摘要:
Die vorliegende Erfindung betrifft ein Verfahren zur Wiederbelegung eines Schleifwerkzeugs (1), wobei das Schleifwerkzeug (1) einen Werkzeuggrundkörper (10) aufweist, der wenigstens eine Aufnahmefläche (11) zur Aufnahme von Schleifkörpern (12) aufweist, wobei die Schleifkörper (12) auf der Aufnahmefläche (11) mittels eines Klebemittels (13) aufgeklebt sind. Erfindungsgemäß umfasst das Verfahren wenigstens die folgenden Schritte: Degenerieren des Klebemittels (13'); Ablösen der abgenutzten Schleifkörper (12') vom Werkzeuggrundkörper (10), Ablösen des degenerierten Klebemittels (13') vom Werkzeuggrundkörper (10), Neuauftrag des Klebemittels (13) und Wiederbelegung des Werkzeuggrundkörper (10) mit neuen Schleifkörpern (12).
摘要:
An additive for imparting caustic removability to a hot melt adhesive includes a hydrocarbon copolymer containing one or more dicarboxylic acid moieties in at least partial ester form and a C5 hydrocarbon polymer comprising a polymeric backbone and, pendent thereon, one or more dicarboxylic acid moieties in at least partial ester form. The hydrocarbon copolymer and a C5 hydrocarbon polymer may have a weight average molecular weight less than 50,000, a flashpoint greater than or equal to 150°C, and may be soluble in a caustic solution having a pH of 8 or greater. A caustic removable hot melt adhesive composition may include the additive composition, a block copolymer, a tackifier, and/or a processing oil. The caustic removable hot melt adhesive composition may be applied to a label to adhere the label to the surface of an article, such as a recyclable bottle.
摘要:
The present invention relates to a process for detaching a component from an electronic assembly.In particular,the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).
摘要:
Switchable adhesion devices, systems and methods are provided. A switchable adhesion component includes a switchable body. At least one portion of the body is adapted to carry an adhesive layer and another portion a load. At least a portion of the body is switchable between one or more varying states without imparting change to the surface chemistries or area at the adhesive joint.
摘要:
A method for removing a label affixed to a material includes exposing the label to one or more of heat, hot gas, or hot liquid having a predetermined temperature, in the absence of any caustic solution, for a period sufficient for the label to release from the material to which it was affixed.
摘要:
A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7- tetramethylcyclotetra-siloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm.
摘要:
The present invention refers to a thermally debondable tape having a base adhesive layer and at least one thermally releasable adhesive layer comprising an adhesive and thermally expandable particles. The debondability even after long term storage or use shall be enhanced. In this regard the base adhesive layer has a lower adhesion at expansion temperature of the thermally expandable particles than at room temperature.
摘要:
An improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.