公开(公告)号：WO2016161150A1

公开(公告)日：2016-10-06

申请号：PCT/US2016/025330

申请日：2016-03-31

Applicant: CORIANT ADVANCED TECHNOLOGY, LLC

Inventor： KINGHORN, David, Henry ,  NOVACK, Ari, Jason ,  KLEIN, Holger, N. ,  NUTTALL, Nathan, A. ,  DESAI, Kishor, V. ,  BLUMENTHAL, Daniel, J. ,  HOCHBERG, Michael, J. ,  SHI, Ruizhi

IPC: G02B6/13 ,  G02B6/24 ,  G02B6/42

CPC classification number: G02B6/423 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4238 ,  G02B6/4251 ,  G02B6/4268 ,  G02B6/4274 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/121 ,  H01L25/16 ,  H01L25/162 ,  H01L25/167 ,  H01L25/50 ,  H01L31/125 ,  H01L31/18 ,  Y02P70/521

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract translation: 两个半导体芯片被光学对准以形成混合半导体器件。 两个芯片具有光波导和对准表面，其定位在与相应波导的光轴精确定义的互补垂直偏移上，使得当其中一个芯片被放置在另一个芯片上并且它们的对准表面彼此邻接时，波导器垂直对准。 其芯片的层叠中的至少一个对准表面的位置通过外延精确地限定。 芯片在偏移接合焊盘处接合，其中对准表面在其间没有接合材料的情况下抵接。