公开(公告)号：WO2017155711A1

公开(公告)日：2017-09-14

申请号：PCT/US2017/019477

申请日：2017-02-24

Applicant: APPLIED MATERIALS, INC.

Inventor： KALITA, Laksheswar ,  GORADIA, Prerna A. ,  BAJAJ, Geetika ,  PAREEK, Yogita ,  LIN, Yixing ,  LUBOMIRSKY, Dmitry ,  KADAM, Ankur ,  THAKUR, Bipin ,  PAPKE, Kevin A. ,  VAIDYA, Kaushik

IPC: C25D5/50 ,  C25D3/54 ,  C25D9/12 ,  C23C16/455

Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.

Abstract translation: 本公开总体上涉及电化学形成氧化钇或氧化钇的方法。 所述方法可包括任选制备电化学浴，氧化钇或氧化钇电沉积到基材上，从基材表面去除溶剂，并在其上具有电沉积氧化钇或氧化钇的基材进行后处理。 / p>

公开(公告)号：WO2017155671A1

公开(公告)日：2017-09-14

申请号：PCT/US2017/017817

申请日：2017-02-14

Applicant: APPLIED MATERIALS, INC.

Inventor： PAREEK, Yogita ,  KALITA, Laksheswar ,  BAJAJ, Geetika ,  PAPKE, Kevin A. ,  KADAM, Ankur ,  THAKUR, Bipin ,  LIN, Yixing ,  LUBOMIRSKY, Dmitry ,  GORADIA, Prerna A.

IPC: H01L21/28 ,  H01L21/02

Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

Abstract translation: 本公开总体上涉及电化学形成铝或氧化铝的方法。 该方法可包括任选地制备电化学浴，将铝或氧化铝电沉积到基材上，从基材表面除去溶剂，并在其上具有电沉积铝或氧化铝的基材进行后处理。 / p>

公开(公告)号：WO2020009766A1

公开(公告)日：2020-01-09

申请号：PCT/US2019/035180

申请日：2019-06-03

Applicant: APPLIED MATERIALS, INC.

Inventor： BALARAMAN, Karthikeyan ,  BINDIGANAVALE, Sathyanarayana ,  PATIBANDLA, Rajasekhar ,  RAMASAMY, Balamurugan ,  SHAH, Kartik ,  KELKAR, Umesh M. ,  LARSSON, Mats ,  PAPKE, Kevin A. ,  LU, William M.

IPC: C23C16/44 ,  C23C14/06 ,  C23C14/02 ,  C23C28/00 ,  C23C28/04 ,  H01J37/32 ,  C23C16/505

Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20°C to about 300°C during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.

公开(公告)号：WO2018147987A1

公开(公告)日：2018-08-16

申请号：PCT/US2018/014269

申请日：2018-01-18

Applicant: APPLIED MATERIALS, INC.

Inventor： TABASSUM, Tasnuva ,  LARSSON, Mats ,  PAPKE, Kevin A.

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/66

CPC classification number: G01N33/005 ,  G01N33/2025 ,  G01N2033/0095 ,  G01N2033/0096

Abstract: Embodiments of the disclosure generally relate to a system, apparatus and method for testing a coating over a semiconductor chamber component. In one embodiment, a test station comprises a hollow tube, a sensor coupled to a top end of the tube and a processing system communicatively coupled to the sensor. The hollow tube has an open bottom end configured for sealingly engaging a coating layer of the semiconductor chamber component. The sensor is configured to detect the presence of a gaseous byproduct of a reaction between a reagent disposed in the hollow tube and a base layer disposed under the coating layer. The processing system is configured to determine exposure of the base layer through the coating layer in response to information about the presence of the gaseous byproduct. In another embodiment, the processing system is communicatively coupled to each sensor of a plurality of test stations.

公开(公告)号：WO2017180304A1

公开(公告)日：2017-10-19

申请号：PCT/US2017/023642

申请日：2017-03-22

Applicant: APPLIED MATERIALS, INC.

Inventor： WANG, Jianqi ,  LU, William Ming-Ye ,  LIN, Yixing ,  PAPKE, Kevin A.

IPC: H01L21/67 ,  H01L21/02

Abstract: The implementations described herein generally relate to 30nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.

Abstract translation: 这里描述的实现通常涉及分析和清洗半导体处理设备的30nm在线液体颗粒计数测试设备。 更具体地说，所描述的实施方式涉及用于稀释，分析和改变流体以使得能够观察流体内容物的系统。 稀释取样工具与液体颗粒检测器耦合，用于在清洗槽中读取含有来自半导体处理设备（例如衬里，护罩，面板或喷头）的颗粒的提取溶液的内含物。 因此，可能会有精确的液体颗粒读数，从而减少颗粒检测器的过饱和度。

公开(公告)号：WO2021029970A1

公开(公告)日：2021-02-18

申请号：PCT/US2020/038873

申请日：2020-06-22

Applicant: APPLIED MATERIALS, INC.

Inventor： BAJAJ, Geetika ,  PAREEK, Yogita ,  THAKARE, Darshan ,  GORADIA, Prerna Sonthalia ,  KADAM, Ankur ,  PAPKE, Kevin A.

IPC: H01J37/32 ,  C23C28/00 ,  C23C16/44

Abstract: The present disclosure relates to protective multilayer coatings for processing chambers and processing chamber components. In one embodiment, a multilayer protective coating includes a metal nitride layer and an oxide layer disposed thereon. In one embodiment, the multilayer protective coating further includes an oxynitride interlayer and/or an oxyfluoride layer. The multilayer protective coating may be formed on a metal alloy or ceramic substrate, such as a processing chamber or a processing chamber component used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, the metal nitride layer and the oxide layer are deposited on the substrate by atomic layer deposition.

公开(公告)号：WO2020013918A1

公开(公告)日：2020-01-16

申请号：PCT/US2019/033383

申请日：2019-05-21

Applicant: APPLIED MATERIALS, INC.

Inventor： BALARAMAN, Karthikeyan ,  RAMASAMY, Balamurugan ,  SHAH, Kartik ,  LARSSON, Mats ,  PAPKE, Kevin A. ,  PATIBANDLA, Rajasekhar ,  BINDIGANAVALE, Sathyanarayana ,  KELKAR, Umesh M.

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/02

Abstract: Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.

公开(公告)号：WO2019050620A1

公开(公告)日：2019-03-14

申请号：PCT/US2018/041670

申请日：2018-07-11

Applicant: APPLIED MATERIALS, INC.

Inventor： NANGOY, Roy C. ,  D'AMBRA, Allen L. ,  PAPKE, Kevin A.

IPC: H01L21/67 ,  H01L21/02

Abstract: Disclosed herein is an apparatus for cleaning a process kit comprising a body, a cleaning source, and a control system. The body is formed from multiple modules configured to couple to, and receive therein, a process kit part. A plurality of cleaning agents may be sequentially delivered to the body in order to remove the particles disposed on the process part.