METHOD OF PARTICLE CONTAMINANT REMOVAL
    1.
    发明申请
    METHOD OF PARTICLE CONTAMINANT REMOVAL 审中-公开
    颗粒污染物去除方法

    公开(公告)号:WO2010103416A2

    公开(公告)日:2010-09-16

    申请号:PCT/IB2010/050842

    申请日:2010-02-26

    CPC classification number: H01L21/02057 H01L21/67051

    Abstract: Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface. The viscoelastic material along with at least some of the particle contaminants is removed from the first area of the surface while the viscoelastic material is exhibiting solid-like characteristics.

    Abstract translation: 用于从基底表面除去颗粒污染物的设备和方法包括在表面上涂覆粘弹性材料层。 粘弹性材料被涂覆成薄膜并呈现出基本上液体状的特征。 将外力施加到涂覆有粘弹性材料的表面的第一区域,使得涂覆有粘弹性材料的表面的第二区域基本上不受施加的力。 施加力的持续时间短于粘弹性材料的固有时间,以便获得粘弹性材料的类固体特性。 表现出类固体特性的粘弹性材料至少部分地与存在于表面上的至少一些颗粒污染物相互作用。 粘弹性材料与至少一些颗粒污染物一起从表面的第一区域除去,而粘弹性材料表现出类似固体的特性。

    METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRATES USING SEQUENTIAL CHEMICAL APPLICATIONS
    2.
    发明申请
    METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRATES USING SEQUENTIAL CHEMICAL APPLICATIONS 审中-公开
    使用顺序化学应用的表面处理半导体基板的方法和装置

    公开(公告)号:WO2010033144A1

    公开(公告)日:2010-03-25

    申请号:PCT/US2009/004080

    申请日:2009-07-13

    Abstract: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.

    Abstract translation: 在蚀刻前清洁操作期间从形成在基板的表面上的金属栅极结构周围除去聚合物残留物的系统和方法包括确定与金属栅极结构和待除去的聚合物残余物相关联的多个工艺参数。 多个制造层限定了金属栅极结构,并且工艺参数限定了制造层和聚合物残余物的特性。 识别第一清洁化学品和第二清洁化学品,并且基于过程参数来定义与第一和第二清洁化学品相关联的多个施用参数。 使用应用参数以受控的方式顺序施加第一和第二施用化学物质,以显着除去聚合物残余物,同时保持栅极结构的结构完整性。

    METHOD OF PARTICLE CONTAMINANT REMOVAL
    3.
    发明申请
    METHOD OF PARTICLE CONTAMINANT REMOVAL 审中-公开
    颗粒污染物去除方法

    公开(公告)号:WO2010103416A3

    公开(公告)日:2010-12-09

    申请号:PCT/IB2010050842

    申请日:2010-02-26

    CPC classification number: H01L21/02057 H01L21/67051

    Abstract: Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface. The viscoelastic material along with at least some of the particle contaminants is removed from the first area of the surface while the viscoelastic material is exhibiting solid-like characteristics.

    Abstract translation: 从基材表面去除颗粒污染物的设备和方法包括在表面上涂覆一层粘弹性材料。 粘弹性材料被涂覆为薄膜并呈现出显着的液体特性。 外力施加到涂覆有粘弹性材料的表面的第一区域,使得涂覆有粘弹性材料的表面的第二区域基本上不受施加的力。 施加力比粘弹性材料的固有时间短的持续时间,以获得粘弹性材料的固体特性。 具有固体样特性的粘弹性材料至少部分地与存在于表面上的至少一些颗粒污染物相互作用。 粘弹性材料与至少一些颗粒污染物一起从表面的第一区域去除,而粘弹性材料呈现出固体状特征。

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