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    PLASMA DAMAGE FREE SPUTTER GUN, SPUTTER, PLASMA PROCESS APPARATUS AND FILM-FORMING METHOD
    2.
    发明申请
    PLASMA DAMAGE FREE SPUTTER GUN, SPUTTER, PLASMA PROCESS APPARATUS AND FILM-FORMING METHOD 审中-公开
    等离子体破坏自由飞溅枪，喷射器，等离子体处理装置和成膜方法

    公开(公告)号：WO2009075393A1

    公开(公告)日：2009-06-18

    申请号：PCT/KR2007/006409

    申请日：2007-12-10

    Applicant: TOP ENGINEERING CO., LTD ,  RYU, Do-hyun ,  LEE, Sang-hyun ,  KIM, Han-ki ,  BAE, Jung-hyeok ,  MOON, Jong-min

    Inventor： RYU, Do-hyun ,  LEE, Sang-hyun ,  KIM, Han-ki ,  BAE, Jung-hyeok ,  MOON, Jong-min

    IPC: H01L21/203 ,  H01L21/205

    CPC classification number: C23C14/35 ,  H01J37/32568 ,  H01J37/3408

    Abstract: Provided are a plasma-damage-free sputter gun, which is capable of forming a layer at high speed, a sputter apparatus including the sputter gun, a plasma processing apparatus using the sputter gun, and a method of forming a layer using the sputter gun. The sputter gun includes: a yoke plate having a single-sided or double-sided opening; and a plurality of magnets disposed on the yoke plate at regular intervals. Each of the magnets includes upper and lower portions that are integrally formed and have different magnetic poles, and the magnets are arranged in a line. Accordingly, it is possible to form a layer at high speed without causing plasma damage using the above-described gun, apparatuses, and method.

    Abstract translation: 提供了能够高速形成层的等离子体损伤的溅射枪，包括溅射枪的溅射装置，使用溅射枪的等离子体处理装置以及使用溅射枪形成层的方法 。 溅射枪包括：具有单面或双面开口的轭板; 以及以规则的间隔设置在轭板上的多个磁体。 每个磁体包括一体形成且具有不同磁极的上部和下部，并且磁体排成一行。 因此，可以使用上述的枪，装置和方法高速地形成层而不引起等离子体损伤。

    METHOD OF CUTTING NONMETAL
    3.
    发明申请
    METHOD OF CUTTING NONMETAL 审中-公开
    切割非金属的方法

    公开(公告)号：WO2005099980A1

    公开(公告)日：2005-10-27

    申请号：PCT/KR2005/001080

    申请日：2005-04-14

    Applicant: TOP ENGINEERING CO., LTD ,  BANG, Kyu Yong ,  RYU, Do Hyun ,  LEE, Chang Bok

    Inventor： BANG, Kyu Yong ,  RYU, Do Hyun ,  LEE, Chang Bok

    IPC: B26F3/16

    CPC classification number: B23K26/0884 ,  B23K26/0622 ,  B23K26/40 ,  B23K2203/50

    Abstract: The present invention provides a method of cutting nonmetal including glass stably, by which the glass substrate for fabricating a module of a display such as TFT-LCD, PDP and OLED can be cut fast and stably with precision without causing a damage to the substrate to enhance productivity and throughput. The present invention includes the steps of generating a laser beam by an Nd-YAG oscillator (10) using a laser diode as a light source, converting the laser beam generated from the Nd-YAG laser oscillator (10) to a short wavelength of a 200~400nm UV area by a wavelength converter, converting the laser beam generated from the Nd-YAG laser oscillator (10) the short wavelength to the laser beam having an ultra short pulse of 1~100ns through Q-switching, guiding the laser beam to a torch (6), condensing to apply the guided short wavelength laser beam to a specific location on a nonmetallic substrate, and allowing the substrate and the laser beam to make relative movements to cut the substrate into a predetermined shape.

    Abstract translation: 本发明提供了一种稳定地切割包括玻璃在内的非金属的方法，通过该方法可以快速且稳定地切割用于制造诸如TFT-LCD，PDP和OLED的显示器的模块的玻璃基板，而不会对基板造成损害 提高生产率和吞吐量。 本发明包括使用激光二极管作为光源的Nd-YAG振荡器（10）产生激光束的步骤，将从Nd-YAG激光振荡器（10）产生的激光束转换成短波长的 通过波长转换器将200〜400nm的UV区域通过Q切换将从Nd-YAG激光振荡器（10）产生的短波长的激光束转换为具有1〜100ns的超短脉冲的激光束，引导激光束 （6），聚焦以将被引导的短波长激光束施加到非金属基底上的特定位置，并允许基底和激光束进行相对运动以将基底切割成预定形状。

    TWIN TARGET SPUTTER SYSTEM FOR THIN FILM PASSIVATION AND METHOD OF FORMING FILM USING THE SAME
    4.
    发明申请
    TWIN TARGET SPUTTER SYSTEM FOR THIN FILM PASSIVATION AND METHOD OF FORMING FILM USING THE SAME 审中-公开
    用于薄膜钝化的双目标溅射系统及其形成膜的方法

    公开(公告)号：WO2008130205A1

    公开(公告)日：2008-10-30

    申请号：PCT/KR2008/002337

    申请日：2008-04-24

    Applicant: TOP ENGINEERING CO., LTD ,  LEE, Sang-hyun ,  RYU, Do-hyun

    Inventor： LEE, Sang-hyun ,  RYU, Do-hyun

    IPC: H01L21/203

    CPC classification number: C23C14/568 ,  C23C14/352 ,  H01L51/5253

    Abstract: Provided are a twin target sputter system for thin film passivation, which generates high density plasma between the same-shaped targets opposite to each other to thereby form a film at a high speed, and a method of forming the film using the same. The twin target sputter system for thin film passivation includes: a vacuum chamber; a substrate supporter which supports a substrate in the vacuum chamber; a pair of sputter guns each of which faces the substrate, and comprises a yoke plate opened to one side or opposite sides and a plurality of magnets disposed on the yoke plate at regular intervals; targets which are mounted on the pair of yoke plates, respectively; a gun supporter which supports the pair of sputter guns; and a power supply which supplies electric current to the targets, wherein the plurality of magnets each comprises upper and lower parts, the upper and lower parts are formed as a single body and different in magnetic polarity from each other, and the plurality of magnets are aligned in a line, and wherein the gun supporter or the substrate supporter is movable in the chamber. Using the twin target sputter system for thin film passivation and the method of forming a film using the same, an organic light emitting diode (OLED) and an organic thin film transistor (OTFT) can be fabricated by a simple thin film process without an encapsulation process using the existing metal can or glass substrate, thereby simplifying the process and lowering initial investment costs for fabricating the OLED.

    Abstract translation: 提供了一种用于薄膜钝化的双靶溅射系统，其在彼此相对的相同形状的靶之间产生高密度等离子体，从而以高速形成膜，以及使用其形成膜的方法。 用于薄膜钝化的双靶溅射系统包括：真空室; 支撑真空室中的基板的基板支撑件; 一对溅射枪各自面向基板，并且包括以一定面积设置在轭板上的一侧或相对侧的磁轭板和多个磁体; 分别安装在一对轭板上的目标; 支持一对溅射枪的枪支持器; 以及向所述目标供给电流的电源，其中，所述多个磁体各自包括上部和下部，所述上部和下部形成为单个主体并且彼此的磁极性彼此不同，并且所述多个磁体是 排列成一行，并且其中枪支撑件或基板支撑件可在腔室中移动。 使用用于薄膜钝化的双靶溅射系统和使用其形成膜的方法，有机发光二极管（OLED）和有机薄膜晶体管（OTFT）可以通过简单的薄膜工艺制造而无需封装 使用现有的金属罐或玻璃基板的工艺，从而简化了工艺并降低了用于制造OLED的初始投资成本。

    APPARATUS FOR CUTTING NONMETAL
    5.
    发明申请
    APPARATUS FOR CUTTING NONMETAL 审中-公开
    用于切割非特异性的装置

    公开(公告)号：WO2005099979A1

    公开(公告)日：2005-10-27

    申请号：PCT/KR2005/001068

    申请日：2005-04-13

    Applicant: TOP ENGINEERING CO., LTD ,  BANG, Kyu Yong ,  RYU, Do Hyun ,  LEE, Chang Bok

    Inventor： BANG, Kyu Yong ,  RYU, Do Hyun ,  LEE, Chang Bok

    IPC: B26F3/16

    CPC classification number: B23K26/0884 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/40 ,  B23K2203/50 ,  H05K3/0029 ,  H05K3/0052

    Abstract: The present invention provides an apparatus for cutting nonmetal including glass stably, by which the glass substrate for fabricating a module of a display such as TFT-LCD, PDP and OLED can be cut fast and stably with precision without causing a damage to the substrate to enhance productivity and throughput. The present invention includes a laser beam generator (10) generating a UV short wavelength laser beam, an optical system (11) guiding a beam path of the short wavelength laser beam generated from the laser beam generator (10) to a portion specified for irradiation, a torch (6) condensing to apply the short wavelength laser beam to a specific location on a nonmetallic substrate to be cut, and a relative movement means for allowing the substrate and the laser beam to make a relative movement to cut the substrate.

    Abstract translation: 本发明提供了一种用于稳定地切割包括玻璃的非金属的装置，通过该装置可以精确地快速稳定地切割诸如TFT-LCD，PDP和OLED的显示器的模块的制造用玻璃基板，而不会对基板造成损害 提高生产力和吞吐量。 本发明包括产生UV短波长激光束的激光束发生器（10），将从激光束发生器（10）产生的短波长激光束的光束路径引导到照射规定的部分的光学系统（11） ，将短波长激光束施加到要切割的非金属基底上的特定位置的手电筒（6），以及用于允许基板和激光束进行相对移动以切割基板的相对移动装置。

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