公开(公告)号：WO2021072987A1

公开(公告)日：2021-04-22

申请号：PCT/CN2020/000251

申请日：2020-10-16

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN, Po Leung Pun ,  CHEE, Wah Cheung ,  JASON, Rotanson

IPC: G02B6/42 ,  H05K1/02

Abstract: An integrated electro-optical circuit board comprises a first flexible substrate (10) having a top side and a bottom side, at least one first optical circuit (12) on the bottom side of the first flexible substrate (10)connected to the top surface through a filled via (20), at least one first metal trace (26) on the top side of the first flexible substrate (10), an optical adhesive layer (16) connecting the bottom side of the first flexible substrate (10) to a top side of a second flexible substrate (18), and at least one second metal trace (30) on a bottom side of the second flexible substrate (18) connected by a filled via (20) through the second flexible substrate(18), the optical adhesive layer (16), and the first flexible substrate (10) to the at least one first metal trace (26).

公开(公告)号：WO2021031507A1

公开(公告)日：2021-02-25

申请号：PCT/CN2020/000184

申请日：2020-08-19

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN, Po Leung Pun ,  CHEE, Wah Cheung

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  C23C18/50 ,  C25D3/38 ,  C25D5/02 ,  B23K26/382

Abstract: A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni-P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni-P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni-P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.