Abstract:
A projection exposure system comprises an illumination system (ILL) configured to receive primary radiation with operating wavelength λ generated by a primary radiation source (S) and to form the primary radiation to generate illumination radiation incident on a mask (M) providing a prescribed pattern (PAT) and a projection objective (PO) configured to project an image of the pattern arranged in an object surface (OS) of the projection objective onto a radiation-sensitive substrate (W) arranged in an image surface (IS) of the projection objective at an image-side numerical aperture NA. An angle-selective filter arrangement (FA) is arranged at or close to a field surface of the projection objective in a projection beam path optically downstream of the object surface. The angle- selective filter arrangement is effective to filter radiation incident on the filter arrangement according to an angle-selective filter function. The filter function comprises a pass band (PB) with relatively high transmittance of intensity of incident radiation for angles of incidence smaller than a cut-off angle of incidence AOI CUT , and a stop band (SB) with relatively low transmittance of intensity of incident radiation for angles of incidence greater than the cut-off angle of incidence AOI CUT . The condition AOI CUT = arcsin (NA * | β | ) holds, with β being a magnification of an image formation between the field surface at or adjacent to the filter plane and the image surface of the projection objective.
Abstract:
The invention relates to a reflective optical element of an optical system for EUV lithography as well as to a method of manufacturing a reflective optical element of an optical system for EUV lithography, said reflective optical element (20) comprising a multilayer system (23, 83) for reflecting an incident electromagnetic wave having an operating wavelength in the EUV range, the reflected wave having a phase φ, and a capping layer (25, 85) made from a capping layer material, wherein the method comprises the following steps: determining, for said capping layer material, a dependency according to which the phase of the reflected wave varies with the thickness of the capping layer, determining a linearity-region in said dependency in which the phase of the reflected wave varies substantially linearly with the thickness of the capping layer (25, 85), and creating a thickness profile in said capping layer (25, 85) such that both the maximum thickness and the minimum thickness in said thickness profile are in said linearity-region.
Abstract:
Verfahren zum Einstellen eines Beleuchtungssettings in einer Beleuchtungsoptik (4) mit mindestens einer steuerbaren Korrektureinrichtung (23, 27), welche eine Vielzahl von verstellbaren Korrektur-Elementen zur Beeinflussung der Transmission aufweist, wobei das Beleuchtungssetting zur Anpassung eines vorgegebenen Abbildungs-Parameters im Bereich eines Bildfelds (8) variiert wird.
Abstract:
A method of operating a projection exposure tool (10) for microlithography is provided. The projection exposure tool (10) has a projection objective (26) for imaging object structures on a mask (20) into an image plane (28) using electromagnetic radiation (13, 13a, 13b), during which imaging the electromagnetic radiation (13b) causes a change in optical properties of the projection objective (26). The method comprises the steps of: providing the layout of the object structures on the mask (20) to be imaged and classifying the object structures according to their type of structure, calculating the change in the optical properties of the projection objective (26) effected during the imaging process on the basis of the classification of the object structures, and using the projection exposure tool (10) for imaging the object structures into the image plane (28), wherein the imaging behavior of the projection exposure tool (10) is adjusted on the basis of the calculated change of the optical properties in order to at least partly compensate for the change of the optical properties of the projection objective (26) caused by the electromagnetic radiation (13, 13a, 13b) during the imaging process.