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    OPTICAL FIBER COATING AND COMPOSITION WITH UV-ABSORBING ADDITIVE
    1.
    发明申请
    OPTICAL FIBER COATING AND COMPOSITION WITH UV-ABSORBING ADDITIVE 审中-公开
    具有紫外线吸收添加剂的光学纤维涂层和组合物

    公开(公告)号：WO2017100122A1

    公开(公告)日：2017-06-15

    申请号：PCT/US2016/064925

    申请日：2016-12-05

    Applicant: CORNING INCORPORATED

    Inventor： DEROSA, Michael Edward ,  FABIAN, Michelle Dawn ,  LOGUNOV, Stephan Lvovich ,  MATTHEWS, James Robert ,  OCAMPO, Manuela

    IPC: C03C25/28 ,  C03C25/62 ,  C09D4/00 ,  C03C25/10

    CPC classification number: C09D4/00 ,  C03B37/025 ,  C03C25/106 ,  C03C2217/74 ,  G02B6/02395 ,  C08F220/18

    Abstract: A coating composition containing a radiation-curable component, a photoinitiator, and a UV absorber is described. The coating composition may be applied to an optical fiber and cured to form a coating. The UV absorber provides a protective function by inhibiting unintended curing of the coating that may occur upon exposure of the fiber to UV light during fiber processing. The spectral overlap of the photoinitiator and UV absorber is minimized to permit efficient photoinitiation of the curing reaction over one or more wavelengths. Photoinitiation may be excited by an LED source with a peak emission wavelength in the range from 360 nm - 410 nm.

    Abstract translation: 描述了含有可辐射固化组分，光引发剂和UV吸收剂的涂料组合物。 涂料组合物可以施加到光纤上并固化以形成涂层。 UV吸收剂通过抑制在纤维处理期间纤维暴露于UV光时可能发生的涂层的意外固化而提供保护功能。 光引发剂和UV吸收剂的光谱重叠被最小化以允许固化反应在一个或多个波长上的有效光引发。 光引发可以由峰值发射波长在360nm-410nm范围内的LED源激发。

    TREATMENT OF GLASS SURFACES FOR IMPROVED ADHESION
    2.
    发明申请
    TREATMENT OF GLASS SURFACES FOR IMPROVED ADHESION 审中-公开
    用于改善粘合剂的玻璃表面处理

    公开(公告)号：WO2015153706A1

    公开(公告)日：2015-10-08

    申请号：PCT/US2015/023774

    申请日：2015-04-01

    Applicant: CORNING INCORPORATED

    Inventor： DEROSA, Rebecca Lee ,  FENG, Jiangwei ,  HAMILTON, James Patrick ,  MATTHEWS, James Robert ,  MIZUSHIMA, Yasuyuki ,  NAKANISHI, Hisanori ,  WALCZAK, Wanda Janina

    IPC: G09F9/00 ,  C03C17/28

    CPC classification number: C03C17/3405 ,  C03C27/00 ,  C03C2218/116 ,  C03C2218/151 ,  G02F1/133512 ,  G02F1/133514 ,  G02F1/133516 ,  G02F2001/133302

    Abstract: A patterned article and a method of making the patterned article. The patterned article comprises a glass substrate and black matrix segments. The black matrix segments are in the form of a pattern and at least one of the segments has a line width of 8 µm or less. The article also comprises an adhesion agent positioned between the glass substrate and the black matrix segments. The adhesion agent provides at least one of: a total surface energy of 65 mN/m or less and at least a 30% reduction in surface polarity compared to a control untreated glass surface as determined by H 2 O and diiodomethane contact angle and application of the Wu model.

    Abstract translation: 图案化制品和制造图案制品的方法。 图案制品包括玻璃基底和黑矩阵片段。 黑色矩阵段是图案的形式，并且至少一个片段具有8μm或更小的线宽。 该制品还包括位于玻璃基板和黑矩阵段之间的粘合剂。 粘合剂提供以下中的至少一种：与通过H 2 O和二碘甲烷接触角确定的对照未处理的玻璃表面相比，总表面能为65mN / m以下，表面极性降低至少30％，应用吴 模型。

    REMOVABLE GLASS SURFACE TREATMENTS AND METHODS FOR REDUCING PARTICLE ADHESION
    4.
    发明申请
    REMOVABLE GLASS SURFACE TREATMENTS AND METHODS FOR REDUCING PARTICLE ADHESION 审中-公开
    可除去的玻璃表面处理和减少颗粒粘附的方法

    公开(公告)号：WO2017058969A1

    公开(公告)日：2017-04-06

    申请号：PCT/US2016/054264

    申请日：2016-09-29

    Applicant: CORNING INCORPORATED

    Inventor： HAMILTON, James Patrick ,  KIM, Jenny ,  MATTHEWS, James Robert ,  NAKAMURA, Kouta ,  STEMPIN, Louis, Joseph, Jr. ,  WALCZAK, Wanda Janina

    IPC: C03C17/00 ,  C03C17/28 ,  C03C17/30 ,  C03C17/32 ,  C03C17/38

    CPC classification number: C03C17/30 ,  C03C17/32 ,  C03C2217/75 ,  C03C2217/76 ,  C03C2218/32

    Abstract: Disclosed herein are methods for treating a glass substrate, comprising bringing a surface of the glass substrate into contact with at least one surface treatment agent for a time sufficient to form a coating comprising the at least one surface treatment agent on at least a portion of the surface. Also disclosed herein are glass substrates comprising at least one surface and a coating on at least a portion of the surface, wherein the coated portion of the surface has a contact angle ranging from about 20 degrees to about 95 degrees, and/or a contact angle greater than about 20 degrees after contact with water, and/or a contact angle less than about 10 degrees after wet or dry cleaning of the glass substrate.

    Abstract translation: 本文公开了用于处理玻璃基板的方法，包括使玻璃基板的表面与至少一种表面处理剂接触足够长的时间以在至少一部分表面处理剂上形成包含至少一种表面处理剂的涂层 表面。 本文还公开了包括至少一个表面和在表面的至少一部分上的涂层的玻璃基板，其中表面的涂覆部分具有约20度至约95度的接触角，和/或接触角 在与水接触后大于约20度，和/或在湿或干洗玻璃基底之后的接触角小于约10度。

    OPTICAL FIBER COATING COMPOSITIONS WITH HYDROGEN BONDING, NON-COVALENT BONDING, CROSS-LINKERS
    5.
    发明申请
    OPTICAL FIBER COATING COMPOSITIONS WITH HYDROGEN BONDING, NON-COVALENT BONDING, CROSS-LINKERS 审中-公开

    公开(公告)号：WO2020013985A1

    公开(公告)日：2020-01-16

    申请号：PCT/US2019/038973

    申请日：2019-06-25

    Applicant: CORNING INCORPORATED

    Inventor： MATTHEWS, James Robert

    IPC: C09D133/06 ,  C09D133/14

    Abstract: An optical fiber coating composition comprising: one or more monomers forming a first polymer chain and a second polymer chain upon polymerization; and one or more hydrogen bonding cross-linkers including a first molecule that covalently bonds to the first polymer chain during the polymerization and a second molecule that covalently bonds to the second polymer chain during the polymerization. The first molecule includes a first functional group. The second molecule includes a second functional group. The first functional group and the second functional group hydrogen bond to form three or more hydrogen bonds during the polymerization. The first functional group and the second functional group both can be a ureidopyrimidinone functional group. The first molecule and the second molecule can both be a ureidopyrimidinone (meth)acrylate. The one or more monomers can be mono-acrylate monomers, and the optical fiber coating composition can lack any multi-acrylate monomers.

    ELECTRONIC ASSEMBLIES INCORPORATING LAMINATE SUBSTRATES AND METHODS OF FABRICATING THE SAME
    6.
    发明申请
    ELECTRONIC ASSEMBLIES INCORPORATING LAMINATE SUBSTRATES AND METHODS OF FABRICATING THE SAME 审中-公开

    公开(公告)号：WO2018152169A1

    公开(公告)日：2018-08-23

    申请号：PCT/US2018/018129

    申请日：2018-02-14

    Applicant: CORNING INCORPORATED

    Inventor： CALABRESE, Gary Stephen ,  GARNER, Sean Matthew ,  HE, Mingqian ,  MATTHEWS, James Robert

    IPC: H01L51/00 ,  H01L51/05

    Abstract: Electronics assemblies including laminate substrates and methods of manufacture are disclosed. In one embodiment, an electronics assembly (140A) includes a glass-based substrate (110) having a thickness of less than or equal to 300 µm, a first surface (111) and a second surface, at least one gate electrode (155) disposed on the first surface (111) of the glass-based substrate (110), and a polymer layer (154) disposed on the first surface (111) of the glass-based substrate (110). The polymer layer (154) contacts at least a portion of the at least one gate electrode (155). The electronics assembly (140A) further includes at least one source electrode (152), at least one drain electrode (153), and a semiconductor material (151) disposed on the polymer layer (154). The semiconductor material (151) contacts at least a portion of the at least one source electrode (152) and the at least one drain electrode (153). The polymer layer (154) is configured to act as a dielectric material between the at least one gate electrode (155) and the semiconductor material (151).

    DOPING OF OTHER POLYMERS INTO ORGANIC SEMI-CONDUCTING POLYMERS
    7.
    发明申请
    DOPING OF OTHER POLYMERS INTO ORGANIC SEMI-CONDUCTING POLYMERS 审中-公开

    公开(公告)号：WO2018226536A1

    公开(公告)日：2018-12-13

    申请号：PCT/US2018/035700

    申请日：2018-06-01

    Applicant: CORNING INCORPORATED

    Inventor： HE, Mingqian ,  LI, Yang ,  MATTHEWS, James Robert ,  MEHROTRA, Karan ,  NIU, Weijun ,  WALLACE, Arthur Lawrence

    IPC: C08G61/12 ,  C08L65/00 ,  H01B1/20 ,  H01L51/00

    Abstract: Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.

    SEMICONDUCTING FUSED THIOPHENE POLYMER INK FORMULATION
    9.
    发明申请
    SEMICONDUCTING FUSED THIOPHENE POLYMER INK FORMULATION 审中-公开
    半导体聚合物聚合物油墨制剂

    公开(公告)号：WO2014035716A1

    公开(公告)日：2014-03-06

    申请号：PCT/US2013/055674

    申请日：2013-08-20

    Applicant: CORNING INCORPORATED ,  HE, Mingqian ,  MATTHEWS, James Robert

    Inventor： HE, Mingqian ,  MATTHEWS, James Robert

    IPC: B01J13/00 ,  C08G61/12 ,  C09D165/00 ,  H01B1/12 ,  H01L51/00

    CPC classification number: H01B1/127 ,  C08G61/126 ,  C08G2261/124 ,  C08G2261/1412 ,  C08G2261/3223 ,  C08G2261/3243 ,  C08G2261/344 ,  C08G2261/364 ,  C08G2261/92 ,  C09D11/52 ,  C09D165/00 ,  H01B13/0026 ,  H01L51/0007 ,  H01L51/0036 ,  H01L51/0558

    Abstract: A formulation including: an organic semiconducting polymer selected from the diketopyrrolopyrrole (DPP) and fused thiophene copolymer structures of the formulas (I), (II), or combinations thereof, or salts thereof, in an amount of from 0.1 to 5 wt% based on the total weight of the formulation: forumulas (I) and (II), respectively, where m is an integer from 1 to 2, n is an integer from 4 to 80, X and Y are independently selected from a divalent heteroaryl, such as a thiophene, R 1 , R 2 , R 3 , and R 4 is each a hydrocarbylene substituent as defined herein, a first solvent is selected from a cyclic aliphatic in an amount of from 2 to 98 wt%; and a second solvent selected from an aromatic in an amount of from 98 to 2 wt%. Also disclosed are method of making and using the disclosed formulations, for example, for use in electronic devices.

    Abstract translation: 一种制剂，其包含：选自二酮吡咯并吡咯（DPP）和式（I），（II）的稠合噻吩共聚物结构或其组合或其盐的有机半导体聚合物，其量为0.1-5wt％ 分别为：式（I）和（II）的式（I）和（II），其中m为1〜2的整数，n为4〜80的整数，X和Y独立地选自二价杂芳基， 作为噻吩，R 1，R 2，R 3和R 4各自为如本文所定义的亚烃基取代基，第一溶剂选自2-98重量％的环状脂族; 和选自98至2重量％的芳族化合物的第二溶剂。 还公开了制备和使用所公开的制剂的方法，例如用于电子装置。

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