公开(公告)号：WO2023061442A1

公开(公告)日：2023-04-20

申请号：PCT/CN2022/125084

申请日：2022-10-13

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： PUN, Kelvin Po-Leung ,  CHEUNG, Chee-Wah ,  ROTANSON, Jason ,  CHAN, Yuen-Yung ,  HON, Wing-Lung ,  CHONG, Yam ,  WONG, Wai-Yin ,  LU, Shengbo ,  LIU, Chenmin

IPC: H01M10/058 ,  H05K1/02

Abstract: A flexible printed circuit board with a multi-layer all solid-state lithium ion battery printed thereon is described. A flexible printed circuit board comprises at least one electrically insulating liquid crystal polymer or polyimide layer and at least one electrically conductive metal layer. The multi-layer all solid-state lithium ion battery comprises at least one anode, at least one cathode, and at least one UV curable solid electrolyte therebetween. The battery is encapsulated between the flexible printed circuit board and a layer of laminated aluminum foil on top of the multi-layer all solid-state lithium ion battery and adhered directly to the flexible printed circuit board.

公开(公告)号：WO2021072987A1

公开(公告)日：2021-04-22

申请号：PCT/CN2020/000251

申请日：2020-10-16

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN, Po Leung Pun ,  CHEE, Wah Cheung ,  JASON, Rotanson

IPC: G02B6/42 ,  H05K1/02

Abstract: An integrated electro-optical circuit board comprises a first flexible substrate (10) having a top side and a bottom side, at least one first optical circuit (12) on the bottom side of the first flexible substrate (10)connected to the top surface through a filled via (20), at least one first metal trace (26) on the top side of the first flexible substrate (10), an optical adhesive layer (16) connecting the bottom side of the first flexible substrate (10) to a top side of a second flexible substrate (18), and at least one second metal trace (30) on a bottom side of the second flexible substrate (18) connected by a filled via (20) through the second flexible substrate(18), the optical adhesive layer (16), and the first flexible substrate (10) to the at least one first metal trace (26).

公开(公告)号：WO2018064873A1

公开(公告)日：2018-04-12

申请号：PCT/CN2017/000614

申请日：2017-10-09

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN PO, Leung Pun ,  CHEE, Wah Cheung

IPC: H01L23/488

Abstract: A method to produce a semiconductor package or system-on-flex package comprising bonding structures for connecting IC/chips to fine pitch circuitry using a solid state diffusion bonding is disclosed. A plurality of traces is formed on a substrate, each respective trace comprising five different conductive materials having different melting points and plastic deformation properties, which are optimized for both diffusion bonding of chips and soldering of passives components.

Abstract translation: 公开了一种制造包括用于使用固态扩散接合将IC /芯片连接到精细间距电路的接合结构的半导体封装或挠曲系统上封装的方法。 在衬底上形成多个迹线，每条迹线包括具有不同熔点和塑性变形性质的五种不同导电材料，这些材料针对芯片的扩散结合和无源组件的焊接进行了优化。

公开(公告)号：WO2022121061A1

公开(公告)日：2022-06-16

申请号：PCT/CN2021/000220

申请日：2021-11-18

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED [CN]/[CN]

Inventor： PUN, Kelvin Po Leung ,  ROTANSON, Jason ,  CHEUNG, Chee Wah

IPC: H01L23/498 ,  H05K1/03

Abstract: A method to produce a flexible substrate is described. A base film material of cyclo-olefin polymer (COP) is provided. A surface of the COP base film is irradiated with UV light to form a functional group on the COP surface. Thereafter, the surface is treated with an alkaline degreaser. Thereafter, a Ni-P seed layer is electrolessly plated on the surface. A photoresist pattern is formed on the Ni-P seed layer. Copper traces are plated within the photoresist pattern. The photoresist pattern is removed and the Ni-P seed layer not covered by the copper traces is etched away to complete the flexible substrate. Alternatively, a biocompatible flexible substrate is formed using a Ni-P seed layer with a biocompatible surface finishing instead of copper.

公开(公告)号：WO2021031507A1

公开(公告)日：2021-02-25

申请号：PCT/CN2020/000184

申请日：2020-08-19

Applicant: COMPASS TECHNOLOGY COMPANY LIMITED

Inventor： KELVIN, Po Leung Pun ,  CHEE, Wah Cheung

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  C23C18/50 ,  C25D3/38 ,  C25D5/02 ,  B23K26/382

Abstract: A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni-P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni-P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni-P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.