公开(公告)号：WO2011049671A1

公开(公告)日：2011-04-28

申请号：PCT/US2010/046599

申请日：2010-08-25

Applicant: APPLIED MATERIALS, INC. ,  KO, Sen-Hou ,  KARUPPIAH, Lakshmanan

Inventor： KO, Sen-Hou ,  KARUPPIAH, Lakshmanan

IPC: H01L21/304

CPC classification number: B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

Abstract translation: 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的辊子，每个所述圆柱形滚筒可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱形滚筒以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

公开(公告)号：WO2014120775A1

公开(公告)日：2014-08-07

申请号：PCT/US2014/013607

申请日：2014-01-29

Applicant: APPLIED MATERIALS, INC

Inventor： KO, Sen-Hou ,  KARUPPIAH, Lakshmanan

IPC: H01L21/304 ,  H01L21/302

CPC classification number: H01L21/67046 ,  B08B1/008 ,  B08B1/04 ,  B24B37/107 ,  B24B37/34 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/02096 ,  H01L21/304 ,  H01L21/463 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/6838

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.

Abstract translation: 提供了一种用于在化学机械平面化（CMP）之后清洁衬底的方法和设备。 该装置包括壳体，可在第一轴线上旋转并被构造成将基底保持在基本垂直取向的衬底保持器，第一衬垫保持器具有以平行和间隔的关系面向衬底保持器的衬垫保持表面，第一衬垫 支架可在平行于第一轴线设置的第二轴线上旋转，第一致动器可操作以相对于衬底支架移动衬垫支架以改变第一轴线与第二轴线之间的距离，以及设置在壳体中的第二垫座， 所述第二焊盘保持器具有以平行和间隔的关系面对所述衬底保持器的焊盘保持表面，所述第二焊盘保持器可在平行于所述第一轴线和所述第二轴线的第三轴线上旋转。

公开(公告)号：WO2007070353A3

公开(公告)日：2007-06-21

申请号：PCT/US2006/046765

申请日：2006-12-07

Applicant: APPLIED MATERIALS, INC.

Inventor： WASINGER, Erik, C. ,  ETTINGER, Gary, C. ,  KO, Sen-Hou ,  HSU, Wei-Yung ,  CHEN, Liang-Yuh ,  SHIN, Ho, Seon ,  OLGADO, Donald

IPC: C03C15/00

Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

公开(公告)号：WO2013059009A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/059148

申请日：2012-10-06

Applicant: APPLIED MATERIALS, INC

Inventor： DING, Yunshuang ,  KO, Sen-Hou

IPC: H01L21/302

CPC classification number: H01L21/02074 ,  H01L21/67028 ,  H01L21/67046

Abstract: Methods, apparatus, and systems for cleaning a substrate are provided. In one aspect, a substrate is scrubbed using an acidic cleaning solution in a first scrubber, transferred to a second scrubber after scrubbing the substrate using the acidic cleaning solution, followed by scrubbing the substrate in the second scrubber using a basic cleaning solution. Numerous additional aspects are disclosed.

Abstract translation: 提供了用于清洁基底的方法，装置和系统。 在一个方面，使用第一洗涤器中的酸性清洁溶液洗涤基底，使用酸性清洁溶液洗涤基底后转移到第二洗涤器，然后使用基本清洁溶液洗涤第二洗涤器中的基底。 公开了许多附加方面。

公开(公告)号：WO2009132003A2

公开(公告)日：2009-10-29

申请号：PCT/US2009/041253

申请日：2009-04-21

Applicant: APPLIED MATERIALS, INC. ,  CHEN, Yufei ,  ZHANG, Zhenhua ,  KO, Sen-Hou ,  HSU, Wei-Yung ,  MATSUO, Makoto

Inventor： CHEN, Yufei ,  ZHANG, Zhenhua ,  KO, Sen-Hou ,  HSU, Wei-Yung ,  MATSUO, Makoto

IPC: H01L21/304

CPC classification number: B24B9/065 ,  B24B21/002

Abstract: Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device includes a base having a first surface; a resin layer adhering to the first surface of the base; and a plurality of abrasive beads affixed to the first surface by the resin layer, the plurality of abrasive beads comprising a plurality of abrasive particles suspended in binder material; wherein the plurality of abrasive beads and the resin layer comprise an abrasive side of the polishing device adapted to contact the substrate. Numerous other aspects are provided.

Abstract translation: 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置包括具有第一表面的基座; 粘附到所述基底的第一表面的树脂层; 以及通过树脂层固定到第一表面的多个研磨珠，所述多个研磨珠包含悬浮在粘合剂材料中的多个磨料颗粒; 其中所述多个研磨珠和所述树脂层包括适于接触所述基底的所述研磨装置的研磨侧。 提供了许多其他方面。

公开(公告)号：WO2014149755A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/020717

申请日：2014-03-05

Applicant: APPLIED MATERIALS, INC.

Inventor： CHEN, Hui ,  KO, Sen-Hou

IPC: H01L21/304

CPC classification number: H01L21/02065 ,  B08B1/002 ,  B08B1/006 ,  B08B1/04 ,  B08B3/10 ,  H01L21/02041 ,  H01L21/02087 ,  H01L21/31053 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67219 ,  H01L21/68764

Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.

Abstract translation: 提供了一种用于在化学机械平面化（CMP）之后清洁衬底的方法和设备。 该装置包括壳体，可在第一轴线上旋转并被配置为将基片保持在基本垂直取向的衬底保持器，第一衬垫保持器具有以平行且间隔开的关系面对衬底保持器的衬垫保持表面，第一衬垫 保持器可在平行于第一轴线旋转的第二轴线上旋转，第一致动器可操作以相对于衬底保持器移动衬垫保持器以改变限定在第一轴线和第二轴线之间的距离，以及设置在壳体中的第二衬垫保持架 ，所述第二焊盘保持器具有以平行和间隔的关系面对所述衬底保持器的焊盘保持表面，其中所述第二焊盘保持器与旋转臂耦合。

公开(公告)号：WO2013112902A1

公开(公告)日：2013-08-01

申请号：PCT/US2013/023244

申请日：2013-01-25

Applicant: APPLIED MATERIALS, INC.

Inventor： KO, Sen-Hou ,  CHEN, Hui

IPC: H01L21/302

CPC classification number: B24B53/017 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67751

Abstract: A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface.

Abstract translation: 颗粒清洁模块包括壳体，衬底保持器，衬垫保持器，致动器和衬垫调节器。 衬底保持器设置在壳体中，被配置为将基板保持在基本上垂直的方向，并且可在第一轴线上旋转。 衬垫保持器设置在壳体中，具有以平行和间隔的关系面对衬底保持器的衬垫保持表面，并且可在平行于第一轴线的第二轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器以改变限定在焊盘保持表面和基板之间的距离。 垫调节器设置在壳体中并且具有平行于衬垫保持表面定向的调节表面。

公开(公告)号：WO2013112196A1

公开(公告)日：2013-08-01

申请号：PCT/US2012/048199

申请日：2012-07-25

Applicant: APPLIED MATERIALS, INC. ,  KO, Sen-Hou ,  KARUPPIAH, Lakshmanan

Inventor： KO, Sen-Hou ,  KARUPPIAH, Lakshmanan

IPC: H01L21/304

CPC classification number: B08B1/006 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051

Abstract: A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.

Abstract translation: 提供了一种用于清洁基板的方法和装置。 在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。 衬底保持器被构造成以基本垂直的方向保持和旋转衬底。 焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。 衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

公开(公告)号：WO2011139388A1

公开(公告)日：2011-11-10

申请号：PCT/US2011/021147

申请日：2011-01-13

Applicant: APPLIED MATERIALS, INC. ,  CHEN, Hui ,  D'AMBRA, Allen L. ,  KO, Sen-Hou ,  CHEN, Yufei ,  BLANK, Adrian ,  SILVETTI, Mario D. ,  ALONZO, Geraldo J. ,  KARUPPIAH, Lakshmanan

Inventor： CHEN, Hui ,  D'AMBRA, Allen L. ,  KO, Sen-Hou ,  CHEN, Yufei ,  BLANK, Adrian ,  SILVETTI, Mario D. ,  ALONZO, Geraldo J. ,  KARUPPIAH, Lakshmanan

IPC: H01L21/302

CPC classification number: H01L21/67046 ,  H01L21/67051

Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

Abstract translation: 本发明的实施例涉及使用盘刷清洁衬底的装置和方法。 一个实施例提供一种基板清洁器，其包括设置在处理体积中的基板卡盘和设置在处理容积中的刷子组件，其中刷子组件包括可移动地布置成与基板卡盘相对的盘刷，以及盘刷触头的处理表面 基板卡盘上的基板的表面。

公开(公告)号：WO2008106221A1

公开(公告)日：2008-09-04

申请号：PCT/US2008/002701

申请日：2008-02-28

Applicant: APPLIED MATERIALS, INC. ,  KO, Sen-Hou ,  ZHANG, Zhenhua ,  CHEN, Yufei ,  HSU, Wei-Yung

Inventor： KO, Sen-Hou ,  ZHANG, Zhenhua ,  CHEN, Yufei ,  HSU, Wei-Yung

IPC: B24B7/00

CPC classification number: B24B9/065 ,  B24B57/02

Abstract: Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to the edge of the substrate; a second channel adapted to direct a second fluid onto a major surface of the rotating substrate; and a third channel adapted to direct a third fluid at the major surface of the substrate and to prevent the second fluid from diluting the first fluid. Numerous other aspects are provided.

Abstract translation: 提供了用于同时化学和机械抛光衬底边缘的方法和装置。 本发明包括适于旋转衬底的衬底支撑件; 抛光头，其适于接触所述基底的边缘，所述抛光头包括适于将第一流体施加到所述基底的边缘的第一通道; 第二通道，其适于将第二流体引导到所述旋转基板的主表面上; 以及第三通道，其适于在基底的主表面处引导第三流体并防止第二流体稀释第一流体。 提供了许多其他方面。