公开(公告)号：WO2010126592A1

公开(公告)日：2010-11-04

申请号：PCT/US2010/001255

申请日：2010-04-27

Applicant: CREE, INC. ,  EMERSON, David ,  KELLER, Bernd ,  HUSSELL, Christopher ,  SALTER, Amber ,  COLLINS, Brian ,  BERGMANN, Michael ,  EDMOND, John ,  TARSA, Eric ,  ANDREWS, Peter

Inventor： EMERSON, David ,  KELLER, Bernd ,  HUSSELL, Christopher ,  SALTER, Amber ,  COLLINS, Brian ,  BERGMANN, Michael ,  EDMOND, John ,  TARSA, Eric ,  ANDREWS, Peter

IPC: H01L33/58 ,  H01L33/64 ,  H01L33/20

CPC classification number: H01L33/58 ,  H01L33/20 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package (30) having increased feature sizes for improved luminous flux and efficacy. A LED chip (34) is disposed on a submount (32) with a lens (70) that covers the LED chip. In some cases, the ratio of the width of the light LED chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to • emit light more efficiently. Some packages, include submounts having dimensions greater than 3.5 mm per 3.5 mm used in conjunction with larger LED chips. Materials having high thermal conductivities are used to fabricate the submounts, such as APN, providing the package with better thermal management.

Abstract translation: 一种发光二极管（LED）封装（30），其具有增加的特征尺寸以改善光通量和功效。 LED芯片（34）设置在具有覆盖LED芯片的透镜（70）的底座（32）上。 在一些情况下，光LED芯片的宽度与所述透镜在给定方向上的宽度的比率为0.5或更大。 增加的特征尺寸可使包装更有效地发光。 一些包装，包括尺寸大于3.5 mm / 3.5 mm的底座，与较大的LED芯片结合使用。 使用具有高导热性的材料来制造诸如APN的底座，为封装提供更好的热管理。