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    SYSTEMS, METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE BUFF PRE-CLEANING
    1.
    发明申请
    SYSTEMS, METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE BUFF PRE-CLEANING 审中-公开
    后期化学机械平面化系统的方法和装置底板清洗预清洗

    公开(公告)号：WO2015061741A1

    公开(公告)日：2015-04-30

    申请号：PCT/US2014/062264

    申请日：2014-10-24

    Applicant: APPLIED MATERIALS, INC

    Inventor： SAKATA, Clinton P. ,  CHEN, Hui ,  ATKINSON, Jim K. ,  BROWN, Brian J. ,  TANG, Jianshe ,  CHEN, Yufei ,  DING, Yunshuang

    IPC: B24B37/34 ,  B24B37/04 ,  B25J15/00

    CPC classification number: B08B1/006 ,  B08B1/04 ,  H01L21/67046

    Abstract: In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

    Abstract translation: 在一些实施例中，提供了一种用于清洁衬底的设备，其包括（1）衬底卡盘，其构造成支撑具有可接近的衬底的前侧的衬底; （2）抛光垫组件，其构造成支撑直径小于所述基底的直径的抛光垫; 和（3）摆动臂，其联接到所述抛光垫并且构造成沿着所述基板的前侧定位和旋转所述抛光垫，并且在清洁期间控制由所述抛光垫施加在所述基板的前侧上的力的量。 衬底卡盘，抛光垫组件和摆臂配置为抛光清洁衬底。 公开了许多附加方面。

    SEMICONDUCTOR SUBSTRATE CLEANING APPARATUS, SYSTEMS, AND METHODS
    2.
    发明申请
    SEMICONDUCTOR SUBSTRATE CLEANING APPARATUS, SYSTEMS, AND METHODS 审中-公开
    半导体基板清洁装置，系统和方法

    公开(公告)号：WO2013059009A1

    公开(公告)日：2013-04-25

    申请号：PCT/US2012/059148

    申请日：2012-10-06

    Applicant: APPLIED MATERIALS, INC

    Inventor： DING, Yunshuang ,  KO, Sen-Hou

    IPC: H01L21/302

    CPC classification number: H01L21/02074 ,  H01L21/67028 ,  H01L21/67046

    Abstract: Methods, apparatus, and systems for cleaning a substrate are provided. In one aspect, a substrate is scrubbed using an acidic cleaning solution in a first scrubber, transferred to a second scrubber after scrubbing the substrate using the acidic cleaning solution, followed by scrubbing the substrate in the second scrubber using a basic cleaning solution. Numerous additional aspects are disclosed.

    Abstract translation: 提供了用于清洁基底的方法，装置和系统。 在一个方面，使用第一洗涤器中的酸性清洁溶液洗涤基底，使用酸性清洁溶液洗涤基底后转移到第二洗涤器，然后使用基本清洁溶液洗涤第二洗涤器中的基底。 公开了许多附加方面。

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