PROCESS FOR APPLYING A TWO-DIMENSIONAL MATERIAL TO A TARGET SUBSTRATE POST-LAMINATION

    公开(公告)号:WO2022243895A1

    公开(公告)日:2022-11-24

    申请号:PCT/IB2022/054619

    申请日:2022-05-18

    Abstract: Processes for creating a two-dimensional-target structure are disclosed. An example process to create a two-dimensional-target structure may include the process of providing two-dimensional material grown on an initial substrate to create a two-dimensional-substrate structure; applying the two-dimensional-substrate structure to a target substrate via an adhesion promoter to create a lamination stack; applying a lamination process to the lamination stack; and then removing the initial substrate from the lamination stack, post-lamination, to create the two-dimensional-target structure. The two-dimensional-target structure may then be used in such rigid or flexible electronic devices and/or non-standard devices as the target substrate may be rigid or flexible and/or translucent in contrast to the initial substrate first used to grow the two-dimensional material.

    ON-CHIP SPECTROMETER WITH TUNABLE PHOTODETECTION LAYER

    公开(公告)号:WO2022232359A1

    公开(公告)日:2022-11-03

    申请号:PCT/US2022/026673

    申请日:2022-04-28

    Abstract: Apparatuses and methods are provided for reconstructing a spectrum of an incident source. An example apparatus includes a photodetection layer, a voltage source, and a voltage drain. In some embodiments, the example apparatus further includes one or more gate electrodes. The photodetection layer includes one or more photodetection materials and is configured to generate a photoresponse vector in response to an incident source and/or gate electrodes. The voltage source and voltage drain are electrically connected to the photodetection layer and are configured to measure the photoresponse vector generated by the photodetection layer. The spectrum of the unknown incidence light can be reconstructed by using the photoresponse vector and the pre-measured response matrix.

    PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS

    公开(公告)号:WO2022243894A1

    公开(公告)日:2022-11-24

    申请号:PCT/IB2022/054618

    申请日:2022-05-18

    Abstract: Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

Patent Agency Ranking