公开(公告)号：WO1998026638A1

公开(公告)日：1998-06-18

申请号：PCT/DE1997001997

申请日：1997-09-09

Applicant: ROBERT BOSCH GMBH ,  NEUTEL, Andreas ,  SCHMIDT, Joachim ,  SABOTKE, Jens ,  HAUSCHILD, Frank-Dieter ,  GRAEN, Ansgar ,  BARAN, Carola

Inventor： ROBERT BOSCH GMBH

IPC: H05K03/34

CPC classification number: H05K3/305 ,  H05K3/3415 ,  H05K2201/09072 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613

Abstract: This invention concerns a process for reflow soldering of circuit boards fitted SMD components in which SMD components are placed on soldering surfaces of the first side of a circuit board and soldered to the circuit board in a first reflow soldering step. Subsequently the circuit board is turned with the first side underneath and SMD components are placed on soldering surfaces of the upward-facing second side, which are soldered to the circuit board in a subsequent reflow soldering step. The SMD components on the first side of the circuit board are firmly cemented to the circuit board before the second reflow soldering step on the first side. It is proposed that after the first reflow soldering step a cement be injected from the second side of the circuit board through holes which pass through the circuit board and correspond to the components soldered to the first side of the board into the space between the components and circuit board.

Abstract translation: 根据与SMD元件组装的印刷电路板的回流焊的方法，其中，所述贴片元件被放置在电路板的第一侧的焊接表面，并且被焊接在第一Reflowlötschritt到电路板，所述印刷电路板的本发明则涉及所述第一侧 调低和SMD元件被放置在现在覆盖所述第二侧的焊接表面在随后的第二Reflowlötschritt被焊接到所述电路板，其中在电路板的第一侧面上的第一页上的SMD元件的第二Reflowlötschritt之前 粘。 所以建议第一Reflowlötschritt从所述电路板的第二侧上的粘接剂通过在每种情况下一个位于的钎焊从所述第一侧到所述印刷电路板的第二侧延伸的第一端组件孔的位置，在两者之间的空间后 注入部件和电路板。

公开(公告)号：WO1996009749A1

公开(公告)日：1996-03-28

申请号：PCT/DE1995001121

申请日：1995-08-24

Applicant: BLAUPUNKT-WERKE GMBH ,  SABOTKE, Jens ,  GRAEN, Ansgar ,  HEINRICH, Hans-Walter

Inventor： BLAUPUNKT-WERKE GMBH

IPC: H05K03/34

CPC classification number: H05K13/0069 ,  H05K3/0097 ,  H05K3/305 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3468 ,  H05K13/046 ,  H05K13/0465 ,  H05K2203/1563 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: The description relates to a process and device for automatically fitting the top and bottom sides of printed circuit boards with SMD components. To this end, the SMD fitters in the device have two parallel acceptors for printed circuit board conveyor belts for this purpose.

Abstract translation: 公开的是一种方法和用于与SMD元件描述的印刷电路板的顶面和底面的自动装载装置。 对于这一点，该装置中的SMD贴片机具有用于电路板的两个平行的传送带插座。