Abstract:
A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves. An optoelectronic transceiver comprises the system and a fiber optic cable including a cable lens component, a plurality of optical fibers at least partially positioned in the cable lens component, and a lens clip configured to be removably located on the transceiver lens component.
Abstract:
Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
Abstract:
A method and apparatus for mounting optical components is described. The apparatus (1) is suitable for mounting multiple optical components (2) and comprises a baseplate (3) having opposing first (4) and second (5) surfaces. Recesses or apertures (7) are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars (13) are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate (3). The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.
Abstract:
A method for accurately mounting an optical element in an optical assembly including precisely positioning the optical element in a desired position with respect to a reference surface, employing a non-metallic adhesive for initially fixing the optical element in the desired position and thereafter employing a metallic adhesive for permanently fixing the optical element in the desired position.
Abstract:
An optical alignment system (122) is provided for aligning an optical module (12) of the type which is suitable for use in an optical device. The system (122) includes a reference base (142) having a registration feature aligns with a registration feature of the optical module (12).
Abstract:
A micro-optical component comprises an optical element (52) for interacting with an optical beam and a mounting structure (50) for attaching the optical element (52) to an optical bench (10). This optical element (52) is solid phase welded to the mounting structure (50). Solid phase welding has advantages in that it can be performed at lower temperatures than most soldering, even some eutectic soldering. Solid-phase welding, however, is much more robust during subsequent temperature cycling. This is especially important when the optical components undergo subsequent high temperature cycling.
Abstract:
A system and procedure for aligning an information carrying laser beam to an optical fiber (102). The laser diode (106) is first axially aligned to the end of the fiber within specific angular and spatial tolerances. Practical spatial tolerances in an example are onemicro meter in a typical Cartesian x, y, and z coordinates system. The angular tolerance is about one micro radian. The system components include a collimating lens (116) that collimates the laser beam, a strong lens that focuses the collimated laser beam onto the fiber end, and a weak lens placed between the collimated lens and the strong lens (108) that performs the final positioning of the focused beam onto the fiber end. This weak lens provides an optical leverage that allows more than an order of magnitude less tolerance in positioning the weak lens compared to the final position of the laser beam onto the fiber end. The collimation and the position of the elements are determined using known instrumentation, known methods and known mechanical assemblies. The assemblies are finally welded in place and mechanically stabilized by baking.
Abstract:
An alignment structure (100) maintains an optical fiber in a bore(113). The structure is fixed on a bench and is passively or ac tively aligned with a light source. Then the structure may be welded or soldered to the optical bench whereby the alignment may suffer due to heat transfer. To correct this, the alignment structure can be plastically deformed to correct the alignment after thecomponents have been fixed. The alignment structure has a substantially constant cross section in a z-axis direction as well as flexible links in order to allow displacements orthogonal to the optical axis. This mouvements will be initiated by seizing the component with a micro-positioner at a handle (136) and displacing it over the elastic limit to achieve permanent deformation.