する工程と、薄板化された炭化珪素ウエハ（１０）の裏面に金属層（２１）を設ける工程と、炭化珪素ウエハ（１０）及び金属層（２１）が平坦化するように外力を加えた状態で、金属層（２１）にレーザ光を照射して炭化珪素ウエハ（１０）中の炭素と反応したカーバイド層（２０）を金属層（２１）の裏面側に形成する工程と、カーバイド層（２０）の裏面側に裏面電極（４０）を形成する工程と、を備える。

Abstract translation: 用于制造

碳化硅半导体器件（100）的方法包括形成在碳化硅晶片（10），碳化硅晶片（10）的表面侧上的表面电极（30）的背面侧的步骤 后薄，减薄碳化硅晶片（10），减薄的碳化硅晶片（10），碳化硅晶片（10）的背表面上提供金属层（21）的步骤的步骤和在金属层 在其中（21）具有一个外部力被施加，以平坦化金属层已经用碳碳化硅晶片（10）照射激光束（20）的金属层进行反应（21）碳化物层的状态下（21 以及形成在背面侧）上形成碳化物层（20的背面侧的背面电极（40））的步骤，所述。

公开(公告)号：WO2017059189A1

公开(公告)日：2017-04-06

申请号：PCT/US2016/054652

申请日：2016-09-30

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： LIU, Yi ,  LOBIANCO, Anthony James ,  READ, Matthew Sean ,  NGUYEN, Hoang Mong ,  CHEN, Howard E.

IPC: H01L23/552 ,  H01L23/053 ,  H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01L21/78 ,  B23K26/38 ,  H01L21/32051 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2224/81

Abstract: Devices and methods related to fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

Abstract translation: 与屏蔽模块制造有关的设备和方法。 在一些实施例中，可以提供载体组件用于处理封装的模块。 载体组件可以包括具有限定多个开口的第一侧的板和在板的第一侧上实现的粘合剂层。 粘合剂层可以限定布置成基本上匹配板的开口的多个开口，粘合剂层的每个开口的尺寸使得粘合剂层能够在包装的下侧周边部分和 围绕板的第一侧的对应开口的周边部分。

公开(公告)号：WO2017019308A1

公开(公告)日：2017-02-02

申请号：PCT/US2016/042223

申请日：2016-07-14

Applicant: SIERRA NEVADA CORPORATION

Inventor： ANTHONY, Brian ,  DOBSON, Rodney ,  JOHNSON, Matthew ,  CHRISTIANSEN, Scott ,  RUHL, L., Eric

IPC: H01L31/18 ,  H01L21/00 ,  H01L31/00 ,  H01L31/042

CPC classification number: H01L31/041 ,  H01L21/00 ,  H01L21/67092 ,  H01L21/67121 ,  H01L21/78 ,  H01L31/042 ,  H01L31/0443 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/18 ,  Y02E10/50

Abstract: A space-grade solar array includes relatively small cells with integrated wiring embedded into or incorporated directly onto a printed circuit board. The integrated wiring provides an interface for solar cells having back side electrical contacts. The single side contacts enable the use of pick and place (PnP) technology in manufacturing the space-grade solar array. The solar cell is easily and efficiently packaged and electrically interconnected with other solar cells on a solar panel such as by using PnP process. The back side contacts are matched from a size and positioning standpoint to corresponding contacts on the printed circuit board.

Abstract translation: 空间级太阳能电池阵列包括具有嵌入或直接结合到印刷电路板上的集成布线的相对较小的单元。 集成布线为具有背面电触点的太阳能电池提供接口。 单面触点可以使用拾音和放置（PnP）技术制造空间级太阳能电池阵列。 太阳能电池容易且高效地封装并与太阳能电池板上的其它太阳能电池电连接，例如通过使用PnP工艺。 背面接触从尺寸和定位角度匹配到印刷电路板上的相应触点。

公开(公告)号：WO2017011246A1

公开(公告)日：2017-01-19

申请号：PCT/US2016/041169

申请日：2016-07-06

Applicant: ADVENTIVE TECHNOLOGY LTD. ,  WILLIAMS, Richard, K.

Inventor： WILLIAMS, Richard, K. ,  LIN, Keng-hung

IPC: H01L23/495 ,  H01L21/268 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L21/561 ,  H01L21/48 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92166 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014

Abstract: In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads in the leadframe. A laser beam is used to form individual plastic capsules for each package, and a second laser beam is used to singulate the packages by severing the metal conductors, tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads, may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam.

Abstract translation: 在半导体封装的制造中，通过从两侧掩蔽和蚀刻金属片而形成引线框，并且在引导框架中附着到焊盘的多个裸片上形成塑料块。 激光束用于为每个封装形成单独的塑料胶囊，并且第二激光束用于通过在包装之间切断金属导体，连接条和导轨来对包装进行分割。 可以仅通过改变掩模层中的开口的图案和创建的塑料沟槽的宽度来制造各种不同类型的包装，从鸥翼底脚包装到无引线封装，具有裸露或隔离的裸片焊盘 通过第一激光束。