公开(公告)号：WO0231227A3

公开(公告)日：2005-08-18

申请号：PCT/US0131943

申请日：2001-10-12

Applicant: APPLIED MATERIALS INC

Inventor： HEY H PETER W ,  DORDI YEZDI N ,  OLGADO DONALD J K ,  DENOME MARK

IPC: C25D7/12 ,  C25D21/12 ,  H01L21/00 ,  H01L21/687

CPC classification number: H01L21/68721 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  H01L21/67155 ,  H01L21/68728

Abstract: A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Abstract translation: 一种用于在具有金属种子层的基板上电化学沉积金属膜的方法和相关设备。 该设备包括保持基板的基板保持器。 电解质电池在处理位置接收基板。 致动器连接到衬底支架并且可调整地将衬底相对于电解质单元定位。 该方法包括在具有金属种子层的基板上电化学沉积金属膜，包括将基板设置在配置为接收基板的电解质电池中。 该方法包括相对于电解质电池可调节地定位衬底。

公开(公告)号：WO0229137A9

公开(公告)日：2007-03-08

申请号：PCT/US0130058

申请日：2001-09-26

Applicant: APPLIED MATERIALS INC

Inventor： DORDI YEZDI N ,  STEVENS JOSEPH J ,  SUGARMAN MICHAEL N

IPC: C25D7/12 ,  C25D21/00 ,  C25D21/04 ,  H01L21/288 ,  H05K3/24

CPC classification number: C25D7/123 ,  C25D21/00 ,  C25D21/04 ,  H01L21/2885 ,  H05K3/241

Abstract: An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

Abstract translation: 描述了电化学电镀系统。 通过将形成在基板上的籽晶层浸渍在电解液中的电化学电镀系统进行。 一方面，当基板进入电解质溶液时，通过使基板倾斜以限制基板和基板支架之间的电解液中的气泡的捕获或形成，将基板浸入电化学电镀系统中。 在另一方面，提供一种用于电镀的设备，其包括电池，衬底保持器和致动器。 致动器可以在x和z方向上移动基板保持器组件，并且还使基板倾斜。 在另一方面，提供一种驱动由电解质溶液形成的弯液面跨越衬底的表面的方法。 该方法包括当基底浸入电解质溶液时增强电解液溶液弯液面与表面之间的相互作用。

公开(公告)号：WO2004013381A2

公开(公告)日：2004-02-12

申请号：PCT/US0324621

申请日：2003-08-06

Applicant: APPLIED MATERIALS INC

Inventor： KOVARSKY NICOLAY Y ,  LUBOMIRSKY DMITRY ,  CHANG ANZHONG ,  DORDI YEZDI N ,  YANG MICHAEL X

IPC: C25D7/12 ,  C25D21/18 ,  C25D21/22 ,  H01L21/288 ,  C25D

CPC classification number: H01L21/2885 ,  C25D7/123 ,  C25D21/18 ,  C25D21/22

Abstract: Embodiments of the invention generally provide a method and apparatus for plating a metal on a substrate. The electrochemical plating system generally includes a plating cell having an anolyte compartment and a catholyte compartment, the anolyte compartment having an insoluble anode and an anolyte therein. The catholyte compartment generally includes a substrate support member and a catholyte therein. In addition, the plating cell generally includes an ion-exchange membrane disposed between the anolyte compartment and the catholyte compartment and a pump in fluid communication with the anolyte compartment, the pump configured to provide an anolyte to the anolyte compartment having a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method generally includes supplying an anolyte solution to an anolyte compartment disposed in a plating cell having an anolyte compartment and a catholyte compartment. The anolyte solution generally passes through the anolyte compartment at a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method further includes plating a metal onto the substrate with a catholyte solution disposed in a catholyte compartment of the plating cell, the catholyte compartment and the anolyte compartment separated by an ion-exchange membrane, removing used anolyte solution from the plating cell and passing at least a portion of the used anolyte solution through a correction device including at least one of copper oxide, copper hydroxide and combinations thereof.

Abstract translation: 本发明的实施例通常提供一种用于在基底上电镀金属的方法和装置。 电化学电镀系统通常包括具有阳极电解液室和阴极电解液隔室的电镀槽，阳极电解液室具有不溶性阳极和阳极电解液。 阴极电解液隔室通常在其中包括基板支撑构件和阴极电解液。 此外，电镀槽通常包括设置在阳极电解液室和阴极电解液室之间的离子交换膜和与阳极电解液室流体连通的泵，所述泵被配置为向阳极电解液室提供线性速度介于 约0.5cm / sec至约50cm / sec。 该方法通常包括将阳极电解液供应到设置在具有阳极电解液室和阴极电解液室的电镀槽中的阳极电解液室。 阳极电解液通常以约0.5cm / sec至约50cm / sec的线速度穿过阳极电解液室。 该方法还包括用设置在电镀池的阴极电解液室中的阴极电解液，阴离子电解质隔室和由离子交换膜隔开的阳极电解液室将金属电镀到基板上，从电镀槽中除去使用的阳极电解液并通过 通过包括氧化铜，氢氧化铜及其组合中的至少一种的校正装置的至少一部分所使用的阳极电解液。

公开(公告)号：WO0219418A3

公开(公告)日：2003-05-08

申请号：PCT/US0126597

申请日：2001-08-27

Applicant: APPLIED MATERIALS INC

Inventor： CARL DANIEL A ,  CHIN BARRY ,  CHEN LIANG ,  CHEUNG ROBIN ,  DING PEIJUN ,  DORDI YEZDI N ,  HASHIM IMRAN ,  HEY PETER W ,  SINHA ASHOK K

IPC: H01L21/288 ,  H01L21/768

CPC classification number: H01L21/2885 ,  H01L21/76877

Abstract: One aspect of the invention provides a consistent metal electroplating technique to form void-less metal interconnects in sub-micron high aspect ratio features on semiconductor substrates. One embodiment of the invention provides a method for filling sub-micron features (214) on a substrate, comprising reactive precleaning the substrate, depositing a barrier layer (218) on the substrate using high density plasma physical vapor deposition; depositing a seed layer (220) over the barrier layer using high density plasma physical vapor deposition; and electro-chemically depositing a metal (222) using a highly resistive electrolyte and applying a first current density during a first deposition period followed by a second current density during a second period.

Abstract translation: 本发明的一个方面提供一致的金属电镀技术，以在半导体衬底上形成亚微米高纵横比特征的无空隙金属互连。 本发明的一个实施例提供了一种用于在基底上填充亚微米特征（214）的方法，其包括反应性预清洗所述基底，使用高密度等离子体物理气相沉积在所述基底上沉积阻挡层（218） 使用高密度等离子体物理气相沉积在阻挡层上沉积种子层（220）; 以及使用高电阻电解质电化学沉积金属（222），并且在第一周期期间在第一沉积周期期间施加第一电流密度，然后施加第二电流密度。

公开(公告)号：WO0204715A3

公开(公告)日：2005-08-04

申请号：PCT/US0120622

申请日：2001-06-28

Applicant: APPLIED MATERIALS INC

Inventor： HEY H PETER W ,  DORDI YEZDI N ,  OLGADO DONALD J K ,  DENOME MARK

IPC: C25D7/12 ,  C25D21/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/687 ,  H05K3/24

CPC classification number: H01L21/67126 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67155 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68785 ,  H05K3/241

Abstract: A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Abstract translation: 一种用于在具有金属种子层的基底上电化学沉积金属膜的方法和相关装置。 该装置包括保持基板的基板支架。 电解质电池在处理位置接收衬底。 致动器连接到基板保持器并且可调节地将基板相对于电解质电池定位。 该方法包括在具有金属种子层的基底上电化学沉积金属膜，包括将基底设置在被配置为接收基底的电解质电池中。 该方法包括相对于电解质电池可调整地定位衬底。

公开(公告)号：WO0204704A3

公开(公告)日：2005-04-28

申请号：PCT/US0121436

申请日：2001-07-06

Applicant: APPLIED MATERIALS INC

Inventor： DORDI YEZDI N ,  HEY PETER W

IPC: C23C18/16 ,  C25D7/12 ,  H01L21/687

CPC classification number: H01L21/68728 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/31 ,  C23C18/36 ,  C25D5/50 ,  C25D7/123 ,  H01L21/68742 ,  H01L21/68792

Abstract: Methods and apparatus for forming a conformal conductive layer on a substrate for an electroplating process are provided. In one aspect, a method is provided for processing a substrate including depositing a conductive barrier layer on the substrate, and then depositing a nucleation layer on the conductive barrier layer. The nucleation layer is deposited by depositing a first conductive material on the substrate and then depositing a second conductive material on the first conductive material by an electroless deposition process. The second conductive material may comprise nickel, tin, or combinations thereof. The substrate may then be further processed by electroplating a third conductive material on the second conductive material and/or annealing the substrate.

Abstract translation: 提供了在用于电镀工艺的衬底上形成保形导电层的方法和装置。 在一个方面，提供了一种用于处理衬底的方法，包括在衬底上沉积导电阻挡层，然后在导电阻挡层上沉积成核层。 通过在衬底上沉积第一导电材料然后通过无电沉积工艺将第二导电材料沉积在第一导电材料上来沉积成核层。 第二导电材料可以包括镍，锡或其组合。 然后可以通过在第二导电材料上电镀第三导电材料和/或退火衬底来进一步处理衬底。

公开(公告)号：WO0204712A3

公开(公告)日：2004-07-08

申请号：PCT/US0120625

申请日：2001-06-28

Applicant: APPLIED MATERIALS INC

Inventor： DORDI YEZDI N ,  STEVENS JOSEPH J ,  HEY H PETER W ,  OLGADO DONALD J K

IPC: C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  H01L21/288 ,  H05K3/24

CPC classification number: C25D17/008 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H05K3/241

Abstract: An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.

Abstract translation: 一种包括电解质电池，阳极和多孔刚性扩散器的装置。 电解质电池被配置为接收衬底以在其上沉积金属膜。 阳极被包含在电解质电池内。 多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。 当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

公开(公告)号：WO2004009878A3

公开(公告)日：2005-03-24

申请号：PCT/US0323356

申请日：2003-07-24

Applicant: APPLIED MATERIALS INC

Inventor： YANG MICHAEL X ,  LUBOMIRSKY DMITRY ,  DORDI YEZDI N ,  SINGH SARAVJEET ,  TULSHIBAGWALE SHESHRAJ ,  KOVARSKY NICOLAY

IPC: A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  C07F9/10 ,  C25D7/12 ,  H01L21/288 ,  C25D17/00 ,  H01L21/00

CPC classification number: H01L21/2885 ,  A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  C07F9/103 ,  C25D7/123 ,  C25D17/001

Abstract: Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.

Abstract translation: 本发明的实施方案通常可以提供小体积的电化学电镀单元。 电镀槽通常包括配置成在其中容纳电镀液的流体池，流体池具有基本上水平的堰。 电池还包括位于流体槽的下部的阳极，阳极具有穿过其形成的多个平行通道，以及构造成容纳阳极的基座构件，基座构件具有形成为阳极接收的多个槽 多个槽中的每一个终止于环形排水通道。 提供了一种膜支撑组件，其被配置为将膜垂直于阳极定位在相对于阳极表面的基本上平面的方向上，膜支撑组件具有形成在其中的多个通道和孔。

公开(公告)号：WO2004009875A3

公开(公告)日：2004-06-10

申请号：PCT/US0322996

申请日：2003-07-24

Applicant: APPLIED MATERIALS INC

Inventor： LUBOMIRSKY DMITRY ,  SINGH SARAVJEET ,  DORDI YEZDI N ,  TULSHIBAGWALE SHESHRAJ

IPC: C25D7/12 ,  C25D17/02 ,  C25D21/00 ,  H01L21/68 ,  C25D17/00 ,  H05K3/42

CPC classification number: C25D17/02 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00

Abstract: A method and apparatus for immersing a substrate for plating operations. The apparatus generally includes a plating cell configured containing a plating solution therein. The plating cell includes at least one fluid basin, a diffusion plate position in a lower portion of the at least one fluid basin, and an anode positioned below the diffusion plate, the anode and the diffusion plate being positioned in parallel orientation with each other and in a tilted orientation with respect to horizontal. The apparatus further includes a head assembly positioned proximate the plating cell, the head assembly including a base member, an actuator positioned at a distal end of the base member, and a substrate support assembly in mechanical communication with the actuator, the substrate support assembly being configured to support a substrate in the at least one fluid basin for processing in an orientation that is generally parallel to the diffusion plate.

Abstract translation: 一种用于浸渍电镀操作的基板的方法和装置。 该装置通常包括在其中包含电镀液的电镀单元。 所述电镀单元包括至少一个流体池，位于所述至少一个流体槽的下部的扩散板位置和位于所述扩散板下方的阳极，所述阳极和所述扩散板彼此平行取向地定位， 相对于水平方向倾斜。 所述装置还包括位于所述电镀单元附近的头部组件，所述头部组件包括基座构件，位于所述基座构件的远端的致动器以及与所述致动器机械连通的衬底支撑组件，所述衬底支撑组件 被配置为支撑所述至少一个流体池中的基底，用于以大致平行于所述扩散板的取向进行处理。

公开(公告)号：WO0204711A3

公开(公告)日：2004-05-06

申请号：PCT/US0120624

申请日：2001-06-28

Applicant: APPLIED MATERIALS INC

Inventor： DORDI YEZDI N ,  STEVENS JOSEPH J ,  SUGARMAN MICHAEL N

IPC: C25D7/12 ,  C25D21/00 ,  C25D21/04 ,  C25D21/10 ,  H01L21/00 ,  H01L21/288 ,  H05K3/24

CPC classification number: H01L21/67167 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00 ,  C25D21/04 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6723 ,  H05K3/241

Abstract: An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

Abstract translation: 描述了电化学电镀系统。 通过将形成在基板上的籽晶层浸渍在电解液中的电化学电镀系统进行。 一方面，当基板进入电解质溶液时，通过使基板倾斜以限制基板和基板支架之间的电解液中的气泡的捕获或形成，将基板浸入电化学电镀系统中。 在另一方面，提供一种用于电镀的设备，其包括电池，衬底保持器和致动器。 致动器可以在x和z方向上移动基板保持器组件，并且还使基板倾斜。 在另一方面，提供一种驱动由电解质溶液形成的弯液面跨越衬底的表面的方法。 该方法包括当基底浸入电解质溶液时增强电解液溶液弯液面与表面之间的相互作用。