公开(公告)号：WO2021047911A1

公开(公告)日：2021-03-18

申请号：PCT/EP2020/073867

申请日：2020-08-26

Applicant: ASML NETHERLANDS B.V.

Inventor： POLET, Theodorus, Wilhelmus ,  STEFFENS, Koen ,  VAN DER HAM, Ronald ,  PIETERSE, Gerben ,  EUMMELEN, Erik, Henricus, Egidius, Catharina ,  FAHRNI, Francis

IPC: G03F7/20

Abstract: A fluid handling system for wetting a region of a surface of a substrate irradiated by a radiation beam. The fluid handling system comprises a first device (112) configured to confine a first liquid to a first space (111) between at least a part of the first device and the surface of the substrate. The first device comprising an aperture (10) formed therein for the passage therethrough of the radiation beam (B) to irradiate the region by passing through the first liquid. The first device comprising at least one first liquid supply member (20, 23, 34) configured to provide the first liquid to the first space and at least one extraction member (32) configured to remove liquid from the first space. The fluid handling system further comprises a second device (200) comprising at least one second liquid supply member (201) configured to provide a second liquid to a second space (211) between at least a part of the second device and the surface of the substrate, wherein there is a gap (g) on the surface of the substrate between the second liquid and the first liquid. The fluid handling system is configured to provide the second liquid to the second space without removing any liquid from the second space to form a liquid layer over at least the region, and is configured to provide the first liquid and the second liquid on the surface of the substrate simultaneously.

公开(公告)号：WO2016177511A1

公开(公告)日：2016-11-10

申请号：PCT/EP2016/056758

申请日：2016-03-29

Applicant: ASML NETHERLANDS B.V.

Inventor： NAKIBOGLU, Günes ,  HOLTRUST, Maarten ,  VAN DUIJNHOVEN, Martinus ,  FAHRNI, Francis ,  VAN BOXTEL, Frank, Johannes, Jacobus ,  QUIST, Anne, Willemijn, Bertine ,  PAARHUIS, Bart, Dinand ,  VAN SOMMEREN, Daan, Daniel, Johannes, Antonius

IPC: G03F7/20 ,  F01N1/02

CPC classification number: G03F7/70891 ,  G03F7/709

Abstract: A lithographic apparatus has: - a conduit through which a gas can flow; - a gas mover configured to cause the gas to flow in the conduit; - a wall in contact with the gas in the conduit and defining a membrane aperture therein; and - an acoustic filter comprising a flexible membrane fixed in the membrane aperture. The acoustic filter reduces transmission of acoustic disturbances without adding any flow resistance.

Abstract translation: 光刻设备具有： - 气体可以通过该导管流动; - 构造成使气体在导管中流动的气体移动器; - 与管道中的气体接触并在其中限定膜孔的壁; 以及 - 包括固定在所述膜孔中的柔性膜的声学过滤器。 声学滤波器减少声学干扰的传播，而不增加任何流动阻力。

公开(公告)号：WO2015193036A1

公开(公告)日：2015-12-23

申请号：PCT/EP2015/060427

申请日：2015-05-12

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN BEUZEKOM, Aart, Adrianus ,  ALBERTI, Jozef, Augustinus, Maria ,  SEGERS, Hubert, Marie ,  VAN DER HAM, Ronald ,  FAHRNI, Francis ,  OLIESLAGERS, Ruud ,  PIETERSE, Gerben ,  ROPS, Cornelius, Maria ,  VAN DEN EIJNDEN, Pepijn ,  VAN DONGEN, Paul ,  WILLEMS, Bas

IPC: G03F7/20

CPC classification number: G03F7/7075 ,  G03F7/70341 ,  G03F7/70991

Abstract: A lithographic apparatus comprises a substrate table, post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is for handling the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a wafer handler.

Abstract translation: 光刻设备包括基板台，曝光后处理模块，基板处理机器人和干燥台。 衬底台被配置为支撑用于曝光过程的衬底。 后曝光处理模块用于处理基板曝光后。 衬底处理机器人被配置为沿着衬底卸载路径将衬底从衬底台转移到后曝光处理模块中。 干燥站构造成主动地从基板的表面移除液体。 干燥站位于基板卸载路径中。 干燥站位于曝光后处理模块中。 后曝光处理模块可以是晶片处理器。