Abstract:
Disclosed herein is a lithographic apparatus comprising: a movable stage comprising a support structure configured to support a patterning device; a projection system configured to project a patterned radiation beam onto a target portion of a substrate; and a plate positioned between the movable stage and the projection system; wherein the plate comprises: a first surface that faces the movable stage; a second surface that faces the projection system; an opening through the plate such that the patterned radiation beam passes through the opening, wherein the opening has at least a first side and a second side that extend from the first surface to the second surface; one or more gas outlets in the first side of the opening and one or more gas outlets in the first surface of the plate, wherein the gas outlets are configured such that gas is supplied, via the gas outlets, to a region between the movable stage and the projection system; one or more gas inlets in the second side of the opening, wherein the gas inlets are configured such that gas is extracted from the region between the movable stage and the projection system via the gas inlets; and all of the one or more gas outlets in the first surface of the plate are positioned and configured such that, for each of the one or more gas outlets, a line that is both orthogonal to the first surface and intersects the gas outlet does not intersect the patterning device at any point during the entire range of movement of the patterning device. Advantageously, the overlay errors are lower than that achieved with known techniques.
Abstract:
The invention relates to a setpoint generator for moving a patterning device of a lithographic apparatus, the patterning device being capable of imparting a radiation beam with a pattern in its cross-section to form a patterned radiation beam, wherein the setpoint generator comprises a finite number of movement profiles for the patterning device, and wherein the setpoint generator is configured to select one of the finite number of movement profiles based on a desired movement profile and to output the selected movement profile as a setpoint for the patterning device.
Abstract:
A fluid handling system for wetting a region of a surface of a substrate irradiated by a radiation beam. The fluid handling system comprises a first device (112) configured to confine a first liquid to a first space (111) between at least a part of the first device and the surface of the substrate. The first device comprising an aperture (10) formed therein for the passage therethrough of the radiation beam (B) to irradiate the region by passing through the first liquid. The first device comprising at least one first liquid supply member (20, 23, 34) configured to provide the first liquid to the first space and at least one extraction member (32) configured to remove liquid from the first space. The fluid handling system further comprises a second device (200) comprising at least one second liquid supply member (201) configured to provide a second liquid to a second space (211) between at least a part of the second device and the surface of the substrate, wherein there is a gap (g) on the surface of the substrate between the second liquid and the first liquid. The fluid handling system is configured to provide the second liquid to the second space without removing any liquid from the second space to form a liquid layer over at least the region, and is configured to provide the first liquid and the second liquid on the surface of the substrate simultaneously.
Abstract:
A route for a substrate support that supports a substrate in an immersion lithographic apparatus is calculated to satisfy the following constraints: after the edge of the substrate first contacts the immersion space, the substrate remains in contact with the immersion space until all target portions are exposed; exposures of target portions are performed whilst the substrate moves in a scan direction; and all movements of the substrate between exposures are, in a plane parallel to its upper surface, either curved or only in one of the scan directions or transverse directions. In order to reduce exposure defects at the edges of the substrate it is avoided to expose the immersion liquid to the ouside of the substrate (W) to be exposed. The transfer routes (R51) are designed to overly the wafer surface.
Abstract:
An immersion lithographic apparatus comprising: a projection system for projecting a patterned radiation beam through an optically active part of a final lens element of the projection system towards a substrate supported by a substrate table, the final lens element having an exposed bottom surface; a liquid confinement structure configured to supply and confine immersion liquid to an immersion space between the final lens element of the projection system and a surface formed of at least one of the substrate and substrate table; and a passageway-former between the projection system and the liquid confinement structure, and a passageway between the passageway-former and the optically active part of the final lens element, the passageway being in liquid communication via an opening with the immersion space and extending radially outwardly with respect to an optical axis of the projection system at least to an edge of the exposed bottom surface of the final lens element and being constructed and configured such that in use it is filled with liquid from the immersion space by capillary action.
Abstract:
A lithographic apparatus comprising a projection system for projecting a patterned radiation beam onto a substrate and a fluid confinement structure configured to confine immersion fluid in a localized region between a final element of the projection system and a surface of the substrate. The lithographic apparatus is configured to have a space bounded on one side by a surface of at least one of the projection system and a component of the lithographic apparatus at least partially surrounding the final element of the projection system and on the other side by a surface of the fluid confinement structure. The apparatus is configured to maximize the humidity of the gas within the space.
Abstract:
A lithographic apparatus comprises a substrate table, post-exposure handling module, a substrate handling robot and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure handling module is for handling the substrate post-exposure. The substrate handling robot is configured to transfer the substrate from the substrate table along a substrate unloading path into the post-exposure handling module. The drying station is configured to actively remove liquid from a surface of the substrate. The drying station is located in the substrate unloading path. The drying station is located in the post-exposure handling module. The post-exposure handling module may be a wafer handler.
Abstract:
An object table (WT) to support an object (W), the object table having a support body (100), an object holder (30) to hold an object, an opening (5) adjacent an edge of the object holder, and a channel (16) in fluid communication with the opening via a passageway (14), wherein the channel is defined by a first material which is different to a second material defining the passageway.