公开(公告)号：WO2013112301A1

公开(公告)日：2013-08-01

申请号：PCT/US2013/021184

申请日：2013-01-11

Applicant: APPLIED MATERIALS, INC

Inventor： LISCHKA, David J. ,  ATKINSON, Jim K. ,  DOMIN, Jonathan Paul ,  LIU, Andrew

IPC: B24B37/04 ,  B24B37/34 ,  H01L21/683

CPC classification number: G01B7/023

Abstract: Methods, apparatus, and systems are provided for detecting the presence of a substrate in a load cup. The invention includes a proximity sensor having a detection pad disposed below a contact surface of a load cup assembly and a target disposed on a lever member and adapted to move toward the detection pad when a substrate is placed on the lever member and adapted to move away from the detection pad when a substrate is removed from the lever member. Numerous additional aspects are disclosed.

Abstract translation: 提供了用于检测负载杯中的衬底的存在的方法，装置和系统。 本发明包括接近传感器，其具有设置在负载杯组件的接触表面下方的检测垫和设置在杆构件上的靶，并且当衬底放置在杆构件上并适于移动时， 当从所述杆构件移除基板时，从所述检测垫开始。 公开了许多附加方面。

公开(公告)号：WO2022182513A1

公开(公告)日：2022-09-01

申请号：PCT/US2022/015658

申请日：2022-02-08

Applicant: APPLIED MATERIALS, INC.

Inventor： LISCHKA, David J. ,  GURUSAMY, Jayus ,  LOI, Danielle ,  ZUNIGA, Steven M.

IPC: B24B37/30 ,  B24B41/06 ,  B24B55/03

Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

公开(公告)号：WO2008055174A2

公开(公告)日：2008-05-08

申请号：PCT/US2007/083045

申请日：2007-10-30

Applicant: APPLIED MATERIALS, INC. ,  BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  LISCHKA, David J.

Inventor： BENVEGNU, Dominic J. ,  SWEDEK, Boguslaw A. ,  LISCHKA, David J.

IPC: C03C15/00 ,  G06F19/00 ,  H01L21/306 ,  C23F1/00

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/12 ,  B24D7/12 ,  H01L21/31053 ,  H01L21/3212

Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.

Abstract translation: 抛光系统接收针对光谱中的选定峰值的一个或多个目标参数，抛光衬底，在抛光衬底的同时测量从衬底反射的光的当前光谱，识别 在当前谱图中选择的峰值，测量当前谱图中所选峰值的一个或多个当前参数，将所选峰值的当前参数与目标参数进行比较，并且当当前参数和目标参数具有时，停止抛光基板 一个预定义的关系。

公开(公告)号：WO2020068271A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/044557

申请日：2019-07-31

Applicant: APPLIED MATERIALS, INC.

Inventor： GURUSAMY, Jay ,  LISCHKA, David J. ,  ZUNIGA, Steven M.

IPC: B24B5/02

Abstract: A method and apparatus for a separable assembly in a platen assembly is provided. The two components of the separable assembly couple together through the first coupling member and the second coupling member, and the coupling is magnetic. The web assembly and hub assembly are placed or decoupled via the methods as described above. The separable components of the assembly reduce the cost and time of removing the entire platen assembly from the CMP system when maintenance or repair is to be performed.