Abstract:
The present invention relates to a speaker assembly with three-dimensional directional multiple speaker units so as to provide a sound system in the form of a speaker box having multiple speaker units. More particularly, the present invention relates to a speaker assembly having a plurality of planar major surfaces and comprising a plurality of speaker units disposed within said major surfaces. A first major surface first speaker unit (1 ) and a first major surface second speaker unit (2) being effective are disposed within a first surface (5). A second major surface speaker unit (4) is disposed within a second surface (6) and an intermediate surface speaker unit (3) is disposed within a third major surface of the speaker assembly neighbouring said first and second surfaces (5, 6) and disposed thereinbetween.
Abstract:
The present invention relates to an image display device capable of adapting the sound pressure level based on the ambient pressure variance according to the specific environment of said image display device. More particularly, the present invention relates to an image display device comprising at least one loudspeaker and an adaptive sound pressure level adjustment system automatically effectuating sound optimization through sound pressure level adjustment by way of analyzing pressure deviances in the surrounding of said image display device.
Abstract:
The present invention relates a method for soldering a shield (2) to a PCB (1), the method of soldering comprising the steps of, inserting four shield pins (3) into a PCB (1), providing the PCB (1) with solder, cutting a planar sheet's four corners to obtain a flat sheet with removed square cut-outs at the corners and forming four side extensions (5) by bending four edges of the flat part (4) in one direction such that the flat part (4) is surrounded by substantially right-angled side extensions (5) in the form of a shield (2).
Abstract:
The present invention relates to a locking mechanism (1) which can be surface mounted onto the electronic card in a manner suitable for automation by means of the weldable metal plate (2) or metal rods (4).
Abstract:
The present invention relates to clip-on pin configurations for improving soldering performance of components mounted onto the electronic cards. The present invention particularly relates to, in a circuit component (1) comprising at least one pin (6) which can be placed onto a circuit board (3) with at least one pin housing (7) suitable for the placement of at least one pin (6), a clip (4) which enables the same to be locked onto said circuit board (3) and which is fixed so as to move over said pin (6).
Abstract:
The present invention relates to a system for surface mount heat sinks for printed circuit boards (PCB) and a method for assembling a PCB having said heat sinks. The present invention more particularly relates to a printed circuit board assembly comprising a printed circuit board (1), a circuit unit (3) and a heat sink (4), said circuit unit (3) being attached to said printed circuit board (1) in a manner to be interposed between said printed circuit board (1) and said heat sink (4).
Abstract:
The present invention relates to an improved printed circuit board (PCB) surface mount connection structure. The present invention more particularly relates to a printed circuit board (1) comprising at least one circuit component (5) in electrical connection with conductive paths or bond pads of said printed circuit board (1), said printed circuit board (1) further comprising at least one outer substrate layer provided with a recess (8).