公开(公告)号：WO2014012243A1

公开(公告)日：2014-01-23

申请号：PCT/CN2012/078921

申请日：2012-07-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  HUANG, Bing ,  OUYANG, Chu ,  ZHANG, Weixiang ,  SHEN, Shijun ,  ZHOU, Hengyuan ,  JIN, Yan ,  CHENG, Xuzhi

Inventor： HUANG, Bing ,  OUYANG, Chu ,  ZHANG, Weixiang ,  SHEN, Shijun ,  ZHOU, Hengyuan ,  JIN, Yan ,  CHENG, Xuzhi

IPC: B65D73/02

CPC classification number: H01L21/6835 ,  B65D37/00 ,  B65D73/02 ,  B65D75/40 ,  B65D2313/10 ,  C09J5/00 ,  C09J7/20 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67132 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68386 ,  H05K13/0084 ,  Y10T428/28 ,  Y10T428/2848

Abstract: A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate. The adhesive layer is disposed on the bottom wall of each pocket in the plurality of pockets, such that when a component is placed in a pocket in the plurality of pockets, the adhesive layer in the pocket permanently bonds to the component, and such that when the adhesive is exposed to UV radiation the adhesive bond strength is sufficiently reduced so that the component can be removed from the pocket.

Abstract translation: 用于运输多个部件的载带包括沿着载带的纵向轴线延伸的柔性基板，形成在基板中并沿着载带的纵向轴线间隔开的多个凹穴和粘合剂层。 每个口袋包括底壁和从底壁延伸到柔性基底顶表面的侧壁。 粘合剂层设置在多个袋中的每个袋的底壁上，使得当将一个部件放置在多个袋中的袋中时，袋中的粘合剂层永久地粘合到部件上，并且使得当 粘合剂暴露于UV辐射下，粘合剂粘合强度被充分降低，使得可以从口袋中去除该组分。

公开(公告)号：WO2013029261A1

公开(公告)日：2013-03-07

申请号：PCT/CN2011/079229

申请日：2011-09-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  ZHANG, Weixiang ,  SHEN, Shijun ,  HUANG, Bing

Inventor： ZHANG, Weixiang ,  SHEN, Shijun ,  HUANG, Bing

IPC: B65D65/40 ,  B32B9/04 ,  B32B27/08

CPC classification number: C09J7/0296 ,  B32B25/16 ,  B32B27/08 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B33/00 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2457/00 ,  C09J7/22 ,  C09J7/29 ,  C09J7/35 ,  H05K13/0084 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/2826

Abstract: A cover film for heat-sealing to a carrier tape for carrying electronic components is described herein. The cover film comprises a polyester base layer, a first antistatic layer disposed on a first surface of the base layer, an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, the first intermediate layer disposed on a second surface of the base layer opposite the first antistatic layer, the second intermediate layer disposed on the first intermediate layer opposite the base layer, a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer, and a heat-sealing layer disposed on the second antistatic layer. In an exemplary aspect, the first intermediate layer comprises polyethylene and the second intermediate layer comprises a poly(vinyl acetate) copolymer and a polystyrene- butadiene) copolymer. In another exemplary aspect, the second antistatic layer comprises carbon nanotubes in a polyacrylate binder.

Abstract translation: 本文描述了一种用于热封到用于承载电子部件的载带的覆盖膜。 覆盖膜包括聚酯基层，设置在基层的第一表面上的第一抗静电层，包括第一中间层和第二中间层的中间双层结构，第一中间层设置在第二表面的第二表面上 所述基底层与所述第一抗静电层相对，所述第二中间层设置在与所述基底层相对的所述第一中间层上，所述第二抗静电层设置在与所述第一中间层相对的所述第二中间层上，所述热封层设置在所述第二中间层 抗静电层。 在示例性方面，第一中间层包括聚乙烯，第二中间层包含聚（乙酸乙烯酯）共聚物和聚苯乙烯 - 丁二烯共聚物。 在另一示例性方面，第二抗静电层包含聚丙烯酸酯粘合剂中的碳纳米管。

公开(公告)号：WO2012079258A1

公开(公告)日：2012-06-21

申请号：PCT/CN2010/079964

申请日：2010-12-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  ZHANG, Weixiang ,  JIN, Zhou ,  SHEN, Shijun ,  ZHANG, Linlin ,  LI, Jiajun

Inventor： ZHANG, Weixiang ,  JIN, Zhou ,  SHEN, Shijun ,  ZHANG, Linlin ,  LI, Jiajun

IPC: B32B27/00 ,  B65D43/00 ,  H05K7/00

CPC classification number: B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2307/31 ,  B32B2307/412 ,  B32B2307/54 ,  B32B2405/00 ,  B32B2553/00

Abstract: The invention provides a heat-sealing film for packaging an electronic element, comprising: a base layer; at least one intermediate layer which is provided on the base layer and comprises a mixture comprising, in terms of 100% by weight of the total weight of the intermediate layer, 5-70 % by weight of a vinyl acetate copolymer, wherein the units derived from vinyl acetate comprise more than 10% by mole of the copolymer, 20-90 % by weight of a styrene-butadiene copolymer, and 0-40 % by weight of a conductive polymer; and at least a heat-sealing layer which is provided on the surface of the intermediate layer opposite to the base layer. The invention further provides a cover tape made of the heat-sealing film as described above.

Abstract translation: 本发明提供了一种用于封装电子元件的热封膜，包括：基底层; 至少一个中间层，其设置在基底层上并包含以中间层总重量的100重量％计的5-70重量％乙酸乙烯酯共聚物的混合物，其中衍生的单元 来自乙酸乙烯酯的共聚物含有超过10摩尔％，20-90重量％的苯乙烯 - 丁二烯共聚物和0-40重量％的导电聚合物; 以及至少设置在与基底层相反的中间层的表面上的热封层。 本发明还提供如上所述的由热封膜制成的覆盖带。