Abstract:
The invention provides a substrate holder to hold a substrate in a substrate holding position, comprising: a frame, multiple surface clamping devices arranged on the frame to clamp a substrate at an upper surface thereof, wherein the surface clamping devices each have a clamping pad to be arranged on the upper surface of the substrate, the surface clamping pads being movable with respect to each other at least in a first direction substantially perpendicular to the upper surface of a substrate held by the surface clamping pads, and one or more actuators to move the surface clamping pads with respect to each other in the first direction.
Abstract:
A substrate support (1), includes: a substrate support location (4) configured to support a substrate (W), and a vacuum clamping device (7) configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source (8) to create a reduced pressure, at least one vacuum section (9) connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device (16) configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input (16a) to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.
Abstract:
Conditioning device for conditioning an object in a conditioning volume, comprising: at least one support pin adapted to support the object; a first plate and a second plate forming outer borders of the conditioning volume; an actuator unit adapted to move at least one of the first plate and the second plate between: an object receiving position in which the first plate and second plate are separated by a receiving distance of each other and the object can be arranged into the conditioning volume; and an object conditioning position in which the first plate and second plate are separated by a conditioning distance of each other which is smaller than the receiving distance, wherein a seal is formed between the first plate and the second plate in the object conditioning position, wherein the seal forms an outer border of the conditioning volume.
Abstract:
A lithographic apparatus comprising a substrate storage module having a controllable environment for protecting lithographically exposed substrates from ambient air. The substrate storage module is configured to store at least twenty substrates and the substrate storage module is an integral part of the lithographic apparatus. The substrate storage module may be used to protect substrates from ambient air during stitched lithographic exposures.
Abstract:
A gripper for an object handler comprises an engaging surface for engaging a surface of an object, and a first channel connected to a first outlet, said first outlet being configured to operate, during use, as a vacuum clamp arranged to secure the engaging surface to the surface of the object. The gripper further comprises a second channel arranged to be connected to a pressure source, and at least one second outlet arranged adjacent to the engaging surface and connected to the second channel.
Abstract:
Disclosed herein is a gripper configured to transport a substrate in a lithographic apparatus, the gripper comprising: a main body with one or more engagement portions for engaging with a surface of the substrate; wherein a part of the main body, that is overlapped by a region of a substrate when the one or more engagement portions are engaged with the substrate, comprises a plurality of openings that extend through the main body in a direction substantially perpendicular to the surface of the substrate.
Abstract:
A lithographic apparatus comprises a substrate table, post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is for handling the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a wafer handler.