公开(公告)号：WO2012120245A1

公开(公告)日：2012-09-13

申请号：PCT/FR2012/050502

申请日：2012-03-09

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  MARION, François

Inventor： MARION, François

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/114 ,  H01L2224/11452 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11616 ,  H01L2224/11827 ,  H01L2224/13011 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13166 ,  H01L2224/13187 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13618 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/81099 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81355 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Un composant de connexion électro-mécanique (10) est muni d'inserts conducteurs (16) destinés à être insérés dans des plots conducteurs respectifs d'un autre composant de connexion pour une hybridation du type face contre face. Chaque insert (16) comporte: une âme métallique (24), non oxydée sur au moins une portion de sa surface, et de dureté supérieure à celle des plots; une première couche métallique non oxydée (26)sur au moins une portion de sa surface, recouvrant au moins ladite portion non oxydée de l'âme (24), la première couche ayant une plasticité supérieure à celle de l'âme; et une seconde couche (28) recouvrant au moins la première couche(26) sur sa portion non oxydée et ayant une plasticité inférieure à celle de la première couche.

Abstract translation: 本发明涉及一种机电连接部件（10），其具有导入插入件（16），以插入到用于倒装芯片型杂交的另一连接部件的相应导电焊盘中。 每个插入件（16）包括：金属芯（24），其在其表面的至少一部分上不被氧化并且具有比垫的硬度更高的硬度; 第一金属层（26），其在其表面的至少一部分上未氧化，并且覆盖所述芯（24）的至少所述非氧化部分，所述第一层具有比所述芯的可塑性更高的可塑性; 以及在其非氧化部分上至少覆盖第一层（26）的第二层（28），并且具有比第一层低的塑性。

公开(公告)号：WO2012094663A3

公开(公告)日：2012-08-30

申请号：PCT/US2012020607

申请日：2012-01-09

Applicant: BRIDGELUX INC ,  WEST R SCOTT

Inventor： WEST R SCOTT

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self- align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

Abstract translation: 标准化的光子构建块用于制造分立的发光体以及阵列产品。 每个光子构建块具有安装在基板上的一个或多个LED芯片。 没有电导体通过衬底的顶表面和底表面之间。 光子构建块由连接到散热器的互连结构支撑。 每个光子构建块的衬底的顶表面上的着陆焊盘附接到布置在互连结构的唇缘的下侧上的接触焊盘。 在焊料回流工艺中，光子构建块在互连结构内自对准。 互连结构上的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。 互连结构的底表面与光子积木的基底的底表面共面。

公开(公告)号：WO2012082227A2

公开(公告)日：2012-06-21

申请号：PCT/US2011057294

申请日：2011-10-21

Applicant: TESSERA INC ,  HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

Inventor： HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

IPC: H01L25/065

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly 700 includes a dielectric element 730 having at least one aperture 733 and electrically conductive elements thereon including terminals 740 exposed at the second surface of the dielectric element 730; a first microelectronic element 712 having a rear surface and a front surface facing the dielectric element 730, the first microelectronic element 712 having a plurality of contacts exposed at the front surface thereof; a second microelectronic element 714 having a rear surface and a front surface facing the rear surface of the first microelectronic element 712, the second microelectronic element 714 having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element 712; and an electrically conductive plane 790 attached to the dielectric element 730 and at least partially positioned between the first and second apertures 733,739, the electrically conductive plane 790 being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements 712,714.

Abstract translation: 微电子组件700包括具有至少一个孔733的介电元件730和其上的导电元件，其中包括在电介质元件730的第二表面处暴露的端子740; 第一微电子元件712具有后表面和面向电介质元件730的前表面，第一微电子元件712具有在其前表面处暴露的多个触点; 第二微电子元件714具有后表面和面向第一微电子元件712的后表面的前表面，第二微电子元件714具有在前表面处暴露并突出超过第一微电子元件712的边缘的多个触点 ; 以及连接到电介质元件730并且至少部分地定位在第一和第二孔733,739之间的导电平面790，导电平面790与第一或第二微电子中的至少一个的一个或多个触点电连接 元素712,714。

公开(公告)号：WO2012082177A1

公开(公告)日：2012-06-21

申请号：PCT/US2011/031391

申请日：2011-04-06

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  ZOHNI, Wael ,  CRISP, Richard, Dewitt

Inventor： HABA, Belgacem ,  ZOHNI, Wael ,  CRISP, Richard, Dewitt

IPC: H01L23/49 ,  H01L23/13 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly 10 includes a dielectric element 30 having first and second surfaces 32, 34, first and second apertures 33, 39 extending between the first and second surfaces 32, 34 and defining a central region of the first surface 32 between the first and second apertures 33, 39, first and second microelectronic elements 12, 14, and leads 50, 70 extending from contacts 20, 26 exposed at respective front surfaces 16, 22 of the first and second microelectronic elements 12, 14 to central terminals 36 exposed at the central region. The front surface 16 of the first microelectronic element 12 can face the second surface 34 of the dielectric element 30. The front surface 22 of the second microelectronic element 14 can face a rear surface 18 of the first microelectronic element 12. The contacts 26 of the second microelectronic element 14 can project beyond an edge of the first microelectronic element 29. At least first and second ones of the leads 518, 519 can electrically interconnect a first central terminal 553 of the central terminals 558 with each of the first and second microelectronic elements 501, 502.

Abstract translation: 微电子组件10包括具有第一和第二表面32,34的介电元件30，在第一和第二表面32,34之间延伸的第一和第二孔33,39，并且在第一和第二表面之间限定第一表面32的中心区域 孔33,39，从第一和第二微电子元件12,14的相应前表面16,22处露出的接触件20,26延伸的第一和第二微电子元件12,14以及引线50,70，暴露在中间端子36处。 中央区域。 第一微电子元件12的前表面16可以面向电介质元件30的第二表面34.第二微电子元件14的前表面22可面对第一微电子元件12的后表面18.接触件26 第二微电子元件14可以突出超过第一微电子元件29的边缘。引线518,519中的至少第一和第二引线可以将中心端子558的第一中心端子553与第一和第二微电子元件 501，502。

公开(公告)号：WO2012054335A1

公开(公告)日：2012-04-26

申请号：PCT/US2011056352

申请日：2011-10-14

Applicant: TESSERA INC ,  HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

Inventor： HABA BELGACEM ,  ZOHNI WAEL ,  CRISP RICHARD DEWITT

IPC: H01L25/065 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element 930B having oppositely-facing first and second surfaces and one or more apertures 972 extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element 900A having a rear surface and a front surface facing the first surface of the dielectric element 930B, the first microelectronic element 900A having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element 900B including having a rear surface and a front surface facing the rear surface of the first microelectronic element 900A, a projecting portion of the front surface of the second microelectronic element 900B extending beyond the first edge of the first microelectronic element 900A, the projecting portion being spaced from the first surface of the dielectric element 930B, the second microelectronic element 900B having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader 970 thermally coupled to at least one of the first microelectronic element 900A or the second microelectronic element 900B.

Abstract translation: 微电子组件包括具有相对面对的第一和第二表面的介电元件930B和在表面之间延伸的一个或多个孔972，该介电元件还具有导电元件; 第一微电子元件900A，其具有背面和与介质元件930B的第一表面相对的前表面，第一微电子元件900A具有第一边缘和在其前表面处暴露的多个触点; 第二微电子元件900B，包括具有背面和面向第一微电子元件900A的后表面的前表面，第二微电子元件900B的前表面的突出部分延伸超过第一微电子元件900A的第一边缘， 所述突出部分与所述电介质元件930B的第一表面间隔开，所述第二微电子元件900B具有在所述前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件900A或第二微电子元件900B中的至少一个的散热器970。

公开(公告)号：WO2011102929A2

公开(公告)日：2011-08-25

申请号：PCT/US2011/021626

申请日：2011-01-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GRUBER, Peter, A. ,  LAURO, Paul, A. ,  NAH, Jae-Woong

Inventor： GRUBER, Peter, A. ,  LAURO, Paul, A. ,  NAH, Jae-Woong

IPC: H01L21/3205

CPC classification number: H05K3/3452 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1131 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/742 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3468 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are earned out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

Abstract translation: 获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。 至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。 将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积被焊料填充。 使焊料固化。 它形成粘附到湿润垫的多个焊料结构。 在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。 配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。 在替代方法中，在氮气环境或形成气体环境中获得焊料注入和凝固，并且可以省略回流步骤。

公开(公告)号：WO2011052615A1

公开(公告)日：2011-05-05

申请号：PCT/JP2010/069020

申请日：2010-10-27

Applicant: 住友ベークライト株式会社 ,  鍵本 奉広 ,  中馬 敏秋

Inventor： 鍵本　奉広 ,  中馬　敏秋

IPC: H01R11/01 ,  H01B5/16 ,  H01L21/60 ,  H05K3/36

CPC classification number: H01L24/29 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83205 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31678 ,  Y10T428/31699 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: 　本発明は、樹脂組成物と半田箔又は錫箔から選ばれる金属箔とから構成される積層構造を有する導電接続材料であって、前記導電接続材料における樹脂組成物（Ａ）と半田箔又は錫箔から選ばれる金属箔（Ｂ）との体積比（（Ａ）／（Ｂ））が１～４０又は２０～５００であることを特徴とする導電接続材料及び該導電接続材料を用いた端子間の接続方法を提供する。本発明の導電接続材料は、電気、電子部品等において電子部材の接続端子間を電気的に接続するために好適に用いられる。

Abstract translation: 提供一种具有包括树脂组合物和金属箔的层状结构的导电连接材料，所述金属箔是焊料箔或锡箔。 所述导电连接材料的特征在于，树脂组合物的体积（A）与导电连接材料中的金属箔的体积（B）之比（A / B），所述金属箔是焊料箔或 锡箔在1至40之间或20至500之间。还提供了使用所提供的导电连接材料的端子至端子连接方法。 所提供的导电连接材料适于电连接电子部件或电子部件等的连接端子。

公开(公告)号：WO2010141296A1

公开(公告)日：2010-12-09

申请号：PCT/US2010/036285

申请日：2010-05-27

Applicant: HSIO TECHNOLOGIES, LLC ,  RATHBURN, James

Inventor： RATHBURN, James

IPC: H01L23/12

CPC classification number: H01L24/82 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/185 ,  H01L2924/00

Abstract: A package for at least one semiconductor device and a method for making the package. At least one dielectric layer is selectively printed on at least a portion of the semiconductor device creating first recesses aligned with a plurality of the electrical terminals. A conductive material is printed in the first recesses forming contact members on the semiconductor device. At least one dielectric layer is selectively printed on at least a portion of the package to create a plurality of second recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the second recesses to create a circuit geometry. The circuit geometry includes a plurality of exposed terminals electrically coupled to the electric terminals on the semiconductor device.

Abstract translation: 用于至少一个半导体器件的封装以及用于制造封装的方法。 至少一个电介质层被选择性地印刷在半导体器件的至少一部分上，形成与多个电端子对准的第一凹槽。 在形成半导体器件上的接触部件的第一凹部中印刷导电材料。 至少一个电介质层被选择性地印刷在封装的至少一部分上以产生对应于目标电路几何形状的多个第二凹部。 导电材料印刷在第二凹槽的至少一部分中以产生电路几何形状。 电路几何形状包括电耦合到半导体器件上的电端子的多个暴露端子。

公开(公告)号：WO2010102182A1

公开(公告)日：2010-09-10

申请号：PCT/US2010/026326

申请日：2010-03-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  BUCHWALTER, Stephen, L. ,  GRUBER, Peter, A. ,  LAURO, Paul, A. ,  NAH, Jae-Woong

Inventor： BUCHWALTER, Stephen, L. ,  GRUBER, Peter, A. ,  LAURO, Paul, A. ,  NAH, Jae-Woong

IPC: B23K3/06

CPC classification number: B23K3/0638 ,  B23K3/08 ,  B23K2201/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract translation: 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。

公开(公告)号：WO2010061311A1

公开(公告)日：2010-06-03

申请号：PCT/IB2009/054988

申请日：2009-11-10

Applicant: TRONIC'S MICROSYSTEMS ,  AZOLEY, Philippe ,  GILET, Jean-Michel ,  NICOLAS, Stéphane

Inventor： AZOLEY, Philippe ,  GILET, Jean-Michel ,  NICOLAS, Stéphane

IPC: B81B7/00 ,  G01P1/02 ,  H01L23/485

CPC classification number: B81B7/007 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0118 ,  G01P1/023 ,  G01P15/0802 ,  H01L24/02 ,  H01L2224/04042 ,  H01L2224/48472 ,  H01L2924/01087 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A micro-electromechanical component (70) produced from a semiconductor substrate, comprising an internal moving portion (41) which includes conductive elements (44) and contacts (60) on its outer surface, said contacts (60) being electrically connected to said conductive elements (44), said electrical contacts (60) being capable of accommodating soldered interconnect wires (84) which are themselves designed to be connected to electrical contacts (81) provided on device (80) which accommodates said component (70), characterized in that electrical contacts (60) are arranged in an area which extends between upper face (12) of the component and lateral face(13), said contacts (60) having a concave shape and having two regions capable of accommodating soldered interconnect wires, said regions(61, 62) being substantially perpendicular to each other and parallel to said upper face (12) and said lateral face (13) respectively.

Abstract translation: 一种从半导体衬底产生的微机电部件（70），包括在其外表面上包括导电元件（44）和触点（60）的内部移动部分（41），所述触点（60）电连接到所述导电 元件（44），所述电触头（60）能够容纳焊接的互连线（84），所述焊接互连线本身设计成连接到设置在容纳所述部件（70）的器件（80）上的电触头（81），其特征在于 所述电触头（60）布置在在所述部件的上表面（12）和侧面（13）之间延伸的区域中，所述触头（60）具有凹形并且具有两个能够容纳焊接互连线的区域，所述 区域（61,62）分别基本上彼此垂直并且平行于所述上表面（12）和所述侧面（13）。