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    LOW CRYSTALLINITY GLASS-CERAMICS
    5.
    发明申请
    LOW CRYSTALLINITY GLASS-CERAMICS 审中-公开
    低结晶玻璃 - 陶瓷

    公开(公告)号：WO2015126900A1

    公开(公告)日：2015-08-27

    申请号：PCT/US2015/016310

    申请日：2015-02-18

    Applicant: CORNING INCORPORATED

    Inventor： BAKER, David Eugene ,  DEJNEKA, Matthew John ,  DUTTA, Indrajit ,  MORENA, Robert Michael ,  SMITH, Charlene Marie

    IPC: C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/097 ,  C03C10/00 ,  C03C21/00 ,  C03C4/02

    CPC classification number: C03C10/0054 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C4/02 ,  C03C10/0018 ,  C03C10/0081 ,  C03C21/002 ,  C03C2204/00 ,  C03C2204/04 ,  Y10T428/315

    Abstract: Embodiments of the present disclosure pertain to crystallizable glasses and glass- ceramics that exhibit a black color and are opaque. In one or more embodiments, the crystallizable glasses and glass-ceramics include a precursor glass composition that exhibits a liquidus viscosity of greater than about 20 kPa*s. The glass-ceramics exhibit less than about 20 wt% of one or more crystalline phases, which can include a plurality of crystallites in the Fe 2 0 3 -Ti0 2 -MgO system and an area fraction of less than about 15%. Exemplary compositions used in the crystallizable glasses and glass-ceramics include, in mol%, SiO 2 in the range from about 50 to about 76, AI 2 O 3 in the range from about 4 to about 25, P 2 O 5 + B 2 O 3 in the range from about 0 to about 14, R 2 O in the range from about 2 to about 20, one or more nucleating agents in the range from about 0 to about 5, and RO in the range from about 0 to about 20.

    Abstract translation: 本公开的实施方案涉及显示黑色并且是不透明的可结晶玻璃和玻璃 - 陶瓷。 在一个或多个实施方案中，可结晶玻璃和玻璃陶瓷包括表现出大于约20kPa·s的液相线粘度的前体玻璃组合物。 玻璃陶瓷表现出小于约20重量％的一个或多个结晶相，其可以包括在Fe 2 O 3 -TiO 2 -MgO体系中的多个微晶和小于约15％的面积分数。 在可结晶玻璃和玻璃陶瓷中使用的示例性组合物包括摩尔％，约50至约76的SiO 2，约4至约25的Al 2 O 3，约0至约25的范围内的P 2 O 5 + B 2 O 3 14，R 2 O在约2至约20的范围内，一种或多种成核剂在约0至约5范围内，RO在约0至约20的范围内。

    LED LIGHTING DEVICES
    6.
    发明申请
    LED LIGHTING DEVICES 审中-公开
    LED照明设备

    公开(公告)号：WO2014159894A1

    公开(公告)日：2014-10-02

    申请号：PCT/US2014/025418

    申请日：2014-03-13

    Applicant: CORNING INCORPORATED ,  BORRELLI, Nicholas Francis ,  LAMBERSON, Lisa Ann ,  MORENA, Robert Michael ,  ORSLEY, Timothy James ,  TRUNTA, William Richard

    Inventor： BORRELLI, Nicholas Francis ,  LAMBERSON, Lisa Ann ,  MORENA, Robert Michael ,  ORSLEY, Timothy James ,  TRUNTA, William Richard

    IPC: H01L25/075 ,  H01L33/64 ,  H01L33/50

    CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.

    Abstract translation: 提供了封装的芯片上（COB）LED阵列，其中颜色转换介质分布在玻璃容纳板而不是硅胶中，以降低颜色转换介质的工作温度，并在增加光输出的同时避免损坏。 提供了一种照明装置，其包括芯片上的（COB）发光二极管（LED）光源，光源密封剂，分布式颜色转换介质和玻璃容纳板。 COB LED光源包括热散热器框架和至少一个LED并且限定光源密封剂腔，光源密封剂分布在LED上。 玻璃容纳板位于光源密封腔上方，并包含分布式颜色转换介质。 光源密封剂以足以封装LED并且限定密封剂热传导路径的厚度分布在LED上。

    ANTIMONY-FREE GLASS, ANTIMONY-FREE FRIT AND A GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH THE FRIT
    8.
    发明申请
    ANTIMONY-FREE GLASS, ANTIMONY-FREE FRIT AND A GLASS PACKAGE THAT IS HERMETICALLY SEALED WITH THE FRIT 审中-公开

    公开(公告)号：WO2014035954A3

    公开(公告)日：2014-03-06

    申请号：PCT/US2013/056780

    申请日：2013-08-27

    Applicant: CORNING INCORPORATED ,  DRAKE, Melinda Ann ,  MORENA, Robert Michael

    Inventor： DRAKE, Melinda Ann ,  MORENA, Robert Michael

    IPC: C03C3/21 ,  C03C8/24 ,  H01L51/52

    Abstract: An antimony-free glass comprising TeO 2 and/or Bi 2 O 3 suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs disposed therein. The antimony-free glass has excellent aqueous durability, good flow, and low glass transition temperature.

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