公开(公告)号：WO2013085731A2

公开(公告)日：2013-06-13

申请号：PCT/US2012066501

申请日：2012-11-26

Applicant: COOLEDGE LIGHTING INC ,  TISCHLER MICHAEL ALBERT ,  SHEEN CALVIN WADE

Inventor： TISCHLER MICHAEL ALBERT ,  SHEEN CALVIN WADE

CPC classification number: H01L33/504 ,  H01L21/67132 ,  H01L33/005 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L2933/0041 ,  H05K13/046 ,  Y10T29/53174

Abstract: In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.

Abstract translation: 根据某些实施例，通过将磷光体粘附到衬底上的激活区域并将其转移到不同的衬底上来形成磷光体布置。

公开(公告)号：WO2013066920A3

公开(公告)日：2014-03-06

申请号：PCT/US2012062663

申请日：2012-10-31

Applicant: COOLEDGE LIGHTING INC ,  SCHICK PHILLIPPE M ,  TISCHLER MICHAEL ALBERT

Inventor： SCHICK PHILLIPPE M ,  TISCHLER MICHAEL ALBERT

IPC: H01L25/075 ,  F21K99/00 ,  F21V5/00 ,  F21V5/04 ,  F21Y105/00

CPC classification number: F21V11/00 ,  F21K9/90 ,  F21V5/007 ,  F21V17/00 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49227 ,  H01L2924/00

Abstract: In accordance with certain embodiments, thermal stresses are mitigated in illumination systems by mating optical substrates with a plurality of discrete substrates each having one or more light-emitting elements thereon.

Abstract translation: 根据某些实施例，在照明系统中通过将光学基板与多个在其上具有一个或多个发光元件的分立基板相配合来减轻热应力。

公开(公告)号：WO2013112691A3

公开(公告)日：2013-11-07

申请号：PCT/US2013022899

申请日：2013-01-24

Applicant: COOLEDGE LIGHTING INC ,  TISCHLER MICHAEL ALBERT

Inventor： TISCHLER MICHAEL ALBERT

IPC: H01L25/075

CPC classification number: H01L33/501 ,  H01L21/00 ,  H01L24/96 ,  H01L24/97 ,  H01L25/00 ,  H01L25/0753 ,  H01L27/14 ,  H01L27/15 ,  H01L27/156 ,  H01L29/00 ,  H01L31/0203 ,  H01L31/022425 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/048 ,  H01L31/055 ,  H01L33/00 ,  H01L33/005 ,  H01L33/10 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/01005 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H05B33/02 ,  H05B33/12 ,  Y02E10/52 ,  H01L2924/00

Abstract: In accordance with certain embodiments, light emitting diodes, i.e. semiconductor dies (210) are embedded within polymeric binder (420; 230) which contains in a specific embodment phosphor, to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies (210) embedded in a single volume of binder (420; 230). In the methods of certain embodiments the contacts of the semicondctor dies (210) remain at least partially uncoated by the binder, or are reexposed to ambient after applying the binder (420; 230) before the dies are separated.

Abstract translation: 根据某些实施例，发光二极管即半导体管芯（210）嵌入聚合物粘合剂（420; 230）中，聚合物粘合剂包含特定的荧光体，以形成例如独立的白色发光管芯和/或复合晶片 其包含嵌入单个体积的粘合剂（420; 230）中的多个发光模具（210）。 在某些实施例的方法中，半金属模具（210）的触点在粘合剂（420; 230）在模具分离之前施加粘合剂（420; 230）后至少部分地未被粘合剂涂覆，或者再次暴露于环境中。

公开(公告)号：WO2009076509A2

公开(公告)日：2009-06-18

申请号：PCT/US2008086383

申请日：2008-12-11

Applicant: HVVI SEMICONDUCTORS INC ,  GOGOI BISHNU PRASANNA ,  TISCHLER MICHAEL ALBERT

Inventor： GOGOI BISHNU PRASANNA ,  TISCHLER MICHAEL ALBERT

IPC: H01L27/04 ,  H01L21/31

CPC classification number: H01L21/76237 ,  H01L21/76232

Abstract: In various embodiments, semiconductor structures and methods to manufacture these structures are disclosed. In one embodiment, a structure includes a dielectric material and a void below a surface of a substrate. The structure further includes a doped dielectric material over the dielectric material, over the first void, wherein at least a portion of the dielectric material is between at least a portion of the substrate and at least a portion of the doped dielectric material. Other embodiments are described and claimed.

Abstract translation: 在各种实施例中，公开了制造这些结构的半导体结构和方法。 在一个实施例中，结构包括电介质材料和位于衬底表面下方的空隙。 该结构进一步包括在第一空隙上的介电材料上的掺杂介电材料，其中介电材料的至少一部分介于至少一部分衬底和至少一部分掺杂介电材料之间。 描述并要求保护其他实施例。