公开(公告)号：WO2006055645A3

公开(公告)日：2006-07-13

申请号：PCT/US2005041553

申请日：2005-11-09

Applicant: INTEL CORP ,  BURR JEREMY ,  POSAMENTIER JOSHUA ,  KOMMANDUR BADARI ,  ADAMS LEW ,  TYO RICHARD

Inventor： BURR JEREMY ,  POSAMENTIER JOSHUA ,  KOMMANDUR BADARI ,  ADAMS LEW ,  TYO RICHARD

IPC: G06K19/07 ,  H01L23/544

CPC classification number: H01L22/34 ,  G06K19/0723 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A radio frequency identification (RFID) antenna and/or RFID tag circuit may be fabricated on a substrate. The substrate may be a wafer, a die created from a wafer, or an integrated circuit package substrate. The RFID tag may also be distributed between the die and the package substrate in an integrated circuit package. In some embodiments the RFID tag may be fabricated in the lower layers of the substrate and become operational before the rest of the circuitry on the substrate has been fabricated.

Abstract translation: 射频识别（RFID）天线和/或RFID标签电路可以制造在基板上。 衬底可以是晶片，由晶片产生的管芯或集成电路封装衬底。 RFID标签也可以在集成电路封装中分布在管芯和封装衬底之间。 在一些实施例中，RFID标签可以制造在衬底的下层中，并且在衬底上的其余电路已被制造之前变得可操作。

公开(公告)号：WO2006055645A2

公开(公告)日：2006-05-26

申请号：PCT/US2005/041553

申请日：2005-11-09

Applicant: INTEL CORPORATION ,  BURR, Jeremy ,  POSAMENTIER, Joshua ,  KOMMANDUR, Badari ,  ADAMS, Lew ,  TYO, Richard

Inventor： BURR, Jeremy ,  POSAMENTIER, Joshua ,  KOMMANDUR, Badari ,  ADAMS, Lew ,  TYO, Richard

IPC: G06K19/07 ,  H01L23/544

CPC classification number: H01L22/34 ,  G06K19/0723 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A radio frequency identification (RFID) antenna and/or RFID tag circuit may be fabricated on a substrate. The substrate may be a wafer, a die created from a wafer, or an integrated circuit package substrate. The RFID tag may also be distributed between the die and the package substrate in an integrated circuit package. In some embodiments the RFID tag may be fabricated in the lower layers of the substrate and become operational before the rest of the circuitry on the substrate has been fabricated.

Abstract translation: 射频识别（RFID）天线和/或RFID标签电路可以被制造在基板上。 衬底可以是晶片，由晶片产生的管芯或集成电路封装衬底。 RFID标签也可以在集成电路封装中分布在管芯和封装衬底之间。 在一些实施例中，RFID标签可以被制造在衬底的下层中并且在衬底上的其余电路已经被制造之前变得可操作。