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    RETAINING RING HAVING INNER SURFACES WITH FACETS
    1.
    发明申请
    RETAINING RING HAVING INNER SURFACES WITH FACETS 审中-公开
    具有表面的内表面的保持环

    公开(公告)号：WO2015164149A1

    公开(公告)日：2015-10-29

    申请号：PCT/US2015/026004

    申请日：2015-04-15

    Applicant: APPLIED MATERIALS, INC.

    Inventor： OH, Jeonghoon ,  ZUNIGA, Steven M. ,  NAGENGAST, Andrew J. ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam Shashank

    IPC: H01L21/304

    CPC classification number: H01L21/3212 ,  B24B37/04 ,  B24B37/32 ,  B24B41/06

    Abstract: A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an outer top perimeter and the bottom surface at an outer bottom perimeter, and an inner surface connected to the top surface at an inner top perimeter and the bottom surface at an inner bottom perimeter. The inner surface comprises seven or more planar facets. Adjacent planar facets are connected at corners. The inner bottom perimeter comprises straight edges of the planar facets connected at the corners.

    Abstract translation: 保持环包括大致环形体。 主体包括顶表面，底表面，外表面和外表面，外表面在外顶部周边处连接到顶表面，底表面连接到外底边周边，内表面在内顶部周边连接到顶表面， 底部表面处于内底部周边。 内表面包括七个或更多个平面。 相邻的平面小平面连接在角落处。 内底部周边包括连接在拐角处的平面的平直边缘。

    SENSORS IN CARRIER HEAD OF A CMP SYSTEM
    2.
    发明申请
    SENSORS IN CARRIER HEAD OF A CMP SYSTEM 审中-公开

    公开(公告)号：WO2014014661A8

    公开(公告)日：2014-01-23

    申请号：PCT/US2013/049169

    申请日：2013-07-02

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHEN, Hung Chih ,  DANDAVATE, Gautam Shashank ,  HSU, Samuel Chu-Chiang ,  KOOSAU, Denis M.

    IPC: H01L21/304 ,  H01L21/66

    Abstract: Sensors can be located in a carrier head for a chemical mechanical polishing system. In some implementations the carrier head includes a flexible membrane, and a thermocouple is positioned on the lower surface of the flexible membrane or embedded in the flexible membrane adjacent the lower surface. In some implementations, the carrier head optical sensor is secured to the head and positioned to sense a reflectivity of a spot on a back surface of a substrate held in the carrier head, and a controller is configured to receive a signal from the optical sensor and determine precession of the substrate based on the signal.

    SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD
    3.
    发明申请
    SUBSTRATE PRECESSION MECHANISM FOR CMP POLISHING HEAD 审中-公开
    CMP抛光头基板预处理机构

    公开(公告)号：WO2014158548A1

    公开(公告)日：2014-10-02

    申请号：PCT/US2014/018069

    申请日：2014-02-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHEN, Chih Hung ,  DANDAVATE, Gautam Shashank ,  GURUSAMY, Jay ,  HSU, Samuel Chu-Chiang

    IPC: H01L21/304

    CPC classification number: B24B37/32

    Abstract: A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.

    Abstract translation: 提供了一种用于载体头的基片进动装置。 该装置使得基板进动是基板抛光期间基板相对于载体头部的旋转运动。 承载头和保持环组件可以被去耦合并且在CMP过程期间彼此独立地移动以促进衬底进动。

    RETAINING RING WITH SELECTED STIFFNESS AND THICKNESS
    4.
    发明申请
    RETAINING RING WITH SELECTED STIFFNESS AND THICKNESS 审中-公开
    具有选择的刚度和厚度的保持环

    公开(公告)号：WO2014066119A1

    公开(公告)日：2014-05-01

    申请号：PCT/US2013/065320

    申请日：2013-10-16

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam Shashank

    IPC: H01L21/304

    CPC classification number: B24B37/32 ,  B24B7/00 ,  B24B7/228

    Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

    Abstract translation: 在化学机械抛光期间用于将基板保持在载体头下方的保持环包括环形下部和固定到下部的环形上部。 环形下部具有主体，其具有用于在抛光期间接触抛光垫的底表面，并且是第一材料。 上部的上表面构造成固定到承载头。 上部是比第一材料更刚性的第二材料。 选择下部的厚度和刚度用于特定的抛光环境以改善靠近基底边缘的抛光均匀性。

    MONITORING RETAINING RING THICKNESS AND PRESSURE CONTROL
    6.
    发明申请
    MONITORING RETAINING RING THICKNESS AND PRESSURE CONTROL 审中-公开
    监测保持环厚度和压力控制

    公开(公告)号：WO2014018238A1

    公开(公告)日：2014-01-30

    申请号：PCT/US2013/049269

    申请日：2013-07-03

    Applicant: APPLIED MATERIALS, INC.

    Inventor： DESHPANDE, Sameer ,  WANG, Zhihong ,  HSU, Samuel Chu-Chiang ,  DANDAVATE, Gautam Shashank ,  CHEN, Hung Chih ,  TU, Wen-Chiang

    IPC: H01L21/304 ,  H01L21/66

    CPC classification number: B24B37/005 ,  B24B37/30 ,  B24B49/105

    Abstract: A chemical mechanical polishing apparatus includes a carrier head including a retaining ring having a plastic portion with a bottom surface to contact a polishing pad, an in-situ monitoring system including a sensor that generates a signal that depends on a thickness of the plastic portion, and a controller configured to receive the signal from the in-situ monitoring system and to adjust at least one polishing parameter in response to the signal to compensate for non-uniformity caused by changes in the thickness of the plastic portion of the retaining ring.

    Abstract translation: 一种化学机械抛光装置，包括：承载头，包括具有接触抛光垫的底表面的塑料部分的保持环，包括产生取决于塑料部分的厚度的信号的传感器的原位监测系统， 以及控制器，被配置为从原位监测系统接收信号并且响应于信号调整至少一个抛光参数以补偿由保持环的塑料部分的厚度变化引起的不均匀性。

    SUBSTRATE EDGE TUNING WITH RETAINING RING
    8.
    发明申请
    SUBSTRATE EDGE TUNING WITH RETAINING RING 审中-公开
    基板边缘调整与保持环

    公开(公告)号：WO2012019144A2

    公开(公告)日：2012-02-09

    申请号：PCT/US2011/046828

    申请日：2011-08-05

    Applicant: APPLIED MATERIALS, INC. ,  CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  YUAN, Yin ,  ZHANG, Huanbo ,  DANDAVATE, Gautam Shashank ,  SILVETTI, Mario David

    Inventor： CHEN, Hung Chih ,  HSU, Samuel Chu-Chiang ,  YUAN, Yin ,  ZHANG, Huanbo ,  DANDAVATE, Gautam Shashank ,  SILVETTI, Mario David

    IPC: H01L21/304

    CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

    Abstract: A carrier head for a chemical mechanical polisher includes base, a substrate mounting surface, an annular inner ring, and an annular outer ring. The inner ring has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. The inner ring is vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad. The outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring. The lower surface of the inner ring has a first width, and the lower surface of the outer ring has a second width greater than the first width.

    Abstract translation: 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和环形外环。 所述内圈具有内表面，所述内表面被构造为围绕位于所述基板安装表面上的基板的边缘，外表面和与所述抛光垫接触的下表面。 内环可相对于基板安装表面垂直移动。 外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面。 外环可以相对于衬底安装表面和内环独立地上下移动。 内圈的下表面具有第一宽度，并且外环的下表面具有大于第一宽度的第二宽度。

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