公开(公告)号：WO2016154494A4

公开(公告)日：2017-01-05

申请号：PCT/US2016024110

申请日：2016-03-24

Applicant: APPLE INC

Inventor： HOANG LAN H ,  KATAHIRA TAKAYOSHI ,  LIU CHANG

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/11 ,  H01L25/16

CPC classification number: H05K1/144 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L21/565 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0216 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/041 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

Abstract translation: 用于系统级封装模块的垂直屏蔽和互连结构，垂直屏蔽和互连结构容易制造并具有空间效率。

公开(公告)号：WO2016154494A3

公开(公告)日：2016-11-03

申请号：PCT/US2016024110

申请日：2016-03-24

Applicant: APPLE INC

Inventor： HOANG LAN H ,  KATAHIRA TAKAYOSHI ,  LIU CHANG

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/11 ,  H01L25/16

CPC classification number: H05K1/144 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L21/565 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0216 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/041 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

Abstract translation: 用于系统级封装模块的垂直屏蔽和互连结构，垂直屏蔽和互连结构容易制造并具有空间效率。