公开(公告)号：WO2006102606A2

公开(公告)日：2006-09-28

申请号：PCT/US2006/010866

申请日：2006-03-23

Applicant: PULSE ENGINEERING, INC. ,  GUTIERREZ, Aurelio, J. ,  RENTERIA, Victor ,  MACHADO, Russell, Lee ,  SCHAFFER, Chris ,  HINRICHS, Hank

Inventor： GUTIERREZ, Aurelio, J. ,  RENTERIA, Victor ,  MACHADO, Russell, Lee ,  SCHAFFER, Chris ,  HINRICHS, Hank

IPC: H05K7/20

CPC classification number: H01R24/64 ,  H01R13/6658 ,  H01R13/6675 ,  H01R2201/04

Abstract: An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract translation: 一个先进的连接器组件，能够接收和分配电源信号。 在一个实施例中，连接器包括单端口模块插座，并且包括设置在连接器壳体的后部中的插入组件。 插入组件包括第一和第二基板和适于接纳一个或多个电子或信号调节部件的腔。 在千斤顶内还利用除热特征以有效地散发由电子或信号调节部件产生的热量。 插入组件也可选地从插座壳体可移除，使得可以替换不同电子装置或端子构造的插入组件。 以这种方式，连接器可被配置成多个不同的标准（例如，千兆以太网，10/100等）。 还公开了用于制造上述实施例的方法。

公开(公告)号：WO2007117489A3

公开(公告)日：2008-12-11

申请号：PCT/US2007008354

申请日：2007-04-04

Applicant: PULSE ENG INC ,  RENTERIA VICTOR ,  SCHAFFER CHRIS ,  GUTIERREZ AURELIO J ,  MACHADO RUSSELL LEE

Inventor： RENTERIA VICTOR ,  SCHAFFER CHRIS ,  GUTIERREZ AURELIO J ,  MACHADO RUSSELL LEE

IPC: H01R13/66

CPC classification number: H05K7/10 ,  H01F17/062 ,  H01F27/02 ,  H01F27/027 ,  H01F27/263 ,  H01F2038/006 ,  H02M1/126 ,  H05K3/303 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49144

Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non¬ conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.

Abstract translation: 一种用于电气连接和封装电子部件的装置。 在一个实施例中，提供了具有一个或多个部件凹部和形成在其中的多个引线通道的模块化非导电基座部件。 至少一个电子部件设置在凹部内，并且部件的引线引导通过引线通道到导电引线端子。 适于与非导电基底构件配合的多个引线端子被容纳在其中，并且适于将装置与外部印刷电路板信号通信。 模块化非导电基座构件被组装或堆叠以形成整体模块化组件。 还公开了用于制造该器件的方法。

公开(公告)号：WO2006102606A3

公开(公告)日：2007-11-01

申请号：PCT/US2006010866

申请日：2006-03-23

Applicant: PULSE ENG INC ,  GUTIERREZ AURELIO J ,  RENTERIA VICTOR ,  MACHADO RUSSELL LEE ,  SCHAFFER CHRIS ,  HINRICHS HANK

Inventor： GUTIERREZ AURELIO J ,  RENTERIA VICTOR ,  MACHADO RUSSELL LEE ,  SCHAFFER CHRIS ,  HINRICHS HANK

IPC: H01R24/00

CPC classification number: H01R24/64 ,  H01R13/6658 ,  H01R13/6675 ,  H01R2201/04

Abstract: An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract translation: 一个先进的连接器组件，能够接收和分配电源信号。 在一个实施例中，连接器包括单端口模块插座，并且包括设置在连接器壳体的后部中的插入组件。 插入组件包括第一和第二基板和适于接纳一个或多个电子或信号调节部件的腔。 在千斤顶内还利用除热特征以有效地散发由电子或信号调节部件产生的热量。 插入组件也可选地从插座壳体可移除，使得可以替换不同电子装置或端子构造的插入组件。 以这种方式，连接器可被配置成多个不同的标准（例如，千兆以太网，10/100等）。 还公开了用于制造上述实施例的方法。

公开(公告)号：WO2007117489A2

公开(公告)日：2007-10-18

申请号：PCT/US2007/008354

申请日：2007-04-04

Applicant: PULSE ENGINEERING, INC. ,  RENTERIA, Victor ,  SCHAFFER, Chris ,  GUTIERREZ, Aurelio, J. ,  MACHADO, Russell, Lee

Inventor： RENTERIA, Victor ,  SCHAFFER, Chris ,  GUTIERREZ, Aurelio, J. ,  MACHADO, Russell, Lee

IPC: H01R13/66

CPC classification number: H05K7/10 ,  H01F17/062 ,  H01F27/02 ,  H01F27/027 ,  H01F27/263 ,  H01F2038/006 ,  H02M1/126 ,  H05K3/303 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49144

Abstract: A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non¬ conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.

Abstract translation: 一种用于电气连接和封装电子部件的装置。 在一个实施例中，提供了具有一个或多个部件凹部和形成在其中的多个引线通道的模块化非导电基座部件。 至少一个电子部件设置在凹部内，并且部件的引线引导通过引线通道到导电引线端子。 适于与非导电基底构件配合的多个引线端子被容纳在其中，并且适于将装置与外部印刷电路板信号通信。 模块化非导电基座构件被组装或堆叠以形成整体模块化组件。 还公开了用于制造该器件的方法。