Abstract:
Piezoelectric devices and methods for forming the piezoelectric devices are provided. The piezoelectric device includes a piezoelectric film disposed on a substrate, where the piezoelectric film contains formamidinium tin iodide and one or more polymeric materials. The piezoelectric device also includes one or more electrodes coupled to, disposed on, or at least in contact with the piezoelectric film. In some embodiments, the piezoelectric film contains a piezoelectric composite material which contains the formamidinium tin iodide and the polymeric material uniformly distributed throughout the piezoelectric composite material. In other embodiments, the piezoelectric film contains a piezoelectric film stack which contains a first layer containing the formamidinium tin iodide and a second layer containing the polymeric material.
Abstract:
Apparatus and methods of substrate temperature control during thin film solar cell manufacturing are provided. One method comprises performing a temperature stabilization process on a substrate to pre-heat the substrate for a time period in a first chamber, calculating a wait time period for a second chamber, wherein the wait time period is bases on the availability of the second chamber, the availability of a vacuum transfer robot adapted to transfer the substrate from the first chamber to the second chamber, or both, and adjusting the temperature stabilization time period to compensate for the loss of heat from the substrate during the wait time period.
Abstract:
Methods for sputter depositing a transparent conductive oxide (TCO) layer are provided in the present invention. The transparent conductive oxide layer may be utilized as a back reflector in a photovoltaic device. In one embodiment, the method includes providing a substrate in a processing chamber, forming a first portion of a transparent conductive oxide layer on the substrate by a first sputter deposition step, and forming a second portion of the transparent conductive oxide layer by a second sputter deposition step.
Abstract:
Embodiments of the present disclosure generally relate to methods for refurbishing aerospace components by removing corrosion and depositing protective coatings. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer.
Abstract:
An additive manufacturing apparatus includes a platform, a dispenser to dispense successive layers of feed material on the platform, a heater configured to heat feed material on spatially and intensity controllable basis on the platform, an energy source to emit a beam of energy to impinge a topmost layer of the feed material to generate a melt pool from the feed material, a thermal imager having a field of view of a build region of the platform and configured to generate a thermal image of the topmost layer of the feed material in the build region, a high- speed camera configured to monitor a region where the energy beam impinges the topmost layer of the feed material, and a controller.
Abstract:
A process for generating a compact alumina passivation layer on an aluminum component includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to concentrated nitric acid, at a temperature below 10°C, for one to 30 minutes. The process also includes rinsing the component in deionized water for at least one minute, drying it for at least one minute, and exposing it to NH 4 OH for one second to one minute. The process further includes rinsing the component in deionized water for at least one minute and drying it for at least one minute. A component for use in a plasma processing system includes an aluminum component coated with an Al x O y film having a thickness of 4 to 8nm and a surface roughness less than 0.05μm greater than a surface roughness of the component without the Al x O y film.
Abstract translation:在铝组分上产生紧密的氧化铝钝化层的方法包括在去离子水中漂洗至少1分钟,将其干燥至少1分钟,并在低于10℃的温度下将其暴露于浓硝酸中, 一到三十分钟。 该方法还包括将去离子水中的组分冲洗至少1分钟,将其干燥至少1分钟,并将其暴露于NH 4 OH 1秒至1分钟。 该方法还包括将组分在去离子水中冲洗至少1分钟并将其干燥至少一分钟。 用于等离子体处理系统的部件包括涂覆有厚度为4至8nm的Al x O y膜并且表面粗糙度小于不含Al x O y膜的部件的表面粗糙度小于0.05μm的铝部件。
Abstract:
Disclosed are methods and apparatus for depositing uniform layers on a substrate (201) for piezoelectric applications. An ultra-thin seed layer (308) having a uniform thickness from center to edge thereof is deposited on a substrate (201). A template layer (310) closely matching the crystal structure of a subsequently formed piezoelectric material layer (312) is deposited on a substrate (201). The uniform thickness and orientation of the seed layer (308) and the template layer (310), in turn, facilitate the growth of piezoelectric materials with improved crystallinity and piezoelectric properties.
Abstract:
Embodiments of the present disclosure generally relate to methods for detecting end-points of cleaning processes for aerospace components containing corrosion. The method includes exposing the aerospace component to a first solvent, exposing the aerospace component to a first water rinse, and analyzing a first aliquot of the first water rinse by absorbance spectroscopy to determine an intermediate solute concentration in the first aliquot, where the intermediate solute concentration is greater than a reference solute concentration. The method further includes exposing the aerospace component to an aqueous cleaning solution to remove corrosion from the aluminum oxide layer, exposing the aerospace component to a second solvent, and exposing the aerospace component to a second water rinse, and analyzing a second aliquot of the second water rinse by absorbance spectroscopy to determine a post-clean solute concentration in the second aliquot, where the post-clean solute concentration is less than the intermediate solute concentration.
Abstract:
A piezoelectric device includes a substrate, a thermal oxide layer on the substrate, a metal or metal oxide adhesion layer on the thermal oxide layer, a lower electrode on the metal oxide adhesion layer, a seed layer on the lower electrode, a lead magnesium niobate-lead titanate (PMNPT) piezoelectric layer on the seed layer, and an upper electrode on the PMNPT piezoelectric layer.
Abstract:
A method of fabricating a piezoelectric layer includes depositing a piezoelectric material onto a substrate in a first crystallographic phase by physical vapor deposition while the substrate remains at a temperature below 400 °C, and thermally annealing the substrate at a temperature above 500 °C to convert the piezoelectric material to a second crystallographic phase. The physical vapor deposition includes sputtering from a target in a plasma deposition chamber.