公开(公告)号：WO2009078975A3

公开(公告)日：2009-08-27

申请号：PCT/US2008013714

申请日：2008-12-12

Applicant: LAM RES CORP ,  MUI DAVID S L ,  SRINIVASAN SATISH ,  PENG GRANT ,  ZHU JI ,  KON SHIH-CHUNG ,  PODLESNIK DRAGAN ,  MENDIRATTA ARJUN

Inventor： MUI DAVID S L ,  SRINIVASAN SATISH ,  PENG GRANT ,  ZHU JI ,  KON SHIH-CHUNG ,  PODLESNIK DRAGAN ,  MENDIRATTA ARJUN

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供了用于清洁具有精细特征的图案化基板的改进材料。 该清洁材料在清洁具有精细特征的图案化基板方面具有优势，而基本上不损坏该特征。 清洁材料是流体，无论是液相还是液相/气相，并在设备特征周围变形; 因此，清洁材料不会实质上损害设备特征或一起减少损坏。 含有大分子量聚合物的聚合物的清洁材料将污染物捕获在基底上。 另外，清洁材料包裹污染物并且不会将污染物返回到基材表面。 一种或多种具有大分子量的聚合物化合物的聚合物形成长聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长聚合物链和/或聚合物网络显示出捕获和截留污染物的优越能力。

公开(公告)号：WO2010103416A3

公开(公告)日：2010-12-09

申请号：PCT/IB2010050842

申请日：2010-02-26

Applicant: LAM RES CORP ,  LAM RES AG ,  SABBA YIZHAK ,  YUN SEOKMIN ,  KAWAGUCHI MARK ,  WILCOXSON MARK ,  PODLESNIK DRAGAN

Inventor： SABBA YIZHAK ,  YUN SEOKMIN ,  KAWAGUCHI MARK ,  WILCOXSON MARK ,  PODLESNIK DRAGAN

IPC: H01L21/302 ,  H01L21/304

CPC classification number: H01L21/02057 ,  H01L21/67051

Abstract: Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface. The viscoelastic material along with at least some of the particle contaminants is removed from the first area of the surface while the viscoelastic material is exhibiting solid-like characteristics.

Abstract translation: 从基材表面去除颗粒污染物的设备和方法包括在表面上涂覆一层粘弹性材料。 粘弹性材料被涂覆为薄膜并呈现出显着的液体特性。 外力施加到涂覆有粘弹性材料的表面的第一区域，使得涂覆有粘弹性材料的表面的第二区域基本上不受施加的力。 施加力比粘弹性材料的固有时间短的持续时间，以获得粘弹性材料的固体特性。 具有固体样特性的粘弹性材料至少部分地与存在于表面上的至少一些颗粒污染物相互作用。 粘弹性材料与至少一些颗粒污染物一起从表面的第一区域去除，而粘弹性材料呈现出固体状特征。

公开(公告)号：WO2009078968A1

公开(公告)日：2009-06-25

申请号：PCT/US2008/013696

申请日：2008-12-12

Applicant: LAM RESEARCH CORPORATION ,  MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

Inventor： MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide methods for cleaning patterned substrates with fine features. The methods for cleaning patterned substrate have advantages in cleaning patterned substrates with fine features without substantially damaging the features by using the cleaning materials described. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供了用于清洁具有精细特征的图案化衬底的方法。 用于清洁图案化衬底的方法具有通过使用所述清洁材料来清洁具有精细特征的图案化衬底而不会基本上损坏特征的优点。 清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损伤全部降低在一起。 包含具有大分子量的聚合物的聚合物的清洁材料捕获基底上的污染物。 此外，清洁材料夹带污染物并且不会将污染物返回到基底表面。 一种或多种具有大分子量的聚合物的聚合物形成长的聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。

公开(公告)号：WO2011003117A3

公开(公告)日：2011-04-28

申请号：PCT/US2010042933

申请日：2010-07-22

Applicant: LAM RES CORP ,  HUANG CHUNG HO ,  VENUGOPAL VIJAYAKUMAR C ,  LAM CONNIE ,  PODLESNIK DRAGAN

Inventor： HUANG CHUNG HO ,  VENUGOPAL VIJAYAKUMAR C ,  LAM CONNIE ,  PODLESNIK DRAGAN

IPC: H01L21/00

CPC classification number: G06F9/5027 ,  G05B19/4184 ,  G05B2219/31202 ,  G05B2219/31293 ,  G05B2219/31318 ,  G05B2219/31481 ,  G05B2219/32209 ,  G05B2219/45031 ,  G06F11/2035 ,  G06F11/2043 ,  Y02P90/14 ,  Y02P90/18

Abstract: A process-level troubleshooting architecture (PLTA) configured to facilitate substrate processing in a plasma processing system is provided. The architecture includes a process module controller. The architecture also includes a plurality of sensors, wherein each sensor of the plurality of sensors communicates with the process module controller to collect sensed data about one or more process parameters. The architecture further includes a process-module-level analysis server, wherein the process-module-level analysis server communicates directly with the plurality of sensors and the process module controller. The process-module-level analysis server is configured for receiving data, wherein the data include at least one of the sensed data from the plurality of sensors and process module and chamber data from the process module controller. The process-module-level analysis server is also configured for analyzing the data and sending interdiction data directly to the process module controller when a problem is identified during the substrate processing.

Abstract translation: 提供了配置为促进等离子体处理系统中的衬底处理的处理级故障排除体系结构（PLTA）。 该架构包括一个过程模块控制器。 该架构还包括多个传感器，其中多个传感器中的每个传感器与处理模块控制器通信以收集关于一个或多个处理参数的感测数据。 该体系结构还包括过程模块级分析服务器，其中过程模块级分析服务器直接与多个传感器和过程模块控制器通信。 处理模块级分析服务器被配置用于接收数据，其中该数据包括来自多个传感器和处理模块的感测数据和来自处理模块控制器的腔室数据中的至少一个。 过程模块级分析服务器还被配置用于在衬底处理期间识别问题时分析数据并将阻断数据直接发送到过程模块控制器。

公开(公告)号：WO2010033144A1

公开(公告)日：2010-03-25

申请号：PCT/US2009/004080

申请日：2009-07-13

Applicant: LAM RESEARCH CORPORATION ,  MIKHAYLICHENKO, Katrina ,  SABBA, Yizhak ,  PODLESNIK, Dragan

Inventor： MIKHAYLICHENKO, Katrina ,  SABBA, Yizhak ,  PODLESNIK, Dragan

IPC: H01L21/302 ,  H01L21/336

CPC classification number: H01L21/67051 ,  H01L21/02071 ,  H01L21/6704 ,  H01L21/67075 ,  H01L21/67253 ,  H01L22/12 ,  H01L22/20

Abstract: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.

Abstract translation: 在蚀刻前清洁操作期间从形成在基板的表面上的金属栅极结构周围除去聚合物残留物的系统和方法包括确定与金属栅极结构和待除去的聚合物残余物相关联的多个工艺参数。 多个制造层限定了金属栅极结构，并且工艺参数限定了制造层和聚合物残余物的特性。 识别第一清洁化学品和第二清洁化学品，并且基于过程参数来定义与第一和第二清洁化学品相关联的多个施用参数。 使用应用参数以受控的方式顺序施加第一和第二施用化学物质，以显着除去聚合物残余物，同时保持栅极结构的结构完整性。

公开(公告)号：WO2009078975A2

公开(公告)日：2009-06-25

申请号：PCT/US2008/013714

申请日：2008-12-12

Applicant: LAM RESEARCH CORPORATION ,  MUI, David S. L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

Inventor： MUI, David S. L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

IPC: H01L21/302 ,  H01L21/30

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide improved materials for cleaning patterned substrates with fine features. The cleaning materials have advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供用于清洁具有精细特征的图案化衬底的改进材料。 清洁材料在清洁具有精细特征的图案化基材上具有优点，而基本上不损坏特征。 清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损伤全部降低在一起。 包含具有大分子量的聚合物的聚合物的清洁材料捕获基底上的污染物。 此外，清洁材料夹带污染物并且不会将污染物返回到基底表面。 一种或多种具有大分子量的聚合物的聚合物形成长的聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。

公开(公告)号：WO2011003117A2

公开(公告)日：2011-01-06

申请号：PCT/US2010/042933

申请日：2010-07-22

Applicant: LAM RESEARCH CORPORATION ,  HUANG, Chung Ho ,  VENUGOPAL, Vijayakumar C. ,  LAM, Connie ,  PODLESNIK, Dragan

Inventor： HUANG, Chung Ho ,  VENUGOPAL, Vijayakumar C. ,  LAM, Connie ,  PODLESNIK, Dragan

IPC: H01L21/00

CPC classification number: G06F9/5027 ,  G05B19/4184 ,  G05B2219/31202 ,  G05B2219/31293 ,  G05B2219/31318 ,  G05B2219/31481 ,  G05B2219/32209 ,  G05B2219/45031 ,  G06F11/2035 ,  G06F11/2043 ,  Y02P90/14 ,  Y02P90/18

Abstract: A process-level troubleshooting architecture (PLTA) configured to facilitate substrate processing in a plasma processing system is provided. The architecture includes a process module controller. The architecture also includes a plurality of sensors, wherein each sensor of the plurality of sensors communicates with the process module controller to collect sensed data about one or more process parameters. The architecture further includes a process-module-level analysis server, wherein the process-module-level analysis server communicates directly with the plurality of sensors and the process module controller. The process-module-level analysis server is configured for receiving data, wherein the data include at least one of the sensed data from the plurality of sensors and process module and chamber data from the process module controller. The process-module-level analysis server is also configured for analyzing the data and sending interdiction data directly to the process module controller when a problem is identified during the substrate processing.

Abstract translation: 提供了一种配置为促进等离子体处理系统中的基板处理的过程级故障排除架构（PLTA）。 该架构包括一个进程模块控制器。 该架构还包括多个传感器，其中多个传感器中的每个传感器与过程模块控制器通信以收集关于一个或多个过程参数的感测数据。 该架构还包括一个过程模块级分析服务器，其中该过程模块级分析服务器与多个传感器和该处理模块控制器直接通信。 过程模块级分析服务器被配置为用于接收数据，其中数据包括来自多个传感器的感测数据中的至少一个以及来自处理模块控制器的处理模块和室数据。 过程模块级分析服务器还被配置为当在衬底处理期间识别出问题时，分析数据并将拦截数据直接发送到过程模块控制器。

公开(公告)号：WO2010103416A2

公开(公告)日：2010-09-16

申请号：PCT/IB2010/050842

申请日：2010-02-26

Applicant: LAM RESEARCH CORPORATION ,  LAM RESEARCH AG ,  SABBA, Yizhak ,  YUN, Seokmin ,  KAWAGUCHI, Mark ,  WILCOXSON, Mark ,  PODLESNIK, Dragan

Inventor： SABBA, Yizhak ,  YUN, Seokmin ,  KAWAGUCHI, Mark ,  WILCOXSON, Mark ,  PODLESNIK, Dragan

IPC: H01L21/302 ,  H01L21/304

CPC classification number: H01L21/02057 ,  H01L21/67051

Abstract: Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface. The viscoelastic material along with at least some of the particle contaminants is removed from the first area of the surface while the viscoelastic material is exhibiting solid-like characteristics.

Abstract translation: 用于从基底表面除去颗粒污染物的设备和方法包括在表面上涂覆粘弹性材料层。 粘弹性材料被涂覆成薄膜并呈现出基本上液体状的特征。 将外力施加到涂覆有粘弹性材料的表面的第一区域，使得涂覆有粘弹性材料的表面的第二区域基本上不受施加的力。 施加力的持续时间短于粘弹性材料的固有时间，以便获得粘弹性材料的类固体特性。 表现出类固体特性的粘弹性材料至少部分地与存在于表面上的至少一些颗粒污染物相互作用。 粘弹性材料与至少一些颗粒污染物一起从表面的第一区域除去，而粘弹性材料表现出类似固体的特性。

公开(公告)号：WO2009078969A1

公开(公告)日：2009-06-25

申请号：PCT/US2008/013697

申请日：2008-12-12

Applicant: LAM RESEARCH CORPORATION ,  MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

Inventor： MUI, David, S., L. ,  SRINIVASAN, Satish ,  PENG, Grant ,  ZHU, Ji ,  KON, Shih-Chung ,  PODLESNIK, Dragan ,  MENDIRATTA, Arjun

IPC: H01L21/302 ,  H01L21/304

CPC classification number: C11D7/5009 ,  C11D3/3723 ,  C11D3/3765 ,  C11D3/3773 ,  C11D7/261 ,  C11D7/3263 ,  C11D7/34 ,  C11D11/0047 ,  H01L21/02057 ,  H01L21/67051 ,  Y10S134/902

Abstract: The embodiments of the present invention provide apparatus for cleaning patterned substrates with fine features with cleaning materials. The apparatus using the cleaning materials has advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network). The long polymer chains and/or polymer network show superior capabilities of capturing and entrapping contaminants, in comparison to conventional cleaning materials.

Abstract translation: 本发明的实施例提供了用清洁材料清洁具有精细特征的图案化衬底的设备。 使用清洁材料的设备具有清洁具有精细特征的图案化基材而不会显着损害特征的优点。 清洁材料是流体，液相或液相/气相，并围绕装置特征变形; 因此，清洁材料基本上不会损坏设备特征或将损伤全部降低在一起。 包含具有大分子量的聚合物的聚合物的清洁材料捕获基底上的污染物。 此外，清洁材料夹带污染物并且不会将污染物返回到基底表面。 一种或多种具有大分子量的聚合物的聚合物形成长的聚合物链，其也可以交联以形成网络（或聚合物网络）。 与传统清洁材料相比，长的聚合物链和/或聚合物网络显示出捕获和捕获污染物的优异性能。