Abstract:
The present invention relates to a lithographic immersion apparatus comprising a fluid handling structure and a device manufacturing method. In an embodiment, the fluid handling structure is configured to confine immersion fluid to a region and comprises a gas knife system, the gas knife system comprising passages each having an exit, the passages comprising a plurality first passages having a plurality of corresponding first exits, and a plurality of second passages having a plurality of corresponding second exits, wherein at least one first passage and at least one second passage are configured such that the stagnation pressure of gas exiting the first exit is greater than the stagnation pressure of gas exiting the second exit, wherein the plurality of first passages and the plurality of second passages are intermingled and arranged in a line such that the first exits and the second exits form a side of a shape in plan view. In an embodiment, the fluid handling structure is configured to confine immersion fluid to a region and comprising a gas knife in use, the fluid handling structure comprising at least one exit, wherein the at least one exit is arranged so that the gas knife forms a side of a shape in plan view, and the at least one exit has a geometry configured to allow movement of a droplet of immersion fluid from a position radially outward of the gas knife to a position radially inward of the gas knife and configured to restrict movement of a droplet of immersion fluid from a position radially inward of the gas knife to a position radially outward of the gas knife.
Abstract:
A lithographic apparatus comprising a projection system for projecting a patterned radiation beam onto a substrate and a fluid confinement structure configured to confine immersion fluid in a localized region between a final element of the projection system and a surface of the substrate. The lithographic apparatus is configured to have a space bounded on one side by a surface of at least one of the projection system and a component of the lithographic apparatus at least partially surrounding the final element of the projection system and on the other side by a surface of the fluid confinement structure. The apparatus is configured to maximize the humidity of the gas within the space.
Abstract:
A lithographic apparatus comprises a substrate table, post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is for handling the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a wafer handler.