METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE IN A LITHOGRAPHIC APPARATUS
    1.
    发明申请
    METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE IN A LITHOGRAPHIC APPARATUS 审中-公开
    用于处理光刻设备中的基板的方法和设备

    公开(公告)号:WO2017092936A1

    公开(公告)日:2017-06-08

    申请号:PCT/EP2016/075913

    申请日:2016-10-27

    CPC classification number: G03F9/7011

    Abstract: A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.

    Abstract translation: 光刻设备具有其上放置有基板的基板台和用于测量基板的对准的对准传感器。 在示例性处理方法中,对准传感器用于在第一步骤中执行一个或多个边缘测量。 在第二步中,在基板的凹槽上执行一个或多个边缘测量。 然后使用边缘测量值来对准光刻设备中的衬底。 在特定示例中,衬底相对于对准传感器布置,使得边缘表面的一部分位于透镜的焦距处。 当对准传感器检测到在透镜的焦距处由边缘表面散射的辐射时,检测到衬底边缘的存在。

    ALIGNMENT MARK RECOVERY METHOD AND LITHOGRAPHIC APPARATUS
    2.
    发明申请
    ALIGNMENT MARK RECOVERY METHOD AND LITHOGRAPHIC APPARATUS 审中-公开
    对准标记恢复方法和光刻设备

    公开(公告)号:WO2018028880A1

    公开(公告)日:2018-02-15

    申请号:PCT/EP2017/066267

    申请日:2017-06-30

    Abstract: The invention relates to a method for recovering alignment marks in a mark layer of a substrate, comprising the steps of: a) providing a substrate with a mark layer covered by a resist layer; b) forming alignment marks in the mark layer, wherein an alignment mark is formed by: exposing the resist layer to a patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; c) forming one or more recovery marks in the mark layer, wherein a recovery mark is formed by: - exposing the resist layer to at least a portion of the patterned radiation beam thereby forming an alignment pattern in a mark area of the resist; and - subsequently exposing the mark area of the resist, each time with a shifted patterned radiation beam until a substantial part of the mark area has been exposed.

    Abstract translation: 本发明涉及一种用于恢复衬底的标记层中的对准标记的方法,该方法包括以下步骤:a)提供具有被抗蚀剂层覆盖的标记层的衬底; b)在标记层中形成对准标记,其中对准标记通过以下步骤形成:将抗蚀剂层暴露于图案化的辐射束,由此在抗蚀剂的标记区域中形成对准图案; c)在所述标记层中形成一个或多个恢复标记,其中恢复标记通过以下步骤形成:将所述抗蚀剂层暴露于所述图案化的辐射束的至少一部分,由此在所述抗蚀剂的标记区域中形成对准图案; 和 - 随后曝光抗蚀剂的标记区域,每次用移动的图案化辐射束直到标记区域的实质部分已经曝光。

    SUBSTRATE EDGE DETECTION
    3.
    发明申请
    SUBSTRATE EDGE DETECTION 审中-公开
    基底边缘检测

    公开(公告)号:WO2017167637A1

    公开(公告)日:2017-10-05

    申请号:PCT/EP2017/056926

    申请日:2017-03-23

    Abstract: A method including directing, by an optical system, an illumination beam to a surface of a substrate, providing relative motion between the directed illumination beam and the substrate until the directed illumination beam is illuminated on a grating underneath an edge or a notch of the substrate, diffracting, by the grating, at least a portion of the illumination beam, and detecting, by the detector, the diffracted illumination.

    Abstract translation: 一种方法,包括通过光学系统将照明光束引导至基板的表面,在所述定向照明光束与所述基板之间提供相对运动,直到所述定向照明光束照射在下面的光栅上 基板的边缘或凹口,通过光栅衍射至少一部分照明光束,并且由检测器检测衍射照明。

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