Abstract:
Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes are disclosed. An article such as an annular body may be formed by a compression molding technique. By including a patterned surface as part of an outer circumferential surface of the annular body, frictional contact between the annular body and the substrate may be enhanced as friction-reducing fluids associated with a wet chemical processes may be directed away from the desired friction contact area between the annular body and the substrate. In this manner, frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the effectively of the process.
Abstract:
Methods, apparatus, and systems are provided for detecting the presence of a substrate in a load cup. The invention includes a proximity sensor having a detection pad disposed below a contact surface of a load cup assembly and a target disposed on a lever member and adapted to move toward the detection pad when a substrate is placed on the lever member and adapted to move away from the detection pad when a substrate is removed from the lever member. Numerous additional aspects are disclosed.
Abstract:
A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
Abstract:
In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.
Abstract:
Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.